JPS6284731U - - Google Patents
Info
- Publication number
- JPS6284731U JPS6284731U JP17701185U JP17701185U JPS6284731U JP S6284731 U JPS6284731 U JP S6284731U JP 17701185 U JP17701185 U JP 17701185U JP 17701185 U JP17701185 U JP 17701185U JP S6284731 U JPS6284731 U JP S6284731U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor pressure
- support
- recess
- housing
- side surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図は本考案装置の一実施例を示す断面図、
第２図は本考案装置の他の実施例を示す断面図、
第３図は従来例を示す断面図である。 １……半導体感圧素子、２……ハウジング、３
……弾性接着剤、４……ステム、９……凹所、１
２……保護体、１４……基台。
第２図は本考案装置の他の実施例を示す断面図、
第３図は従来例を示す断面図である。 １……半導体感圧素子、２……ハウジング、３
……弾性接着剤、４……ステム、９……凹所、１
２……保護体、１４……基台。
Claims (1)
- ハウジングを構成する支持体の凹所に半導体感
圧素子を配置し、上記支持体に対して底面及び側
面の少なくとも一部を接着固定したことを特徴と
する半導体感圧装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17701185U JPS6284731U (ja) | 1985-11-18 | 1985-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17701185U JPS6284731U (ja) | 1985-11-18 | 1985-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6284731U true JPS6284731U (ja) | 1987-05-29 |
Family
ID=31117807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17701185U Pending JPS6284731U (ja) | 1985-11-18 | 1985-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6284731U (ja) |
-
1985
- 1985-11-18 JP JP17701185U patent/JPS6284731U/ja active Pending