JPS6286902A - Structure of ultra high frequency filter - Google Patents
Structure of ultra high frequency filterInfo
- Publication number
- JPS6286902A JPS6286902A JP60226939A JP22693985A JPS6286902A JP S6286902 A JPS6286902 A JP S6286902A JP 60226939 A JP60226939 A JP 60226939A JP 22693985 A JP22693985 A JP 22693985A JP S6286902 A JPS6286902 A JP S6286902A
- Authority
- JP
- Japan
- Prior art keywords
- dielectric substrate
- metal plate
- hole
- strip line
- high frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
- Waveguides (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はストリップラインによって形成される超高周波
フィルタの構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of an ultra-high frequency filter formed by strip lines.
し・−グに使用される幅広い周波数帯域のマイクロ波の
受信（ま、このマイクロ波をシフ５波周波数の異なる複
数の超高周波フィルタによって諺彼し、ろ波して得られ
た各周波数のマイクロ波を局部発信器によって中間局ｅ
数に変換するのが一般に行われる方法である。この際、
複数の超高周波フィルタは同一スＩ・ＩＪ ＝ｔプライ
ン平面又りよ同軸ケーブル等によって互いに接続配線さ
れる。Reception of microwaves in a wide frequency band used for switching (well, this microwave is filtered by multiple ultra-high frequency filters with different frequencies, The waves are sent to an intermediate station e by a local oscillator.
A common method is to convert it into a number. On this occasion,
A plurality of ultra-high frequency filters are connected to each other by coaxial cables or the like across the same plane of the I·IJ=t plane.
係る超高周波フィルタはストリップラインによって誘電
体基板上に形成されろ。この場合、超高周波フィルタを
構成する容量素子ばス）・リスブラインのパターン幅を
広くすることによって得られ、インダクタンス素子はス
トリップラインのパターン幅を狭くすることによって得
られる。又、直列容量素子は誘電体基板を挾んでストリ
ップラインを重ね合わせろことによって形成されること
ば周知の通りである。。Such an ultra-high frequency filter is formed on a dielectric substrate using strip lines. In this case, the capacitive elements constituting the ultra-high frequency filter can be obtained by widening the pattern width of the strip lines, and the inductance elements can be obtained by narrowing the pattern width of the strip lines. Furthermore, as is well known, a series capacitive element is formed by overlapping strip lines with dielectric substrates sandwiched therebetween. .
ところで、ス）・リップラインによって超高周波フィル
タを形成する乙とによって、マイクロ波受信器の小型化
を図ることができるが、上述したように複数の超高周波
フィルタを接続配線使用することによって、マイクロ波
受信器の小型化が難しくなる場合が生じるという問題が
あった。By the way, it is possible to downsize the microwave receiver by forming an ultra-high frequency filter using lip lines. There has been a problem in that it may be difficult to miniaturize the wave receiver.
本発明は上記問題点を解決するためになされたもので、
マイクロ波受信器の小型化を容易にする超高周波フィル
タの構造を提供することを目的とする。The present invention has been made to solve the above problems,
An object of the present invention is to provide a structure of an ultra-high frequency filter that facilitates miniaturization of a microwave receiver.
