JPS6277199A - Backing material for one-side welding - Google Patents
Backing material for one-side weldingInfo
- Publication number
- JPS6277199A JPS6277199A JP21489585A JP21489585A JPS6277199A JP S6277199 A JPS6277199 A JP S6277199A JP 21489585 A JP21489585 A JP 21489585A JP 21489585 A JP21489585 A JP 21489585A JP S6277199 A JPS6277199 A JP S6277199A
- Authority
- JP
- Japan
- Prior art keywords
- backing material
- backing
- copper plate
- melting point
- sided welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Butt Welding And Welding Of Specific Article (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は、片面溶接時に被溶接材裏面に押し当てられ
る裏当材に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a backing material that is pressed against the back surface of a workpiece during single-sided welding.
片面溶接は、第3図に示すように、被溶接材1の裏面に
開先にそってフラックスやグラスファイバーテープ等の
裏当材2を裏当銅板4によって押し当て、溶接電極3と
被溶接材1との間にアークを発生させて、被溶接材1を
溶接するものである。In single-sided welding, as shown in Fig. 3, a backing material 2 such as flux or glass fiber tape is pressed against the back surface of the workpiece 1 along the groove using a backing copper plate 4, and the welding electrode 3 and workpiece are welded together. The material 1 to be welded is welded by generating an arc between the material 1 and the material 1.
上記裏当材2は、溶接中に溶け、スラグとなって裏ビー
ドを保護する役割を果すものである。The backing material 2 melts during welding, becomes slag, and serves to protect the back bead.
しかし、裏当月2が融点の低い材質でできていると、裏
ビードが直接裏当銅板4に当り、これによって、溶接ビ
ード内に銅が混入して、溶接欠陥が生じる。また、この
部分は、裏ピードが溶融したγ当材2によるスラグによ
って保護されないので、ビード外観がきれいにならない
という問題が生じる。However, if the backing plate 2 is made of a material with a low melting point, the backing bead will directly contact the backing copper plate 4, which will cause copper to get mixed into the weld bead and cause welding defects. Further, since this portion is not protected by the slag caused by the γ contact material 2 in which the back bead is melted, a problem arises in that the bead appearance is not clear.
また、最近、被溶接材1と裏当銅板4との間に生じる電
圧が、裏ビード形状に関係することが判明したことから
、前記電圧を検出する盛装があるが、従来の裏当材2で
は、溶融金属が裏当銅板に直接接触し、このために前記
電圧を検出できないという問題があった。In addition, it has recently been found that the voltage generated between the material to be welded 1 and the backing copper plate 4 is related to the shape of the backing bead. However, there was a problem in that the molten metal directly contacted the backing copper plate, and therefore the voltage could not be detected.
従って、この発明の目的は、良好な裏ビードを形成でき
ることは勿論、裏ピードが直接裏当銅板に当ることが防
止できる裏当材を提供することにある。Therefore, an object of the present invention is to provide a backing material that can not only form a good back bead but also prevent the back bead from directly contacting the backing copper plate.
片面溶接時、被溶接材の裏面に開先にそい裏当銅板によ
って押し当てられる、無機質の裏当材において、前記裏
当材を少なくとも2層とし、下層の真当材は、上層の裏
当材より融点の高い材質としたことに特徴を有するもの
である。During single-sided welding, an inorganic backing material is pressed against the back surface of the material to be welded by a backing copper plate along the groove, and the backing material has at least two layers, and the lower layer of the backing material is the same as the upper layer of the backing material. It is characterized by being made of a material that has a higher melting point than the other materials.
次に、この発明の一実施態様を図面を参照しながら説明
する。Next, one embodiment of the present invention will be described with reference to the drawings.
第1図は、この発明の一実施態様の真当材を用いて片面
溶接を行なっている状態を示す断面図である。FIG. 1 is a cross-sectional view showing a state in which one-sided welding is performed using a true member according to an embodiment of the present invention.
第1図に示すように、この発明の一実施態様の裏当材5
は、2層になっており、被溶接材1の裏面に開先にそっ
て直接押し当てられる上層テープ5Aと、上層テープ5
Aの下面に貼り合わされた下層テープ5Bと、からなっ
ている。As shown in FIG. 1, a backing material 5 according to an embodiment of the present invention
has two layers: an upper layer tape 5A that is directly pressed against the back surface of the workpiece 1 along the groove, and an upper layer tape 5
It consists of a lower layer tape 5B bonded to the lower surface of A.
