JPS6286733A - Resin molding device - Google Patents

Resin molding device

Info

Publication number
JPS6286733A
JPS6286733A JP22747285A JP22747285A JPS6286733A JP S6286733 A JPS6286733 A JP S6286733A JP 22747285 A JP22747285 A JP 22747285A JP 22747285 A JP22747285 A JP 22747285A JP S6286733 A JPS6286733 A JP S6286733A
Authority
JP
Japan
Prior art keywords
plunger
resin
mold
resin molding
frames
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22747285A
Other languages
Japanese (ja)
Inventor
Junzo Ishizaki
石崎　順三
Kazuo Kusuda
楠田　一夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP22747285A priority Critical patent/JPS6286733A/en
Publication of JPS6286733A publication Critical patent/JPS6286733A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/58—Details
    • B29C45/586—Injection or transfer plungers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To perform a sufficient molding on a cull as well as the cavity and the runner in case a resin molding is performed using a quick-curing resin by providing the plunger attaching part with a heater for plunger. CONSTITUTION:New frames 10 and 10 are installed and thereafter, the frames are clamped and a resin is filled. This resin is cured by the heat of a top force 1, a bottom force 2 and a plunger 4, is integrally formed with the frames 10 and 10 and thereafter, the mold is again released and the frames 10 and 10 are taken out. At this time, with the top and bottom forces 1 and 2 heated by heaters 3..., a plunger attaching part 5 is also heated by a heater 11 for plunger. Hereby, the plunger 4 is also heated by thermal conduction from the plunger attaching part 5. In this heating process of the plunger 4, the temperature of the plunger 4 is set at the same temperature or more as that of the both top and bottom forces and 2. By this way, even when a resin molding is performed using a quick-curing resin, this resin molding device can be applied.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体装置等の製造に用いられる樹脂モール
ド装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin molding apparatus used for manufacturing semiconductor devices and the like.

〔従来技術〕[Prior art]

従来の樹脂モールド装置は、上金型及び下金型子Ｐ内部
にヒータが設けられており、これによって孔が縦設され
、この貫通孔に、上金型に対し挿入抜脱自在な円柱状の
プランジャが設けられている。In the conventional resin molding device, a heater is provided inside the upper mold and the lower mold element P, and a hole is provided vertically by this, and a cylindrical shape that can be inserted into and removed from the upper mold is inserted into the through hole. A plunger is provided.

このような構造において、樹脂成形後の型開時には上金
型にプランジャが挿入されていないため、プランジャの
温度は金型の温度より低い温度になっている。しかしな
がら、樹脂成形前の型締時には上金型にプランジャが挿
入されているため、上金型の熱がプランジャに伝わる。In such a structure, since the plunger is not inserted into the upper mold when the mold is opened after resin molding, the temperature of the plunger is lower than the temperature of the mold. However, since the plunger is inserted into the upper mold during mold clamping before resin molding, heat from the upper mold is transmitted to the plunger.

この型締時において、従来の樹脂は硬化時間が長いこと
から、十分なキュアタイムを必要とし、従って、型締時
の時間が長くなるので、プランジャの温度は金型の温度
と同じになるまで上昇する。これにより、製品の形を作
る型部であるキャビ、このキャビとカルとを結び樹脂流
路となるランチ、及び複数のランナを結ぶカルの樹脂成
形が行われていた。During this mold clamping process, as conventional resins take a long time to harden, sufficient curing time is required.Therefore, the mold clamping time is extended until the temperature of the plunger reaches the same temperature as that of the mold. Rise. As a result, the resin molding of the cavity, which is a mold part that creates the shape of the product, the lunch that connects the cavity and the cull and serves as a resin flow path, and the cull that connects a plurality of runners is performed.

しかしながら、近年、オートモールド等によりトランス
ファーモールド工程における樹脂成形時間の短縮を図る
ために、速硬化性の樹脂が開発されている。この速硬化
性の樹脂では、キュアタイムが大幅に短縮されるため、
型締時の時間も短くなる。これにより、上記プランジャ
の温度が金型の温度迄上昇する以前、或いは上昇した直
後に型開となる。従って、上下両金型により樹脂成形さ
れる上記キャビ及びランナは硬化するが、プランジャに
より樹脂成形されるカルは硬化しないため、半導体装置
の品質が低下するという欠点を有していた。However, in recent years, fast-curing resins have been developed in order to shorten the resin molding time in the transfer molding process using automolding or the like. This fast-curing resin significantly reduces cure time, so
The mold clamping time is also shortened. As a result, the mold is opened before or immediately after the temperature of the plunger rises to the temperature of the mold. Therefore, although the cavity and runner molded with resin by the upper and lower molds are hardened, the cull molded with resin by the plunger is not hardened, resulting in a drawback that the quality of the semiconductor device is degraded.