そこで本発明では、下層金属板と、下層金属板の上方に
下層金属板と所定の間隔を隔てて配置され、下面に下層
ストリップラインによる超高周波フィルタが形成されて
いるとともに、下層ストリップラインの始端部分を臨む
位置に所定の大きさの穴が穿設された下層誘電体基板と
、下層誘電体基板の上方に下層誘電体基板と所定の間隔
を隔てて配置され、下層誘電体基板の穴穿設位置に対応
する位置に下層誘電体基板の穴よりも大きい穴が穿設さ
れた中層金属板と、中層金属板の上方に中層金属板と所
定の間隔を隔てて配置され、上面に上層ストリップライ
ンによる超高周波フィルタが形成されているとともに、
上層ストリップラインの終端部分を臨む位置であって、
下層誘電体基板の穴穿設位置に対応する位置に下層誘電
体基板の穴とほぼ等しい大きさの穴が設けられた上層誘
電体基板と、上層誘電体基板の上方に上層誘電体基板と
所定の間隔を隔てて配置された上層金属板と、上層誘電
体基板の穴、中層金属板の穴及び下層誘電体基板の穴を
介して上層スＩ−ＩＪ ２）プラインと下層ストリップ
ラインとを接続ずろ中心導体及び中心導体のうち上層誘
電体基板の下面から下Ｂ誘電体基板の上面までを中層金
属板の穴を介して被覆し、ており、上層誘電体基板の下
面から中層金属板の上面までの部分が中層金属板の穴に
嵌挿し１辱ない形状で、中層金属板の上面から下層誘電
体基板の上面までの部分が中層金属板の穴に嵌挿し得る
形状の誘電体とから超高周波フィルタの構造を構成する
。Therefore, in the present invention, a lower layer metal plate is arranged above the lower layer metal plate at a predetermined distance from the lower layer metal plate, an ultra-high frequency filter is formed by a lower layer strip line on the lower surface, and a starting point of the lower layer strip line is formed. A lower dielectric substrate is provided with a hole of a predetermined size formed at a position facing the lower dielectric substrate. A middle layer metal plate is provided with a hole larger than the hole in the lower dielectric substrate at a position corresponding to the installation position, and an upper layer strip is placed above the middle layer metal plate at a predetermined distance from the middle layer metal plate. An ultra-high frequency filter is formed by the line, and
A position facing the terminal part of the upper layer strip line,
An upper dielectric substrate is provided with a hole approximately the same size as the hole in the lower dielectric substrate at a position corresponding to the hole drilling position in the lower dielectric substrate, and an upper dielectric substrate is provided above the upper dielectric substrate. 2) Connect the upper layer strip line and the lower layer strip line through the upper layer metal plate arranged at intervals of , the hole in the upper layer dielectric substrate, the hole in the middle layer metal plate, and the hole in the lower layer dielectric substrate The center conductor and the center conductor are covered from the lower surface of the upper dielectric substrate to the upper surface of the lower B dielectric substrate through the hole in the intermediate layer metal plate, and from the lower surface of the upper dielectric substrate to the upper surface of the intermediate layer metal plate. The part from the top surface of the middle layer metal plate to the top surface of the lower dielectric substrate has a shape that can be inserted into the hole in the middle layer metal plate. Configure the structure of the high frequency filter.
上記構成の超高周波フィルタの構造は、下層金属板、下
層誘電体基板、中層金属板、上層誘電体基板及び上層金
属板を所定の間隔を隔てて積重して配置し、中心導体を
誘電体で被覆した構造の接続部材によって上層ス）−リ
ップラインと下層ストリップラインとを接続する。The structure of the ultra-high frequency filter having the above configuration is that a lower metal plate, a lower dielectric substrate, a middle metal plate, an upper dielectric substrate, and an upper metal plate are stacked at predetermined intervals, and the center conductor is made of dielectric material. The upper layer strip line and the lower layer strip line are connected by a connecting member having a structure coated with.
以下、本発明の一実施例を添付図面を参照して詳細に説
明ずろ。Hereinafter, one embodiment of the present invention will be described in detail with reference to the accompanying drawings.
