JP2005188972A - Voltage-drop type current measuring device - Google Patents
Voltage-drop type current measuring device Download PDFInfo
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Abstract
Description
この発明は、電圧降下式電流計測装置に関する。 The present invention relates to a voltage drop type current measuring device.
例えば、自動車等に搭載された様々な負荷を駆動するに際して、電流センサで電流を計測し、計測された電流値を発電機の制御パラメータ等に使用することが行われている。 For example, when various loads mounted on an automobile or the like are driven, the current is measured by a current sensor, and the measured current value is used as a control parameter for a generator.
この場合に使用される電流センサとしては、ホール素子を用いたものもあるが、大電流を流す導体の大きさに準じて部品サイズが比較的大きくなり、このため小型化の要請に合致しない場合がある。そこで、電流経路内にシャント抵抗を配置し、このシャント抵抗に流れる電流を計測することが行われている。 Some current sensors used in this case use Hall elements, but the component size is relatively large according to the size of the conductor through which a large current flows, and this does not meet the requirements for miniaturization. There is. Therefore, a shunt resistor is arranged in the current path, and a current flowing through the shunt resistor is measured.
この場合、電流経路を構成するバスバーをシャント抵抗として利用し、このバスバーに重ね合せるようにPCB(プリント回路基板)を配設して、該PCB上に所定の電流検出用の回路を組込むと共に、該PCBの配線とバスバーとを半田付け等で接続するようにしたものが考えられる。 In this case, a bus bar constituting the current path is used as a shunt resistor, a PCB (printed circuit board) is disposed so as to be superimposed on the bus bar, and a predetermined current detection circuit is incorporated on the PCB, It can be considered that the wiring of the PCB and the bus bar are connected by soldering or the like.
しかしながら、上述のようにバスバーにPCBを重ね合せて両者を半田付け等した構成では、例えば、車両内等における温度変化が激しい環境下においては、両者の熱膨張係数の差等によって、それらの接続部分に応力が作用し、場合によっては該接続部分が破損等する恐れがある。 However, in the configuration in which the PCB is superimposed on the bus bar and soldered together as described above, for example, in an environment where the temperature change is severe in the vehicle or the like, the connection between them due to the difference in the thermal expansion coefficient between the two Stress may be applied to the portion, and in some cases, the connecting portion may be damaged.
そこで、この発明の課題は、被計測電流が流れる板状配線材とこれに取付けられる電流計測用の回路基板との間で、それらの接続部分に作用する応力を緩和できる、電圧降下式電流計測装置を提供することにある。 Accordingly, an object of the present invention is to provide a voltage drop type current measurement that can relieve stress acting on a connecting portion between a plate-like wiring member through which a current to be measured flows and a circuit board for current measurement attached thereto. To provide an apparatus.
上記課題を解決すべく、請求項1記載の発明は、所定の経路を流れる被計測電流を計測する電圧降下式電流計測装置であって、導電性を有し、前記経路に介装される配線材と、前記配線材上に配設され、前記配線材の所定の2点間に生じる電圧降下量に基づいて前記被計測電流を計測する回路の少なくとも一部が設けられた回路基板と、を備え、前記回路基板が、前記配線材よりも可撓性のあるもので構成されると共に、前記所定の2点で前記配線材に電気的に接続されて固定されたものである。 In order to solve the above-mentioned problem, the invention according to claim 1 is a voltage drop type current measuring device for measuring a current to be measured flowing through a predetermined path, which has conductivity and is a wiring interposed in the path. And a circuit board provided on the wiring material and provided with at least a part of a circuit for measuring the measured current based on a voltage drop amount generated between two predetermined points of the wiring material. The circuit board is made of a material that is more flexible than the wiring material, and is electrically connected and fixed to the wiring material at the predetermined two points.
また、請求項2記載のように、前記回路基板には、外部接続用の引出線が一体形成されていてもよい。 According to a second aspect of the present invention, a lead wire for external connection may be integrally formed on the circuit board.