〔発明の目的〕[Purpose of the invention]

本発明は、上記従来の問題点を考慮してなされたもので
あって、速硬化性の樹脂を使用して樹脂成形を行う際、
キャビ及びランナと共にカルについても十分な成形を行
うことができるようにして、高品質の半導体装置を製造
し得るようにした樹脂モールド装置の提供を目的とする
ものである。The present invention has been made in consideration of the above-mentioned conventional problems, and when performing resin molding using a fast-curing resin,
The object of the present invention is to provide a resin molding device that can sufficiently mold not only the cavity and the runner but also the cull, thereby making it possible to manufacture high-quality semiconductor devices.

〔発明の構成〕[Structure of the invention]

本発明に係る樹脂モールド装置は、半導体装置を保護す
るための樹脂の成形に用いられるプランジャがプランジ
ャ取付部に装着されている樹脂モールド装置において、
前記プランジャ取付部にプランジャ用ヒータを設けて、
プランジャの温度を上下両金型と同一ないしはそれ以上
に設定することができるように構成したことを特徴とす
るものである。A resin molding device according to the present invention is a resin molding device in which a plunger used for molding resin for protecting a semiconductor device is attached to a plunger mounting part.
A plunger heater is provided in the plunger mounting portion,
This is characterized in that the temperature of the plunger can be set to be the same as or higher than that of both the upper and lower molds.

〔実施例〕〔Example〕

本発明の一実施例を第１図乃至第７図に基づいて、以下
に説明する。An embodiment of the present invention will be described below based on FIGS. 1 to 7.

第４図に示すように、断面長方形の上金型１及び下金型
２のそれぞれ左右両端部付近には、断面円形のヒータ３
・・・が挿入されている。上記上金型１の中央部には、
上下に貫通した貫通孔６が形成されており、この貫通孔
６には、上金型１に対し挿入抜脱自在な円柱状のプラン
ジャ４が設けられている。このプランジャ４は、その上
端部にて円柱状のプランジャ取付部５に装着されている
。一方、上記下金型２の上面中央部は、断面皿状に形成
されている。この皿状部の中央部と、上記貫通孔６の下
部と、プランジャ４の下端面とによって囲まれた空域部
位は、第７図にも示したように、後述するランナ８・・
・を結ぶカル９を形成している。又、上記断面皿状部の
端部付近と上金型ｌの下面とによって囲まれる断面クサ
ビ状の空域部位は、上記カル９と後述のキャビア・・・
とを結び樹脂流路となるランナ８・・・を形成している
。これらランナ８・・・に接続されているキャビア・・
・においては、製品の形を作り得るように、上金型１の
下面と下金型２の上面とが共に凹状に形成され対向配置
に設けられている。これらキャビア・・・に挟まれるよ
うに、樹脂と一体成形されるフレーム１０・１０が設置
されている。又、第１図乃至第３図に示すように、前記
プランジャ取付部５の外周面から略中央部にかけてプラ
ンジャ用ヒータ１１が埋設されており、このプランジャ
用ヒータ１１は図示しない温度調節器に接続されている
。As shown in FIG. 4, heaters 3 with a circular cross section are installed near both left and right ends of the upper mold 1 and the lower mold 2, each having a rectangular cross section.
... has been inserted. In the center of the upper mold 1,
A through hole 6 is formed that penetrates vertically, and a cylindrical plunger 4 that can be inserted into and removed from the upper mold 1 is provided in this through hole 6. The plunger 4 is attached to a cylindrical plunger attachment part 5 at its upper end. On the other hand, the center portion of the upper surface of the lower mold 2 is formed into a dish-shaped cross section. As shown in FIG. 7, the air space surrounded by the central part of the dish-shaped part, the lower part of the through hole 6, and the lower end surface of the plunger 4 is a runner 8, which will be described later.
・It forms a cull 9 that connects. In addition, an air space portion having a wedge-shaped cross section surrounded by the vicinity of the end of the dish-shaped cross-sectional portion and the lower surface of the upper mold l is formed by the cull 9 and the caviar described later...
A runner 8 is connected to form a resin flow path. Caviar connected to these runners 8...
In *, the lower surface of the upper mold 1 and the upper surface of the lower mold 2 are both formed in a concave shape and are arranged to face each other so that the shape of the product can be formed. Frames 10, which are integrally molded with resin, are installed so as to be sandwiched between these caviars. Further, as shown in FIGS. 1 to 3, a plunger heater 11 is embedded from the outer peripheral surface of the plunger mounting portion 5 to approximately the center thereof, and this plunger heater 11 is connected to a temperature regulator (not shown). has been done.

