JPS628669U - - Google Patents

Info

Publication number

JPS628669U

JPS628669U JP10070985U JP10070985U JPS628669U JP S628669 U JPS628669 U JP S628669U JP 10070985 U JP10070985 U JP 10070985U JP 10070985 U JP10070985 U JP 10070985U JP S628669 U JPS628669 U JP S628669U

Authority

JP

Japan

Prior art keywords

circuit board

printed circuit

electronic components

solder resist

unnecessary parts

Prior art date

1985-07-02

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229910000679 solder Inorganic materials 0.000 claims description 4
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
• 239000011889 copper foil Substances 0.000 claims description 2
• 239000011248 coating agent Substances 0.000 claims 1
• 238000000576 coating method Methods 0.000 claims 1
• 238000005476 soldering Methods 0.000 claims 1
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1

Cited By (1)