JPS628673U - - Google Patents
Info
- Publication number
- JPS628673U JPS628673U JP1985100634U JP10063485U JPS628673U JP S628673 U JPS628673 U JP S628673U JP 1985100634 U JP1985100634 U JP 1985100634U JP 10063485 U JP10063485 U JP 10063485U JP S628673 U JPS628673 U JP S628673U
- Authority
- JP
- Japan
- Prior art keywords
- chip carrier
- cap
- chip
- adhesive
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985100634U JPS628673U (zh) | 1985-07-02 | 1985-07-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985100634U JPS628673U (zh) | 1985-07-02 | 1985-07-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS628673U true JPS628673U (zh) | 1987-01-19 |
Family
ID=30970636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985100634U Pending JPS628673U (zh) | 1985-07-02 | 1985-07-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS628673U (zh) |
-
1985
- 1985-07-02 JP JP1985100634U patent/JPS628673U/ja active Pending