第１図は本発明に係る超高周波フィルタの構造の概略図
である。第１図において、１は下層金属板、２は下層金
属板１の上方に下層金属板工と所定の間隔を隔てて配置
された下層誘電体基板、３（よ下層誘電体基板２の下面
に形成された超高周波フィルタを構成する下層ストリッ
プライン、２ａは下層ス１． リップライン３の始端部
分を臨む位置に穿設された所定の大きさの穴、４は下層
誘電体基板２の下面両端部と下層金属板１の上面両端部
との間に介在されたスペーサ、５ば下層誘電体基板２の
上方に下Ｒ誘電体基板２と所定の間隔を隔てて配置され
た中層金属板、５ａｌま下層誘電体基板２の穴穿設位置
に対応する位置に穿設された下層誘電体基板２の穴２ａ
よりも大きい穴、６は中層金属板５の下面両端部と下層
誘電体基板２の上面両端部との間に介在されたスペーサ
、７は中層金属板５の上方に中層金属板５と所定の間隔
を隔てて配置された上層誘電体基板、８は上層誘電体基
板７の上面に形成された超高周波フィルタを構成する上
層ストリップライン、ハは上層ストリップライン８の終
端部分を臨む位置であって、下層誘電体基板２の穴穿設
位首に対応する位置に穿設された下層誘電体基板２の穴
２ａと同じ大きさの穴、９は上層誘電体基板７の下面両
端部と中層金属板５の上面両端部との間に介在されたス
ペーサ、１０は上層誘電体基板７の」ニガに上層′Ａ誘
電体基板と所定の間隔を隔てて配置された上層金属板、
１１は上層誘電体基板７の上面両端部と上層金属板１０
との間に介在されたスペーサ、１２は上層ストリップラ
イン８と下層ストリップライン３とを接続する接続部材
である。接続部材１２は第２図に示すように、上層スト
リップライン８と下層ストリップライン３とを接続する
中心導体１２ａと中心導体１２ａを被覆している誘電体
＋２ｂとから構成されている。中心導体１２ａは上層誘
電体基板７の穴７ａ、中層金属板５の穴５ａ及び下層誘
電体基板２の穴２ａに嵌挿されており、上端部が上層ス
）・リップライン８に、下端部が下層ストリップライン
３にそれぞれ接続されている。又、誘電体１２ｂは中心
導体１２ａのうち上層誘電体基板７の下面から下層誘電
体基板２の上面までの部分を被覆しており、上層誘電体
基板７の下面から中層金属板５の上面までの部分が中層
金属板５の穴よりも径が大きい円柱形状で、中層金属板
５の上面から下層誘電体基板２の上面までの部分が中層
金属板５の穴５ａに嵌挿し得る形状になっている。 ス
トリップライン８を伝搬されてきたマイクロ波はス）・
リップライン８の終端部分から中心導体１２ａを介して
ストリップライン３の始端部分に伝搬され、さらにスト
リップライン３を伝搬されていくことになる。FIG. 1 is a schematic diagram of the structure of an ultra-high frequency filter according to the present invention. In FIG. 1, 1 is a lower metal plate, 2 is a lower dielectric substrate placed above the lower metal plate 1 at a predetermined distance from the lower metal plate, and 3 (on the lower surface of the lower dielectric substrate 2). The lower layer strip line constituting the formed ultra-high frequency filter, 2a is the lower layer strip 1. A hole of a predetermined size is drilled at a position facing the starting end of the lip line 3, 4 is both ends of the lower surface of the lower dielectric substrate 2. spacer 5a interposed between the lower layer dielectric substrate 2 and both ends of the upper surface of the lower layer metal plate 1; Holes 2a in the lower dielectric substrate 2 are drilled at positions corresponding to the hole drilling positions in the lower dielectric substrate 2.
6 is a spacer interposed between both ends of the bottom surface of the middle layer metal plate 5 and both ends of the top surface of the lower dielectric substrate 2, and 7 is a spacer between the middle layer metal plate 5 and a predetermined space above the middle layer metal plate 5. Upper layer dielectric substrates are arranged at intervals, 8 is an upper layer strip line forming an ultra-high frequency filter formed on the upper surface of the upper layer dielectric substrate 7, and C is a position facing the terminal part of the upper layer strip line 8. , a hole of the same size as the hole 2a of the lower dielectric substrate 2, which is drilled at a position corresponding to the hole opening position of the lower dielectric substrate 2, and 9 indicates both ends of the lower surface of the upper dielectric substrate 7 and the middle layer metal. A spacer is interposed between both ends of the upper surface of the plate 5, and an upper metal plate 10 is disposed at a predetermined distance from the upper dielectric substrate 7 of the upper dielectric substrate 7.