さらに、請求項3記載のように、前記被計測電流を計測する回路は、前記配線材と、前記配線材と同じ抵抗温度係数の材料で構成されて前記配線材に対して所定の接続点で電気的に接続されるセンス導体と、前記配線材において前記接続点から前記被計測電流の流れる方向に一定距離離れた第1の点と前記センス導体において前記接続点から所定の距離離れた第2の点との電位差を比較する電位差比較回路と、前記電位差比較回路からの信号に基づいて、前記第1の点と前記第2の点との電位差が等しくなるように前記センス導体に前記接続点から前記第2の点に向って計測用電流を流す電流制御回路と、前記計測用電流に基づいて前記被計測電流を計測する電流計測回路と、を備えて構成され、前記回路基板には、前記配線材を除いた前記被計測電流を計測するための回路の構成要素のうち前記センス導体が少なくとも設けられていてもよい。 Further, according to a third aspect of the present invention, the circuit for measuring the current to be measured is composed of the wiring material and a material having the same resistance temperature coefficient as the wiring material, and is connected to the wiring material at a predetermined connection point. A sense conductor that is electrically connected, a first point that is a predetermined distance away from the connection point in the wiring material in a direction in which the current to be measured flows, and a second point that is a predetermined distance away from the connection point in the sense conductor. The potential difference comparison circuit for comparing the potential difference between the first point and the connection point to the sense conductor so that the potential difference between the first point and the second point becomes equal based on a signal from the potential difference comparison circuit. A current control circuit for flowing a measurement current toward the second point, and a current measurement circuit for measuring the measured current based on the measurement current, and the circuit board includes: Excluding the wiring material The sense conductor of the components of a circuit for measuring the measured current may be provided with at least.
以上のように、請求項1〜請求項3記載の電圧降下式電流計測装置によると、配線材と回路基板との熱膨張係数の差等に起因する形状変化の差が、比較的可撓性のある回路基板の変形によって吸収される。従って、配線材と回路基板との間でそれらの接続部分での応力を緩和できる。 As described above, according to the voltage drop type current measurement device according to claims 1 to 3, the difference in shape change caused by the difference in thermal expansion coefficient between the wiring material and the circuit board is relatively flexible. It is absorbed by the deformation of the circuit board. Therefore, the stress at the connection portion between the wiring material and the circuit board can be relaxed.
さらに、請求項2記載の発明によれば、引出線を介して外部回路への接続を容易に行える。 Furthermore, according to the second aspect of the present invention, connection to an external circuit can be easily performed via the lead wire.
また、請求項3記載の発明によれば、配線材における電圧降下と、この配線材と同一の抵抗温度係数を有する材料のセンス導体の電圧降下とが、同一の温度変化による抵抗値変化を受けることを利用して、センス導体から流れ出る計測用電流を計測することで、配線材に流れる被計測電流を計測するので、温度変化に対する抵抗値の変化率を演算等によって考慮しなくても、被計測電流を容易に計測することができる。 According to the invention of claim 3, the voltage drop in the wiring material and the voltage drop in the sense conductor made of the material having the same resistance temperature coefficient as the wiring material are subjected to the resistance value change due to the same temperature change. Therefore, the current to be measured flowing through the wiring material is measured by measuring the measurement current flowing out from the sense conductor. The measurement current can be easily measured.
以下、この発明の実施の形態に係る電圧降下式電流計測装置について説明する。 Hereinafter, a voltage drop type current measuring device according to an embodiment of the present invention will be described.
図1は電圧降下式電流計測装置20を示す斜視図であり、図2は電圧降下式電流計測装置20を示す側面図である。 FIG. 1 is a perspective view showing a voltage drop type current measuring device 20, and FIG. 2 is a side view showing the voltage drop type current measuring device 20.