上記の構成において、本樹脂モールド装置を作動させる
と、第５図に示す型開時には、樹脂成形工程が終了した
フレーム１０・１０（第４図示）が取り出され、次に新
しいフレーム１０・１０が設置される。この新しいフレ
ーム１０・１０が設置された後に、第６図に示すように
型締され、樹脂が充填される。この樹脂は、上金型１、
下金型２、及びプランジャ４の熱により硬化し、フレー
ム１０・１０と一体形成され、その後、再び型開され、
フレーム１０・１０が取り出される。このとき、ヒータ
３・・・により上金型１及び下金型２が加熱されると共
に、プランジャ用ヒータ１１によりプランジャ取付部５
も加熱される。これにより、プランジャ取付部５から熱
伝導によりプランジャ４も加熱される。このプランジャ
４の加熱工程において、プランジャ４の温度を両金型１
・２の温度と同一ないしはそれ以上に設定することによ
り、速硬化性の樹脂を使用して樹脂成形を行うときにも
、本発明の樹脂モールド装置を適用することができる。In the above configuration, when the present resin molding device is operated, the frames 10, 10 (shown in the fourth figure) for which the resin molding process has been completed are taken out when the mold is opened as shown in FIG. will be installed. After the new frames 10 are installed, the molds are clamped and filled with resin as shown in FIG. This resin is used for upper mold 1,
It is hardened by the heat of the lower mold 2 and the plunger 4, is formed integrally with the frames 10, and is then opened again.
Frames 10 and 10 are taken out. At this time, the upper mold 1 and the lower mold 2 are heated by the heater 3 . . . , and the plunger mounting portion 5 is heated by the plunger heater 11.
is also heated. As a result, the plunger 4 is also heated by heat conduction from the plunger mounting portion 5. In this heating process of the plunger 4, the temperature of the plunger 4 is
- By setting the temperature to be the same as or higher than 2, the resin molding apparatus of the present invention can be applied even when resin molding is performed using a fast-curing resin.

〔発明の効果〕〔Effect of the invention〕

本発明の樹脂モールド装置は、以上のように、プランジ
ャ取付部にプランジャ用ヒータを設けた構成であるから
、プランジャの温度を上下両金型の温度と同一ないしは
それ以上に設定することができる。これにより、速硬化
性の樹脂を使用して樹脂成形を行う際に、キャビ及びラ
ンナと共に、カルについても十分な成形を行うことがで
きるので、高品質の半導体装置を容易に製造することが
できるという効果を奏する。As described above, the resin molding device of the present invention has a configuration in which the plunger heater is provided in the plunger mounting portion, so that the temperature of the plunger can be set to be the same as or higher than the temperature of both the upper and lower molds. This allows sufficient molding of the cavity and runner as well as the cull when performing resin molding using fast-curing resin, making it possible to easily manufacture high-quality semiconductor devices. This effect is achieved.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例を示す正面図、第２図は第１
図の底面図、第３図は第１図のＡ−Ａ線矢視断面図、第
４図はトランスファーモールド時のプランジャ及び上下
両金型の構造を示す断面図、第５図は型開時におけるプ
ランジャと両金型との位置関係の概略を示す説明図、第
６図は型締時におけるプランジャと両金型との位置関係
の概略を示す説明図、第７図はトランスファーモールド
時のカル、ランナ及びキャビの形状を示す平面図である
。 １は上金型、２は下金型、３はヒータ、４はプランジャ
、５はプランジャ取付部、７はキャビ、８はランナ、９
はカル、１０はフレーム、１１はプランジャ用ヒータで
ある。 特許出願人　　　シャープ株式会社 第７図 第　１　図 ２図FIG. 1 is a front view showing one embodiment of the present invention, and FIG. 2 is a front view showing one embodiment of the present invention.
The bottom view of the figure, Figure 3 is a sectional view taken along the line A-A in Figure 1, Figure 4 is a sectional view showing the structure of the plunger and upper and lower molds during transfer molding, and Figure 5 is when the mold is opened. Fig. 6 is an explanatory diagram showing an outline of the positional relationship between the plunger and both molds during mold clamping, and Fig. 7 is an explanatory diagram showing an outline of the positional relationship between the plunger and both molds during mold clamping. FIG. 2 is a plan view showing the shapes of the runner and the cab. 1 is an upper mold, 2 is a lower mold, 3 is a heater, 4 is a plunger, 5 is a plunger mounting part, 7 is a cavity, 8 is a runner, 9
10 is a frame, and 11 is a plunger heater. Patent applicant Sharp Corporation Figure 7 Figure 1 Figure 2

Claims (1)

【特許請求の範囲】[Claims] １、半導体装置を保護するための樹脂の成形に用いられ
るプランジャがプランジャ取付部に装着されている樹脂
モールド装置において、前記プランジャ取付部にプラン
ジャ用ヒータを設けたことを特徴とする樹脂モールド装
置。1. A resin molding apparatus in which a plunger used for molding resin for protecting a semiconductor device is attached to a plunger mounting part, characterized in that a heater for the plunger is provided in the plunger mounting part.
JP22747285A 1985-10-11 1985-10-11 Resin molding device Pending JPS6286733A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22747285A JPS6286733A (en) 1985-10-11 1985-10-11 Resin molding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22747285A JPS6286733A (en) 1985-10-11 1985-10-11 Resin molding device

Publications (1)

Publication Number Publication Date
JPS6286733A true JPS6286733A (en) 1987-04-21

Family

ID=16861415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22747285A Pending JPS6286733A (en) 1985-10-11 1985-10-11 Resin molding device

Country Status (1)

Country Link
JP (1) JPS6286733A (en)

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