11 are both ends of the upper surface of the upper dielectric substrate 7 and the upper metal plate 10
A spacer 12 interposed between the upper layer strip line 8 and the lower layer strip line 3 is a connecting member. As shown in FIG. 2, the connecting member 12 is composed of a center conductor 12a that connects the upper strip line 8 and the lower strip line 3, and a dielectric +2b covering the center conductor 12a. The center conductor 12a is fitted into the hole 7a of the upper dielectric substrate 7, the hole 5a of the middle metal plate 5, and the hole 2a of the lower dielectric substrate 2, and its upper end is connected to the upper layer lip line 8, and its lower end is connected to the upper layer lip line 8. are connected to the lower strip lines 3, respectively. Further, the dielectric 12b covers a portion of the center conductor 12a from the lower surface of the upper dielectric substrate 7 to the upper surface of the lower dielectric substrate 2, and extends from the lower surface of the upper dielectric substrate 7 to the upper surface of the middle layer metal plate 5. The part has a cylindrical shape with a diameter larger than the hole in the middle metal plate 5, and the part from the top surface of the middle metal plate 5 to the top surface of the lower dielectric substrate 2 has a shape that can be inserted into the hole 5a in the middle metal plate 5. ing. The microwave propagated through the strip line 8 is
The light is propagated from the terminal end of the lip line 8 to the starting end of the strip line 3 via the center conductor 12a, and further propagated through the strip line 3.
なお、上層ス！・リップライン８と中心導体１２ａとの
接続及び下層ストリップライン３と中心導体＋２ａとの
接続はハンダ付は等によってなされている。又、誘電体
１２ｂの材料としてはテフロン等を用いる。In addition, the upper class! - The connection between the lip line 8 and the center conductor 12a and the connection between the lower strip line 3 and the center conductor +2a are made by soldering or the like. Furthermore, Teflon or the like is used as the material for the dielectric 12b.
なお、本実施例では２層構造の超高周波フィルタについ
て説明したが、これに限らず３層以上の超高周波フィル
タを構成するようにしてもよい。In this embodiment, an ultra-high frequency filter having a two-layer structure has been described, but the present invention is not limited to this, and an ultra-high frequency filter having three or more layers may be configured.
以上説明したように本発明によれば、下層金属板、下Ｍ
誘電体基板、中層金属板、上層誘電体基板及び上層金属
板を所定の間隔を隔てて積層して配置し、上層誘電体基
板の穴、中層金属板の穴及び下層誘電体基板の穴に嵌挿
されており、上層ストリップライン及び下層ストリップ
ラインとに接続されている中心導体、この中心導体を被
覆しており、上層誘電体基板の下面から中層金属板の上
面までの部分が中層金属板の穴に嵌挿し得ない形状で、
中層金属板の上面から下層誘電体基板の上面までの部分
が中層金属板の穴に嵌挿し得ろ形状の誘電体から構成さ
れた接続部材によって上層ストリップラインと下層スト
リップラインとを接続ずろことによって、積み重ねた超
高層ｄＹフィルタの構造が得られるので、かかる超高周
波フィルタの構造を使用するマイクロ波受信器の小型化
を実現できる。As explained above, according to the present invention, the lower metal plate, the lower M
A dielectric substrate, a middle layer metal plate, an upper layer dielectric substrate, and an upper layer metal plate are stacked and arranged at a predetermined interval, and are fitted into the holes of the upper layer dielectric substrate, the holes of the middle layer metal plate, and the holes of the lower layer dielectric substrate. The center conductor is inserted and connected to the upper layer strip line and the lower layer strip line, and the part that covers this center conductor and extends from the lower surface of the upper layer dielectric substrate to the upper surface of the middle layer metal plate is the middle layer metal plate. With a shape that cannot be inserted into a hole,
By connecting the upper layer strip line and the lower layer strip line with a connecting member made of a dielectric material whose portion from the top surface of the middle layer metal plate to the top surface of the lower layer dielectric substrate can be inserted into a hole in the middle layer metal plate, Since a stacked superhigh-rise dY filter structure is obtained, it is possible to realize miniaturization of a microwave receiver using such a superhigh frequency filter structure.