この電圧降下式電流計測装置20は、測定対象となる所定の電流経路に流れる電流を測定するものであり、例えば、車両等において、バッテリからスタータモータへの通電電流を検出することで、バッテリの充電状態を判別する用途に用いられる。 This voltage drop type current measuring device 20 measures a current flowing through a predetermined current path to be measured. For example, in a vehicle or the like, by detecting an energization current from the battery to the starter motor, Used for determining the state of charge.
この電圧降下式電流計測装置20は、配線材であるバスバー1と、そのバスバー1に付設された回路基板としてフレキシブル配線板24とを備えている。 The voltage drop type current measuring device 20 includes a bus bar 1 which is a wiring material, and a flexible wiring board 24 as a circuit board attached to the bus bar 1.
バスバー1は、銅や銅合金、アルミなどの導電性材料により形成された板状の導電性片である。このバスバー1は、所定負荷に電源供給を行う電流経路に介挿されている。本電圧降下式電流計測装置20は、このバスバー1に流れる電流を測定する。なお、図1では、バスバー1の両端部には、所定の負荷或はバッテリー側の配線材との接続用に供される孔1hが形成されている。 The bus bar 1 is a plate-like conductive piece formed of a conductive material such as copper, a copper alloy, or aluminum. The bus bar 1 is inserted in a current path that supplies power to a predetermined load. The voltage drop type current measuring device 20 measures the current flowing through the bus bar 1. In FIG. 1, holes 1 h provided for connection to a predetermined load or a wiring material on the battery side are formed at both ends of the bus bar 1.
フレキシブル配線板24は、例えば、一対の可撓性樹脂フィルムの間に、銅箔等により形成された所定の配線パターンを挟込んだフレキシブル配線基板(FPC)であり、可撓性を有する配線板である。回路基板としては、かかるフレキシブル配線板24の他、例えば、所定厚みの樹脂板を用いた一般的なプリント基板よりも可撓性(或は柔軟正)に優れたものを用いることができる。 The flexible wiring board 24 is a flexible wiring board (FPC) in which a predetermined wiring pattern formed of a copper foil or the like is sandwiched between a pair of flexible resin films, for example, and has a flexible wiring board. It is. As the circuit board, in addition to the flexible wiring board 24, for example, a circuit board that is superior in flexibility (or softness) to a general printed board using a resin board having a predetermined thickness can be used.
このフレキシブル配線板24には、所定の配線パターンが形成されると共に所定の電子部品が実装されて、電流測定用の回路が少なくとも部分的に形成されている。電流測定用の回路の一例については後述する。 On the flexible wiring board 24, a predetermined wiring pattern is formed and a predetermined electronic component is mounted, so that a circuit for current measurement is at least partially formed. An example of a circuit for measuring current will be described later.
そして、その電流測定用の回路を構成する配線部材である配線パターンが、上記バスバー1に電気的、機械的に接続されている。配線パターンとバスバー1との接続は、例えば、半田付け、或は、溶接、ねじ止等により行われる。本実施の形態では、フレキシブル配線板24をバスバー1の一方面側に重ね合せるように配設した状態で、配線パターンとバスバー1とが半田付部22を介して電気的、機械的に接続されている。ここで、配線パターンとバスバー1との接続点は、後述する点Aと点Pcnに対応している。 A wiring pattern which is a wiring member constituting the current measurement circuit is electrically and mechanically connected to the bus bar 1. The connection between the wiring pattern and the bus bar 1 is performed by, for example, soldering, welding, screwing, or the like. In the present embodiment, the wiring pattern and the bus bar 1 are electrically and mechanically connected via the soldering portion 22 in a state where the flexible wiring board 24 is disposed so as to overlap one side of the bus bar 1. ing. Here, the connection point between the wiring pattern and the bus bar 1 corresponds to a point A and a point Pcn described later.
ここで、図3を参照して、本電圧降下式電流計測装置20において適用される電流測定用の回路例について説明する。 Here, a circuit example for current measurement applied in the voltage drop type current measurement device 20 will be described with reference to FIG.
