JPS6281087A - Lead frame connecting structure - Google Patents
Lead frame connecting structureInfo
- Publication number
- JPS6281087A JPS6281087A JP60220127A JP22012785A JPS6281087A JP S6281087 A JPS6281087 A JP S6281087A JP 60220127 A JP60220127 A JP 60220127A JP 22012785 A JP22012785 A JP 22012785A JP S6281087 A JPS6281087 A JP S6281087A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- connection
- board
- resistance
- hot wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、回路基板と外部端子とを接続するリードフレ
ームの接続に係り、特に自動車に搭載する厚膜回路基板
に好適なリードフレーム接続構造に関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a lead frame connection for connecting a circuit board and an external terminal, and particularly relates to a lead frame connection structure suitable for a thick film circuit board mounted on an automobile. .
従来、この種のリードフレーム接続は、特開昭５６−１
０１０７３号公報に記載される如く、基板とリードフレ
ームとの接続が機械的国定と、電気的接続とを兼ねた１
点の半田付で行われているため、組み立て作業における
熱応力に対する余裕が少ないという欠点を有している。Conventionally, this type of lead frame connection was disclosed in Japanese Unexamined Patent Publication No. 56-1
As described in Publication No. 01073, the connection between the board and the lead frame is one that serves as both mechanical and electrical connection.
Since it is performed by point soldering, it has the disadvantage that there is little margin for thermal stress during assembly work.
本発明の目的は、電子装置内における厚膜回路等を形成
した基板と外部端子との接続部の信頼性特にヒートショ
ック性の向上を図ると共に、組み立て作業時の機械的ス
トレスを回避することのできるリードフレーム接続構造
を提供することにある。It is an object of the present invention to improve the reliability, especially the heat shock resistance, of the connection between a board on which a thick film circuit or the like is formed and an external terminal in an electronic device, and to avoid mechanical stress during assembly work. The objective is to provide a lead frame connection structure that can be used.
本発明は、リードフレーム接続部において機械的ストレ
スや、使用中の熱的ストレスに対する耐力の向上をはか
るために、機械的固定のための接続部と、電気的接続の
ための接続部を個別に設けたものである。すなわち、本
発明は、厚膜印刷回路を形成した基板と、外部端子とを
接続するリードフレームにおいて、上記リードフレーム
と上記基板とを固定するための第１の接続部と、前記リ
ードフレームと前記基板との電気的接続を行なうための
第２の接続部を設け、前記第１の接続部と前記第２の接
続部を半田付可能な金属で構成したことを特徴とするも
のである。In order to improve the resistance against mechanical stress and thermal stress during use in the lead frame connection part, the present invention separately connects the connection part for mechanical fixing and the connection part for electrical connection. It was established. That is, the present invention provides a lead frame for connecting a substrate on which a thick film printed circuit is formed and an external terminal, including a first connection portion for fixing the lead frame and the substrate, and a first connecting portion for fixing the lead frame and the substrate, and The present invention is characterized in that a second connection part is provided for making an electrical connection with the substrate, and the first connection part and the second connection part are made of a solderable metal.
以下、本発明の実施例について説明する。 Examples of the present invention will be described below.
第１図には、本発明を熱線式空気流量センサに適用した
場合の一実施例が示されている。FIG. 1 shows an embodiment in which the present invention is applied to a hot wire type air flow sensor.
図において、１は絶縁体１例えばプラスチックを成形し
たハウジング、２は、ｉｔ子回路を厚膜回路で形成した
回路基板、３は、外部端子４と回路基板２を接続するた
めのリードフレームで、３ａ。In the figure, 1 is a housing made of an insulator 1 such as plastic, 2 is a circuit board with an IT circuit formed of a thick film circuit, and 3 is a lead frame for connecting the external terminal 4 and the circuit board 2. 3a.
３ｂ、３ｃの３対を有している。端子５ａ、５ｂ。It has three pairs, 3b and 3c. Terminals 5a, 5b.
