JPS6279956A - Fixing method for wafer in semi-conductor manufacturing process - Google Patents

Abstract

PURPOSE:To facilitate the adhesion, leveling, and peeling of a wafer so as to shorten the operating time and reduce the cost of a drug and the like, by attaching wafer on a plate and then fixing the wafer thereon for cooling it under the freezing point so as to make the wafer adhere to the plate. CONSTITUTION:As clean water is attached on the surface of a plate 3 and a wafer 1 is fixed thereon, the water wets both surfaces of the plate 3 and the wafer 1 so as to form uniform water screen therebetween. And, the plate 3 is cooled for freezing the water so as to form ice 5 so that the wafer 1 and the plate 3 are fixed with each other. Then, the water 1 is polished, being cooled by a cooling module 4, and thereafter the ice 5 is fused by the heat of heating wind or the like so that the wafer 1 is peeled from the plate 3. Therefore, the adhesion of the wafer 1 to the plate 3, the levering and adhesion thereof are facilitate so that the operating time can be shortened. Further, drug and the like for the adhesion is not necessary, thereby it is possible to reduce the manufacturing cost.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application e] The present invention relates to a method for fixing a wafer during wafer polishing in a semiconductor manufacturing process.

[Conventional technology]

The conventional method of fixing the wafer during wafer polishing in the semiconductor manufacturing process was to attach wax or organic adhesive (epoxy thread, etc.) to the base plate using sound. Now! 5 inches is the best size.

In recent years, large-diameter devices of 6 inches have been appearing. The thickness thereof is approximately several μ to several nanometers, and therefore, when the adhesive is peeled off, there is a risk of damage due to the thin film.

[Apex while the idea is trying to solve]

Conventional methods of fixing wafers using wax or adhesives require time and effort. That is, WAX.

The preparation of wafer leveling with adhesive requires a lot of attention, and also requires a long working time.

For adhesives, etc., it is essential to use a solvent to remove them after polishing is completed, and the cost of these adhesives, WA, l(, solvent, etc.) must be considered.Removal using the N rule of skin contact requires a long time and effort. 1. Since the sea urchin solvent is used, 1. It is characterized by tampering with the working environment. In particular, after peeling, traces of wax or adhesive present as impurities on the surface of the sea urchin are removed and cleaned. In some cases, it requires a lot of time and effort and is very tedious.

As described above, in order to solve the problems associated with fixing wafers using wax adhesives and the like, it is necessary to reduce the labor involved in attaching wafers, to save labor in the process of peeling off the adhesive, and to shorten cleaning time.

[Means for solving the four points in between] In order to solve the above-mentioned four points, in the present invention, W.
We realized an adhesive method using ice instead of adhesive. That is, after water is deposited on the plate and the wafer is fixed thereon, the plate is cooled to a temperature below freezing to freeze the water and bonded to the wafer. after that.

After finishing the licking of the wafer, the ice is melted by heat or the like and peeled off from the Ueno plate.

[Effect]

The adhesion force due to the above ice adhesion is 10/1 at -10°C.
From d to SOK/d, the adhesive force by WAX (number?/cI/1) or the adhesive force by adhesive (10
~300 m/d) is sufficient for holding the wafer in place during IJ shing operations. The adhesion force of ice is at its maximum at around -10°C, so it is necessary to lower the temperature of the plate and wafer bonding surface to about -10°C.Also, the ice can be melted by heating with hot air, etc., and the wafer can be attached. Peel from the plate (80 catl
& ) and plate and wafer heating (Cu 0.9
call & , Sj 1.8cal/y)CDf
It is necessary to give careful consideration to c. Regarding distortion of the wafer due to IV heating, the coefficient of linear expansion of silicon, which is the material of the wafer, is one order of magnitude smaller than that of metal, so the distortion is small and only 1 d.
There isn't.

[Implementation row]

For the purpose of polishing a semi-4# wafer, the method of fixing the wafer to the seventh plate using the ice layer technique is shown in Figure 1 + 8), (
Shown in bl.

First, clean water 2 is applied to the front surface of the plate 30, and then a wafer is fixed thereon. Water 2 wets both surfaces of plate 3 and cube 1.

A uniform water film is formed between the wafer 1 and the plate 3 (FIG. 1(a)).

Next, the plate 3 is cooled to solidify 2t of water.

Have ice 5 cut into shape. Maintain this temperature at 1-10°C.

Ice 5 sticks wafer 1 and plate 3 together.

Then, the wafer 1 is polished while continuing cooling by the cooling module 4VC (Vfbl).

After polishing, the ice 5 is melted by heating with hot air or the like, and the wafer 11c is peeled off from the plate 3.

In the above embodiment, the cooling module 4t is rod-shaped, but it is preferable to have a structure in which the cooling modules are uniformly arranged on the surface of the plate 30.

A higher cooling effect can be obtained.

〔Effect of the invention〕

The adhesion of 9EVA to the plate by ice contact NVc as described above had a similar effect. 01) It is easy to adhere by ice adhesion.

No leveling is easy.

3) Work time is reduced 1 calm down 1 su list! Western Reijima Mu- 5) The working environment is safe.

6) Easy to peel off by heating with hot air, etc.

No cleaning process is required.

8) No labor required.

[Brief explanation of drawings]

FIGS. 1(a) and 1(b) are schematic diagrams relating to a method of fixing a wafer to a plate by adhering ice as an embodiment of the present invention. 1... Wafer, 2... Water, 3... Plate, 4...
...Cooling module, 5...Ice. Applicant Sub-Agent Patent Attorney Takeshi Suzue (a) 0-25C No. (b) 110°0 1 Figure

Claims (1)

[Claims] In a method of fixing a wafer to a plate for wafer polishing in a semiconductor manufacturing process, a water film is formed between the wafer and the plate, and then the water between the wafer plates is solidified by cooling. A method for fixing a wafer in a semiconductor manufacturing process, characterized by fixing a plate.