この電流測定用の回路は、電圧降下を計測することによって負荷Mに流されるメイン電流I1を計測するものであって、概略的には、シャント抵抗であるバスバー1での電圧降下と、このバスバー1と略同一の抵抗温度係数を有する材料の温度補償用抵抗体2(センス導体)での電圧降下とが、温度変化により略同一の抵抗値変化の影響を受けることを利用して、バスバー1に近接配置して接続した温度補償用抵抗体2から流れ出る計測用電流I2を計測し、もって、バスバー1に流れるメイン電流I1を計測しようとするものである。 This circuit for measuring current measures the main current I1 that flows through the load M by measuring the voltage drop. In general, the voltage drop at the bus bar 1 that is a shunt resistor, and the bus bar By utilizing the fact that the voltage drop in the temperature compensating resistor 2 (sense conductor) of the material having the resistance temperature coefficient substantially the same as 1 is affected by the substantially same resistance value change due to the temperature change, the bus bar 1 The measuring current I2 flowing out from the temperature compensating resistor 2 connected in close proximity to the measuring current I2 is measured, so that the main current I1 flowing through the bus bar 1 is measured.
具体的には、電圧降下式電流計測装置20は、バッテリから負荷Mへの電流経路に介挿されたシャント抵抗としてのバスバー1と、このバスバー1の所定の接続点Pcnに接続された温度補償用抵抗体2と、バスバー1内において上記接続点Pcnからメイン電流I1の流れる方向に一定距離だけ離れた点Aの電位と温度保証用抵抗体2内において上記接続点Pcnから所定の距離だけ離れた点Bの電位とを比較する電位差比較回路3と、点Bの電位と点Aの電位が等しくなるまで温度補償用抵抗体2に上記接続点Pcnから点Bに向かって計測用電流I2を流す電流制御回路4と、この計測用電流I2に基づいてメイン電流I1を計測する電流計測回路5とを備える。 Specifically, the voltage drop type current measuring device 20 includes a bus bar 1 as a shunt resistor inserted in a current path from the battery to the load M, and a temperature compensation connected to a predetermined connection point Pcn of the bus bar 1. The resistor 2 is separated from the connection point Pcn in the bus bar 1 by a predetermined distance from the connection point Pcn in the direction in which the main current I1 flows, and the temperature assurance resistor 2 is separated from the connection point Pcn by a predetermined distance. The potential difference comparison circuit 3 that compares the potential at the point B, and the current I2 for measurement from the connection point Pcn to the point B are applied to the temperature compensation resistor 2 until the potential at the point B and the potential at the point A become equal. A current control circuit 4 is provided, and a current measurement circuit 5 that measures the main current I1 based on the measurement current I2.
上記温度補償用抵抗体2は、例えば、フレキシブル配線板24に含まれる配線パターンにより構成されている。 The temperature compensating resistor 2 is constituted by, for example, a wiring pattern included in the flexible wiring board 24.
また、電位差比較回路3は、例えば、演算増幅器(オペアンプ)により構成されており、その非反転入力端子がバスバー1側の点Aに接続され、反転入力端子が、温度補償用抵抗体2側の点Bに接続されており、両入力端子に与えられる電圧の差分が出力端子から出力されるようになっている。 Further, the potential difference comparison circuit 3 is configured by, for example, an operational amplifier (op-amp), and its non-inverting input terminal is connected to the point A on the bus bar 1 side, and the inverting input terminal is on the temperature compensation resistor 2 side. It is connected to the point B, and the difference between the voltages applied to both input terminals is output from the output terminal.
また、電流制御回路4は、PチャネルFETにより構成されており、ソースが温度補償用抵抗体2の点Bに接続され、ドレインが電流計測回路5に接続され、ゲートが電位差比較回路3の出力端子に接続されている。 The current control circuit 4 is composed of a P-channel FET, the source is connected to the point B of the temperature compensating resistor 2, the drain is connected to the current measurement circuit 5, and the gate is the output of the potential difference comparison circuit 3. Connected to the terminal.