６ａ、６ｂは、前述の空気流量を検出するための熱線抵
抗ＨＷ、および空気温度検出抵抗ＣＷとリードＬを介し
て接続されている。５ａ、５ｂ。6a and 6b are connected via leads L to the aforementioned hot wire resistance HW for detecting the air flow rate and to the air temperature detection resistance CW. 5a, 5b.
６ａ、６ｂと回路基板２とは、ワイヤＷを介して接続さ
れている。Ｃはカバーで、ＡＤはハウジング１と回路基
板２とを固定するための接着剤である。6a, 6b and the circuit board 2 are connected via wires W. C is a cover, and AD is an adhesive for fixing the housing 1 and the circuit board 2.
次にリードフレーム３の接続について詳述する。Next, the connection of the lead frame 3 will be described in detail.
Ｐ２．Ｐ３は、回路基板２とり−１（フレーム３との接
続部ではんだ付けにより、接続されており、第３図のよ
うにＰ２は固定を目的としているため、基板の導体ＣＯ
１は何にも電気的に接続されず、Ｐ３にて、基板内の回
路に導体Ｃ○２を介して接続されている。またＰ２とＰ
３の間のリードフレームは、第２図の如く、互いにスト
レスの影響を受けない様にたるみを設けである。さらに
外部端子４とリードフレーム３とはＰ１部の溶接で接続
されている。P2. P3 is connected to the circuit board 2-1 (by soldering at the connection part with the frame 3, and as shown in Figure 3, P2 is intended for fixation, so the conductor CO of the board
1 is not electrically connected to anything, but is connected to a circuit in the board via conductor C2 at P3. Also P2 and P
As shown in FIG. 2, the lead frames between the lead frames 3 and 3 are provided with slack so that they are not affected by stress. Further, the external terminal 4 and the lead frame 3 are connected by welding at the P1 portion.
次に本実施例の熱線式空気流量センサの動作について説
明する。Next, the operation of the hot wire type air flow sensor of this embodiment will be explained.
第４図は、熱線式空気流量センサの全体構造図。FIG. 4 is an overall structural diagram of the hot wire type air flow sensor.
第５図は、その電気回路図、第６図は呂力持性を示した
ものである。第４図において、Ｂは、空気通路、例えば
、自動車のエアクリーナと吸気管の間の吸気通路で、そ
の流量Ｑの１部ｑは、バイパス通路ＢＹに入り、第１図
である空気流量センサＭの熱線抵抗ＭＷ、空気温度検出
抵抗ＣＷを経て下流で再びＱと合流する。熱線抵抗ＨＷ
と空気温度検出抵抗ＣＷで、第５図に示す回路を構成す
れば、Ｐ８ａ抵抗ＨＷと空気温度検出抵抗ＣＷの関係は
（１）式で表わされる。FIG. 5 shows its electrical circuit diagram, and FIG. 6 shows its power retention. In FIG. 4, B is an air passage, for example, an intake passage between an air cleaner of an automobile and an intake pipe, and a part q of the flow rate Q enters the bypass passage BY and is connected to the air flow sensor M shown in FIG. It passes through the hot wire resistance MW and the air temperature detection resistance CW, and then merges with Q again downstream. Hot wire resistance HW
If the circuit shown in FIG. 5 is configured with the P8a resistance HW and the air temperature detection resistance CW, the relationship between the P8a resistance HW and the air temperature detection resistance CW is expressed by equation (1).
すなわち、空気の温度変化を補償し、（１）式が成り立
つように差動増巾器Ａ、トランジスタＴが動作し、熱線
抵抗ＨＷへの供給電力を制御する。That is, the differential amplifier A and the transistor T operate so as to compensate for the temperature change of the air and satisfy equation (1), thereby controlling the power supplied to the hot wire resistor HW.
一方、熱線抵抗ＨＷの消費電力と空気ｑの流速ｖｑの間
には（２）式の関係がある。On the other hand, there is a relationship expressed by equation (2) between the power consumption of the hot wire resistance HW and the flow velocity vq of the air q.