第１図は本発明に係る超高周波フィルタの構造の概略図
、第２図は第１図に示した部材の↑ミ）親図である。
１−下層金属板、２ 下ＩＦＩ誘電体基板、４，６゜９
．１１ スペーサ、３，８ ストリップライン、５ 中
層金属板、７ 上層誘電体基板、ＩＯ上層金属板、１２
接続部材。FIG. 1 is a schematic diagram of the structure of an ultra-high frequency filter according to the present invention, and FIG. 2 is a parent diagram of the members shown in FIG. 1. 1-Lower metal plate, 2 Lower IFI dielectric substrate, 4,6°9
．． 11 Spacer, 3, 8 Strip line, 5 Middle layer metal plate, 7 Upper layer dielectric substrate, IO upper layer metal plate, 12
Connection member.
Claims (2)
属板と所定の間隔を隔てて配置され、下面に下層ストリ
ップラインによる超高周波フィルタが形成されていると
ともに、該下層ストリップラインの始端部分を臨む位置
に所定の大きさの穴が穿設された下層誘電体基板と、前
記下層誘電体基板の上方に該下層誘電体基板と所定の間
隔を隔てて配置され、該下層誘電体基板の穴穿設位置に
対応する位置に所定の大きさの穴が穿設された中層金属
板と、前記中層金属板の上方に該中層金属板と所定の間
隔を隔てて配置され、上面に上層ストリップラインによ
る超高周波フィルタが形成されているとともに、該上層
ストリップラインの終端部分を臨む位置であって、前記
下層誘電体基板の穴穿設位置に対応する位置に所定の大
きさの穴が設けられた上層誘電体基板と、前記上層誘電
体基板の上方に該上層誘電体基板と所定の間隔を隔てて
配置された上層金属板と、前記上層誘電体基板の穴、前
記中層金属板の穴及び前記下層誘電体基板の穴を介して
前記上層ストリップラインと前記下層ストリップライン
とを接続する中心導体及び前記中心導体のうち前記上層
誘電体基板の下面から前記下層誘電体基板の上面までを
前記中層金属板の穴を介して被覆しており、該上層誘電
体基板の下面から該中層金属板の上面までの部分が該中
層金属板の穴に嵌挿し得ない形状で、該中層金属板の上
面から該下層誘電体基板の上面までの部分が該中層金属
板の穴に嵌挿し得る形状の誘電体とから構成された接続
部材とを備えたことを特徴とする超高周波フィルタの構
造。(1) A lower metal plate, which is arranged above the lower metal plate at a predetermined distance from the lower metal plate, and has an ultra-high frequency filter formed by a lower strip line on its lower surface, and a super high frequency filter formed by a lower strip line. a lower dielectric substrate in which a hole of a predetermined size is bored at a position facing the starting end portion; a middle layer metal plate in which a hole of a predetermined size is drilled at a position corresponding to the hole drilled position of the substrate; An ultra-high frequency filter is formed by the upper layer stripline, and a hole of a predetermined size is formed at a position facing the terminal portion of the upper layer stripline and corresponding to the hole drilling position of the lower layer dielectric substrate. an upper dielectric substrate provided, an upper metal plate disposed above the upper dielectric substrate at a predetermined distance from the upper dielectric substrate, a hole in the upper dielectric substrate, and a hole in the middle metal plate. A center conductor that connects the upper strip line and the lower strip line through a hole and a hole in the lower dielectric substrate, and a center conductor that connects the upper strip line and the lower strip line from the lower surface of the upper dielectric substrate to the upper surface of the lower dielectric substrate. The middle layer metal plate is coated through the hole in the middle layer metal plate, and the portion from the bottom surface of the upper dielectric substrate to the top surface of the middle layer metal plate has a shape that cannot be inserted into the hole in the middle layer metal plate. A structure of an ultra-high frequency filter, characterized in that the portion from the upper surface of the lower dielectric substrate to the upper surface of the lower dielectric substrate includes a connecting member formed of a dielectric material having a shape that can be inserted into a hole of the intermediate layer metal plate.