これにより、バスバー1にメイン電流I1が流れた際に生じる該バスバー1での電圧降下によって電位差比較回路3が電流制御回路4のゲート入力を制御し、A点とB点の電圧降下が等しくなるようにB点に電流I2が流れることになる。 Thereby, the potential difference comparison circuit 3 controls the gate input of the current control circuit 4 by the voltage drop in the bus bar 1 generated when the main current I1 flows through the bus bar 1, and the voltage drops at the points A and B become equal. Thus, the current I2 flows through the point B.
電流計測回路5は、計測用電流I2を電圧に変換するための抵抗器11と、この抵抗器11の一端の電位を計測するA/D変換器(検出回路)12とを備える。 The current measurement circuit 5 includes a resistor 11 for converting the measurement current I2 into a voltage, and an A / D converter (detection circuit) 12 for measuring the potential at one end of the resistor 11.
上記電位差比較回路3、電流制御回路4及び電流計測回路5は、フレキシブル配線板24に実装されていてもよいし、又は、フレキシブル配線板24とは別の基板に実装されていてもよい。 The potential difference comparison circuit 3, the current control circuit 4, and the current measurement circuit 5 may be mounted on the flexible wiring board 24 or may be mounted on a substrate different from the flexible wiring board 24.
この電圧降下式電流計測装置20の回路動作について説明する。 The circuit operation of the voltage drop type current measuring device 20 will be described.
まず、バッテリ(+B)からの電源電圧が供給されると、バスバー1にメイン電流I1が流れ、このメイン電流I1が負荷Mに流れる。 First, when the power supply voltage from the battery (+ B) is supplied, the main current I1 flows through the bus bar 1, and the main current I1 flows through the load M.
ここで、バスバー1にメイン電流I1が流れると、バスバー1での電圧降下によって、電位差比較回路3の非反転入力端子がローとなる。そうすると、電位差比較回路3の出力端子がローとなり、これがPチャネルFETである電流制御回路4のゲートに与えられ、このゲート入力が制御されることで、電位差比較回路3の動作に基づきA点とB点の電圧降下が等しくなるように温度補償用抵抗体2に計測用電流I2が流れる。 Here, when the main current I1 flows through the bus bar 1, the non-inverting input terminal of the potential difference comparison circuit 3 becomes low due to the voltage drop at the bus bar 1. Then, the output terminal of the potential difference comparison circuit 3 becomes low, and this is given to the gate of the current control circuit 4 which is a P-channel FET, and the gate input is controlled. A measurement current I2 flows through the temperature compensating resistor 2 so that the voltage drops at point B are equal.
この場合、バスバー1の抵抗値をR1とし、温度補償用抵抗体2の抵抗値をR2として、「R1×I1=R2×I2」となるように、電位差比較回路3が電流制御回路4を制御することになる。かかる動作において、電位差比較回路3の各入力端子には電流が流れ込まないので、分流電流としての計測用電流I2は全て電流制御回路4のドレイン電流として電流計測回路5に出力される。 In this case, assuming that the resistance value of the bus bar 1 is R1 and the resistance value of the temperature compensating resistor 2 is R2, the potential difference comparison circuit 3 controls the current control circuit 4 so that “R1 × I1 = R2 × I2”. Will do. In this operation, since no current flows into each input terminal of the potential difference comparison circuit 3, all the measurement current I 2 as a shunt current is output to the current measurement circuit 5 as the drain current of the current control circuit 4.
電流計測回路5の抵抗器11に計測用電流I2が流れると、この抵抗器11の一端に生じる電圧がA/D変換器12に与えられ、これにより計測用電流I2を計測することで、メイン電流I1を計測する。 When the measurement current I2 flows through the resistor 11 of the current measurement circuit 5, a voltage generated at one end of the resistor 11 is applied to the A / D converter 12, and thereby the measurement current I2 is measured. The current I1 is measured.
