JPS628636U - - Google Patents
Info
- Publication number
- JPS628636U JPS628636U JP10015585U JP10015585U JPS628636U JP S628636 U JPS628636 U JP S628636U JP 10015585 U JP10015585 U JP 10015585U JP 10015585 U JP10015585 U JP 10015585U JP S628636 U JPS628636 U JP S628636U
- Authority
- JP
- Japan
- Prior art keywords
- diameter
- chuck table
- wafer chuck
- porous portion
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
第1図は本考案のウエハチヤツクテーブルの平
面図、第2図は同ウエハチヤツクテーブルの断面
図、第3図は従来のウエハチヤツクテーブルの平
面図、第4図は同ウエハチヤツクテーブル断面図
、第5図は従来の他のウエハチヤツクテーブルの
平面図、第6図は同ウエハチヤツクテーブルの断
面図、第7図は本考案の第2実施例を示すウエハ
チヤツクテーブルの平面図、第8図は本考案の第
3の実施例を示すウエハチヤツクテーブルの平面
図である。
11…基部、12…第1のポーラス部、13,
13′…第2のポーラス部、14…開口、15…
バキユーム口、16…第3のポーラス部。
Figure 1 is a plan view of the wafer chuck table of the present invention, Figure 2 is a sectional view of the same wafer chuck table, Figure 3 is a plan view of a conventional wafer chuck table, and Figure 4 is the same wafer chuck table. 5 is a plan view of another conventional wafer chuck table, FIG. 6 is a sectional view of the same wafer chuck table, and FIG. 7 is a wafer chuck table showing a second embodiment of the present invention. FIG. 8 is a plan view of a wafer chuck table showing a third embodiment of the present invention. 11...base, 12...first porous part, 13,
13'...Second porous portion, 14...Opening, 15...
Bakyum mouth, 16...Third porous part.
Claims (1)
ユームできると共に小径ウエハの直径よりは直径
が小さい円板状の第1のポーラス部と、該ポーラ
ス部の外周部には少なくとも第2のポーラス部と
を形成し、ポーラス部を多重にするようにしたこ
とを特徴とするウエハチヤツクテーブル。 (2) 前記第2のポーラス部はリング状に形成さ
れることを特徴とする実用新案登録請求の範囲第
1項記載のウエハチヤツクテーブル。 (3) 前記第2のポーラス部の直径は大径ウエハ
の直径よりは大きいことを特徴とする実用新案登
録請求の範囲第2項記載のウエハチヤツクテーブ
ル。[Claims for Utility Model Registration] (1) In the center of the wafer chuck table, there is a disc-shaped first porous part that can be vacuumed and has a diameter smaller than the diameter of the small-diameter wafer, and on the outer periphery of the porous part. 1. A wafer chuck table, characterized in that the porous portion is formed with at least a second porous portion, and the porous portion is multiplexed. (2) The wafer chuck table according to claim 1, wherein the second porous portion is formed in a ring shape. (3) The wafer chuck table according to claim 2, wherein the diameter of the second porous portion is larger than the diameter of the large-diameter wafer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10015585U JPS628636U (en) | 1985-07-02 | 1985-07-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10015585U JPS628636U (en) | 1985-07-02 | 1985-07-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS628636U true JPS628636U (en) | 1987-01-19 |
Family
ID=30969708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10015585U Pending JPS628636U (en) | 1985-07-02 | 1985-07-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS628636U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150052181A (en) * | 2012-08-31 | 2015-05-13 | 세미컨덕터 테크놀로지스 앤드 인스트루먼츠 피티이 엘티디 | Single ultra-planar wafer table structure for both wafers and film frames |
-
1985
- 1985-07-02 JP JP10015585U patent/JPS628636U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150052181A (en) * | 2012-08-31 | 2015-05-13 | 세미컨덕터 테크놀로지스 앤드 인스트루먼츠 피티이 엘티디 | Single ultra-planar wafer table structure for both wafers and film frames |
JP2015528643A (en) * | 2012-08-31 | 2015-09-28 | セミコンダクター テクノロジーズ アンド インストゥルメンツ ピーティーイー リミテッド | Single ultra-flat wafer table structure for both wafer and film frame |
US10312124B2 (en) | 2012-08-31 | 2019-06-04 | Semiconductor Technologies & Instruments Pte Ltd | Single ultra-planar wafer table structure for both wafers and film frames |