部と前記下層金属板の上面両端部との間に介在されたス
ペーサ、中層金属板は該中層金属板の下面両端部と前記
下層誘電体基板の上面両端部との間に介在されたスペー
サ、上層誘電体基板は該上層誘電体基板の下面両端部と
前記中層金属板の上面両端部との間に介在されたスペー
サ及び上層金属板は該上層金属板の下面両端部と前記上
層誘電体基板の上面両端部との間に介在されたスペーサ
によって、それぞれ前記間隔が保持されている特許請求
の範囲第１項記載の超高周波フィルタの構造。(2) The lower dielectric substrate has a spacer interposed between both ends of the lower surface of the lower dielectric substrate and both ends of the upper surface of the lower metal plate, and the middle layer metal plate has spacers interposed between both ends of the lower surface of the middle layer metal plate and A spacer interposed between both ends of the top surface of the lower dielectric substrate, a spacer interposed between both ends of the bottom surface of the upper dielectric substrate and both ends of the top surface of the middle layer metal plate, and a spacer interposed between both ends of the top surface of the upper dielectric substrate, The super high frequency according to claim 1, wherein the metal plate is spaced apart from each other by spacers interposed between both ends of the lower surface of the upper metal plate and both ends of the upper surface of the upper dielectric substrate. Filter structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60226939A JPS6286902A (en) | 1985-10-14 | 1985-10-14 | Structure of ultra high frequency filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60226939A JPS6286902A (en) | 1985-10-14 | 1985-10-14 | Structure of ultra high frequency filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6286902A true JPS6286902A (en) | 1987-04-21 |
Family
ID=16852975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60226939A Pending JPS6286902A (en) | 1985-10-14 | 1985-10-14 | Structure of ultra high frequency filter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6286902A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016158095A (en) * | 2015-02-24 | 2016-09-01 | 日立金属株式会社 | Antenna device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3303439A (en) * | 1965-06-14 | 1967-02-07 | Western Electric Co | Strip transmission line interboard connection |
| JPS509352A (en) * | 1973-05-21 | 1975-01-30 | ||
| JPS5645210U (en) * | 1979-09-14 | 1981-04-23 | ||
| JPS5756241A (en) * | 1980-09-22 | 1982-04-03 | Aika Kogyo Kk | Manufacture of corrugated cardboard |
| JPS5743603B2 (en) * | 1975-11-25 | 1982-09-16 | ||
| JPS58166803A (en) * | 1982-03-27 | 1983-10-03 | Fujitsu Ltd | Dielectric filter |
-
1985
- 1985-10-14 JP JP60226939A patent/JPS6286902A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3303439A (en) * | 1965-06-14 | 1967-02-07 | Western Electric Co | Strip transmission line interboard connection |
| JPS509352A (en) * | 1973-05-21 | 1975-01-30 | ||
| JPS5743603B2 (en) * | 1975-11-25 | 1982-09-16 | ||
| JPS5645210U (en) * | 1979-09-14 | 1981-04-23 | ||
| JPS5756241A (en) * | 1980-09-22 | 1982-04-03 | Aika Kogyo Kk | Manufacture of corrugated cardboard |
| JPS58166803A (en) * | 1982-03-27 | 1983-10-03 | Fujitsu Ltd | Dielectric filter |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016158095A (en) * | 2015-02-24 | 2016-09-01 | 日立金属株式会社 | Antenna device |
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