すなわち、抵抗器11の抵抗値をRout、抵抗器11の両端電圧をVoutとすると、「Vout=Rout×I2」であり、また「I2=(R1/R2)×I1」であるため、「Vout=Rout×(R1/R2)×I1」である。したがって、メイン電流I1は、A/D変換器12で計測されたVoutに基づいて、「I1=Vout×(R2/R1)/Rout」という式により演算で求めることができる。 That is, assuming that the resistance value of the resistor 11 is Rout and the voltage across the resistor 11 is Vout, “Vout = Rout × I2” and “I2 = (R1 / R2) × I1”. = Rout × (R1 / R2) × I1 ”. Therefore, the main current I1 can be obtained by calculation based on the expression “I1 = Vout × (R2 / R1) / Rout” based on Vout measured by the A / D converter 12.
ここで、バスバー1と温度補償用抵抗体2とを略同じ抵抗温度係数の材料で構成し、しかも、それらを互いに近接配置しておくと、温度変化に対する抵抗値の変化はほぼ同一となる。つまり、上述した電流I1の導出式において、(R2/R1)はほぼ一定値となる。従って、温度補償用抵抗体2から流れ出る計測用電流I2を計測することで、温度変化に対する抵抗値の変化率を演算等によって考慮しなくても、バスバー1から流れ出るメイン電流I1を計測することができることとなる。 Here, if the bus bar 1 and the temperature compensating resistor 2 are made of materials having substantially the same resistance temperature coefficient, and they are arranged close to each other, the change in resistance value with respect to the temperature change becomes substantially the same. That is, (R2 / R1) is a substantially constant value in the above-described equation for deriving the current I1. Therefore, by measuring the measurement current I2 flowing out from the temperature compensating resistor 2, the main current I1 flowing out from the bus bar 1 can be measured without taking into account the rate of change of the resistance value with respect to the temperature change by calculation or the like. It will be possible.
すなわち、電圧降下式電流計測装置20として、図3に示す原理を利用した回路ブロックを適用した場合には、温度変化に対する、バスバー1と温度補償用抵抗体2との抵抗値変化率を略同一にするために、バスバー1と温度補償用抵抗体2とを近接配置するのが好ましい。このため、電流測定用の回路の構成要素である温度補償用抵抗体2をフレキシブル配線板24に組込んだ上で、該フレキシブル配線板24をバスバー1に重ね合せて配設すると、バスバー1と温度補償用抵抗体2との抵抗変化率を略同一にすることができる。 That is, when the circuit block using the principle shown in FIG. 3 is applied as the voltage drop type current measuring device 20, the resistance value change rates of the bus bar 1 and the temperature compensating resistor 2 with respect to the temperature change are substantially the same. In order to achieve this, it is preferable that the bus bar 1 and the temperature compensating resistor 2 are arranged close to each other. For this reason, when the temperature compensating resistor 2 which is a component of the circuit for current measurement is assembled in the flexible wiring board 24 and the flexible wiring board 24 is arranged so as to overlap the bus bar 1, The rate of change in resistance with the temperature compensating resistor 2 can be made substantially the same.
このように構成された電圧降下式電流計測装置20によると、周辺温度変化が生じた場合に、バスバー1とフレキシブル配線板24との熱膨張係数の差等に起因して両者間に変化量の差が生じた場合でも、比較的可撓性あるフレキシブル配線板24の変形によって、変化量の差が吸収される。従って、フレキシブル配線板24の配線部材とバスバー1との接続部分での応力を緩和できる。 According to the voltage drop type current measuring device 20 configured in this way, when the ambient temperature changes, the amount of change between the two due to the difference in the thermal expansion coefficient between the bus bar 1 and the flexible wiring board 24 or the like. Even when the difference occurs, the difference in the amount of change is absorbed by the deformation of the flexible wiring board 24 that is relatively flexible. Therefore, the stress at the connection portion between the wiring member of the flexible wiring board 24 and the bus bar 1 can be relaxed.
図4及び図5に、電圧降下式電流計測装置20の取付例を示す。 4 and 5 show examples of mounting the voltage drop type current measuring device 20.