工ｎ２×ＨＷ＝Ｃ４＋Ｃ２（Ｐｖｑ） ・・・・・・
（２）Ｃｘ ｐ Ｃ２１ｎ ；定数
Ｐ ；空気の密度
Ｉｎ ；）（ｗに流れる電流
従って出力電圧Ｖ、は（３）式とより、第６図に示した
特性を得ることができる。Engineering n2×HW=C4+C2(Pvq) ・・・・・・
(2) Cx p C21n; constant P; density of air In;) (The current flowing through w, and therefore the output voltage V, is determined by equation (3), and the characteristics shown in FIG. 6 can be obtained.
但し Ｑ＝ｋｑ ｑ＝ＰＶｑ、Ｓ
Ｋ；Ｑと９の分流率
Ｓ；バイパス通路Ｉ３Ｙの断面積
〔発明の効果〕
以上説明したように、本発明によれば、外部端子とリー
ドフレームの溶接時に、リードフレームに力を加え１機
械的ストレスを与えても、電気的接続部にはダメードを
与えない効果がある。However, Q=kq q=PVq, S K; Dividing ratio S of Q and 9; Cross-sectional area of bypass passage I3Y [Effect of the invention] As explained above, according to the present invention, when welding the external terminal and the lead frame, Even if mechanical stress is applied to the lead frame, the electrical connections will not be damaged.
また、本発明によれは、使用中のストレス、例えば自動
車での定期におけるエンジン始動どいつた熱？＃撃によ
る熱ストレスに対しても耐力が向上し、信頼性を向上で
きる効果がある。In addition, the present invention also deals with stress during use, such as the heat caused by starting the engine in a car. It also has the effect of improving its resistance to heat stress caused by impact and improving reliability.
！
第１図は本発明の実施例を示す平面図、第２図は第１図
図示実施例の側断面図、第３図は基板とリードフレーム
の詳細図、第４図は熱線式流量センサの全体構造図、第
５図は熱線式空気流量センサの回路図、第６図は熱線式
流量センサの出力特性図である。
１・・・ハウジング、２・・・回路基板、３・・・リー
ドフレーム、４・・・外部端子、Ｐ工・・・溶接々枝部
、Ｐ２・・・固定接続部、Ｐ、・・・電気的接続部。
ｌ巷憬人 ４＾渭↓ 上ｌｌＩｎ田
第１０
６２囚 ７
鰻３の! FIG. 1 is a plan view showing an embodiment of the present invention, FIG. 2 is a side sectional view of the embodiment shown in FIG. 5 is a circuit diagram of the hot wire type air flow sensor, and FIG. 6 is an output characteristic diagram of the hot wire type air flow sensor. DESCRIPTION OF SYMBOLS 1... Housing, 2... Circuit board, 3... Lead frame, 4... External terminal, P work... Welding joint part, P2... Fixed connection part, P,... Electrical connections. l Street people 4＾渭↓ Upper llInden No. 10 62 prisoners 7 Eel 3
Claims (1)
するリードフレームにおいて、上記リードフレームと上
記基板とを固定するための第１の接続部と、前記リード
フレームと前記基板との電気的接続を行なうための第２
の接続部を設け、前記第１及び第２の接続部を半田付可
能な金属で構成したことを特徴とするリードフレーム接
続構造。1. In a lead frame that connects a board on which a thick film printed circuit is molded and an external terminal, a first connection part for fixing the lead frame and the board, and an electrical connection between the lead frame and the board the second to make the connection
1. A lead frame connection structure, characterized in that the first and second connection parts are made of solderable metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60220127A JPS6281087A (en) | 1985-10-04 | 1985-10-04 | Lead frame connecting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60220127A JPS6281087A (en) | 1985-10-04 | 1985-10-04 | Lead frame connecting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6281087A true JPS6281087A (en) | 1987-04-14 |
Family
ID=16746330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60220127A Pending JPS6281087A (en) | 1985-10-04 | 1985-10-04 | Lead frame connecting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6281087A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014092430A (en) * | 2012-11-02 | 2014-05-19 | Denso Corp | Flow rate measuring device |
-
1985
- 1985-10-04 JP JP60220127A patent/JPS6281087A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014092430A (en) * | 2012-11-02 | 2014-05-19 | Denso Corp | Flow rate measuring device |
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