図4は、リレーボックス等の筐体30内の底面30aに重ね合せるように電圧降下式電流計測装置20を配設した例を示しており、図5は、筐体30内の側面30bに重ね合せるように電圧降下式電流計測装置20を配設した例を示している。 FIG. 4 shows an example in which the voltage drop type current measuring device 20 is disposed so as to overlap with the bottom surface 30a in the housing 30 such as a relay box, and FIG. The example which has arrange | positioned the voltage drop type | formula current measuring device 20 so that it may match is shown.
これらの図に示すように、本電圧降下式電流計測装置20は、板状のバスバー1にフレキシブル配線板24を重ね合せるように配設した薄型の構成であるため、筐体30内の底面30aや側面30bに重ね合せるようにして省スペースで組込むことができる。特に、フレキシブル配線板24自体が薄型であるため、本電圧降下式電流計測装置20の全体構成の薄型化に貢献する。 As shown in these drawings, the voltage drop type current measuring device 20 has a thin configuration in which the flexible wiring board 24 is superposed on the plate-like bus bar 1. And can be assembled in a space-saving manner so as to overlap the side surface 30b. In particular, since the flexible wiring board 24 itself is thin, it contributes to thinning of the overall configuration of the voltage drop type current measuring device 20.
なお、図4及び図5に示す例では、バスバー1の両端部の一側部を屈曲し、その屈曲片1bを筐体30に貫通させて外方に導出させている(図5参照)。そして、その屈曲片1bの導出端部に、バッテリや負荷Mに至る配線を適宜接続している。 In the example shown in FIGS. 4 and 5, one side portion of both end portions of the bus bar 1 is bent, and the bent piece 1b is penetrated through the housing 30 and led out outward (see FIG. 5). And the wiring which reaches a battery and load M is suitably connected to the derivation end of the bent piece 1b.
また、フレキシブル配線板24には、外部接続用の引出線25が一体形成されている。この引出線25は、例えば、電流検出用の回路の検出信号を外部に出力する信号線を含んでいる。そして、この引出線25を介して、電流測定用の回路が所定の制御部に接続される。 The flexible wiring board 24 is integrally formed with a lead wire 25 for external connection. The lead line 25 includes, for example, a signal line for outputting a detection signal of a current detection circuit to the outside. Then, a current measurement circuit is connected to a predetermined control unit via the lead line 25.
このようにフレキシブル配線板24に引出線25を一体形成しておくことで、該引出線25を介して、電流検出用の回路と外部回路との接続を容易に行える。 Thus, by integrally forming the lead wire 25 on the flexible wiring board 24, the current detection circuit and the external circuit can be easily connected via the lead wire 25.
このため、特に 上記電位差比較装置3、電流制御装置4及び電流計測装置5を、フレキシブル配線板24とは別の基板に実装する場合において、当該フレキシブル基板24と別の基板とを接続するのに有効である。 For this reason, particularly when the potential difference comparison device 3, the current control device 4, and the current measurement device 5 are mounted on a substrate different from the flexible wiring board 24, the flexible substrate 24 and the other substrate are connected. It is valid.
1 バスバー
2 温度補償用抵抗体
3 電位差比較回路
4 電流制御回路
5 電流計測装置
20 電圧降下式電流計測装置
24 フレキシブル配線板
DESCRIPTION OF SYMBOLS 1 Bus bar 2 Resistor for temperature compensation 3 Potential difference comparison circuit 4 Current control circuit 5 Current measuring device 20 Voltage drop type current measuring device 24 Flexible wiring board
Claims (3)
導電性を有し、前記経路に介装される配線材と、
前記配線材上に配設され、前記配線材の所定の2点間に生じる電圧降下量に基づいて前記被計測電流を計測する回路の少なくとも一部が設けられた回路基板と、を備え、
前記回路基板が、前記配線材よりも可撓性のあるもので構成されると共に、前記所定の2点で前記配線材に電気的に接続されて固定された、電圧降下式電流計測装置。 A voltage drop type current measuring device that measures a current to be measured flowing through a predetermined path,
A wiring material having conductivity and interposed in the path;
A circuit board provided on the wiring member and provided with at least a part of a circuit for measuring the current to be measured based on a voltage drop amount generated between two predetermined points of the wiring member;
The voltage drop type current measuring device, wherein the circuit board is configured to be more flexible than the wiring material, and is electrically connected and fixed to the wiring material at the predetermined two points.
前記回路基板には、外部接続用の引出線が一体形成されている、電圧降下式電流計測装置。 The voltage drop type current measuring device according to claim 1,
A voltage drop type current measuring device in which a lead wire for external connection is integrally formed on the circuit board.
前記被計測電流を計測する回路は、
前記配線材と、
前記配線材と同じ抵抗温度係数の材料で構成されて前記配線材に対して所定の接続点で電気的に接続されるセンス導体と、
前記配線材において前記接続点から前記被計測電流の流れる方向に一定距離離れた第1の点と前記センス導体において前記接続点から所定の距離離れた第2の点との電位差を比較する電位差比較回路と、
前記電位差比較回路からの信号に基づいて、前記第1の点と前記第2の点との電位差が等しくなるように前記センス導体に前記接続点から前記第2の点に向って計測用電流を流す電流制御回路と、
前記計測用電流に基づいて前記被計測電流を計測する電流計測回路と、
を備えて構成され、
前記回路基板には、前記配線材を除いた前記被計測電流を計測するための回路の構成要素のうち前記センス導体が少なくとも設けられる、電圧降下式電流計測装置。 The voltage drop type current measuring device according to claim 1 or 2,
The circuit for measuring the measured current is:
The wiring material;
A sense conductor composed of a material having the same resistance temperature coefficient as the wiring material and electrically connected to the wiring material at a predetermined connection point;
A potential difference comparison that compares a potential difference between a first point that is a fixed distance away from the connection point in the wiring material in the direction in which the current to be measured flows and a second point that is a predetermined distance away from the connection point in the sense conductor. Circuit,
Based on a signal from the potential difference comparison circuit, a current for measurement is applied to the sense conductor from the connection point toward the second point so that the potential difference between the first point and the second point becomes equal. A current control circuit to flow;
A current measurement circuit for measuring the measured current based on the measurement current;
Configured with
The voltage drop type current measuring device, wherein the circuit board is provided with at least the sense conductor among components of a circuit for measuring the measured current excluding the wiring member.
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012137980A1 (en) | 2011-04-05 | 2012-10-11 | Yazaki Corporation | Shunt resistance type current sensor |
WO2013041603A1 (en) * | 2011-09-23 | 2013-03-28 | Continental Automotive Gmbh | Device for measuring a battery current |
WO2014010410A1 (en) | 2012-07-11 | 2014-01-16 | Yazaki Corporation | Shunt resistance type current sensor |
WO2014046246A1 (en) | 2012-09-21 | 2014-03-27 | 矢崎総業株式会社 | Shunt resistance-type current sensor |
-
2003
- 2003-12-24 JP JP2003427577A patent/JP2005188972A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012137980A1 (en) | 2011-04-05 | 2012-10-11 | Yazaki Corporation | Shunt resistance type current sensor |
WO2013041603A1 (en) * | 2011-09-23 | 2013-03-28 | Continental Automotive Gmbh | Device for measuring a battery current |
CN103827674A (en) * | 2011-09-23 | 2014-05-28 | 大陆汽车有限责任公司 | Device for measuring a battery current |
US9360500B2 (en) | 2011-09-23 | 2016-06-07 | Continental Automotive Gmbh | Device for measuring a battery current |
WO2014010410A1 (en) | 2012-07-11 | 2014-01-16 | Yazaki Corporation | Shunt resistance type current sensor |
WO2014046246A1 (en) | 2012-09-21 | 2014-03-27 | 矢崎総業株式会社 | Shunt resistance-type current sensor |
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