上層テープ5Aは、900℃以下の低融点のグラスファ
イバーテープによってできている。そして、下層テープ
5Bは、1200℃以上の高融点のグラスファイバーテ
ープによってできている。The upper layer tape 5A is made of glass fiber tape with a low melting point of 900° C. or lower. The lower layer tape 5B is made of a glass fiber tape having a high melting point of 1200° C. or higher.
このように、裏当材5を低融点のテープと高融点のテー
プとの2層にして片面溶接を行なうと、被溶接材1の裏
面に直接押し当てられている低融点の上層テープ5Aは
、すぐに溶けてスラグを形成し、高融点の下層テープ5
Bは、はとんど溶融しないので、裏ビードが直接裏当銅
板4に当たることは無く、この結果、裏ビードはきれい
な外観当銅板4との間に生じる電圧と溶接電流との関係
を示すが、第2図から明らかなように、この発明の裏当
材を用いた場合には、従来の裏当材を用いた場合に比べ
て電圧の変化が顕著に現われている。In this way, when single-sided welding is performed with the backing material 5 made of two layers, a low melting point tape and a high melting point tape, the low melting point upper layer tape 5A that is directly pressed against the back surface of the welded material 1 , melts quickly to form a slag, high melting point lower layer tape 5
In B, since the back bead hardly ever melts, the back bead does not come into direct contact with the backing copper plate 4, and as a result, the back bead has a clean appearance. As is clear from FIG. 2, when the backing material of the present invention is used, the voltage changes more significantly than when the conventional backing material is used.
従って、被溶接材1と裏当銅板4との間に生じる電圧を
用いて、溶接電流を溶易に制御できるので、裏ビード幅
の自動制御がより容易に行なえる。なお、裏当材5の材
質は、グラスファイバーテープ以外に、粒状または固形
フラックスでも良く、また、裏当材5は少なくとも2層
とするが、少なくとも最下層の裏当材が、グラスファイ
バーテープまたは固形フラックスであれば良い。Therefore, the welding current can be easily controlled using the voltage generated between the material to be welded 1 and the backing copper plate 4, so that the back bead width can be automatically controlled more easily. The backing material 5 may be made of granular or solid flux in addition to glass fiber tape, and the backing material 5 should have at least two layers, but at least the bottom layer of the backing material may be glass fiber tape or solid flux. Any solid flux is fine.
以上説明したように、この発明によれば、良好な裏ビー
ドを形成できることは勿論、裏ピードが裏当銅板に直接
当ることが防止でき、且つ、被溶接材と裏当銅板との間
に生じる電圧を安定して検出することができるといった
きわめて有用な効果がもたらされる。As explained above, according to the present invention, it is possible not only to form a good back bead, but also to prevent the back bead from directly hitting the backing copper plate, and to prevent the back bead from directly hitting the backing copper plate. This brings about the extremely useful effect of being able to stably detect voltage.
第1図は、この発明の一実施態様の裏当材を用いて片面
溶接を行なっている状態を示す断面図、第2図は、検出
電圧と溶接電流との関係を示すグラフ、第3図は、従来
の裏当材を用いて片面溶接を行なっている状態を示す断
面図である。図面において、
1・・・被溶接材、 2・・・裏当材、3・・・溶
接電極、 4・・・裏当銅板、5・・・裏当材、
5A・・・上層テープ、5B・・・下層テープ。FIG. 1 is a sectional view showing a state in which one-sided welding is performed using a backing material according to an embodiment of the present invention, FIG. 2 is a graph showing the relationship between detected voltage and welding current, and FIG. 3 is a graph showing the relationship between detected voltage and welding current. FIG. 2 is a cross-sectional view showing a state in which one-sided welding is performed using a conventional backing material. In the drawings, 1... Material to be welded, 2... Backing material, 3... Welding electrode, 4... Backing copper plate, 5... Backing material,
5A... Upper layer tape, 5B... Lower layer tape.
Claims (5)
銅板によつて押し当てられる、無機質の裏当材において
、 前記裏当材を少なくとも2層とし、下層の裏当材は、上
層の裏当材より融点の高い材質としたことを特徴とする
片面溶接用裏当材。(1) In an inorganic backing material that is pressed against the back side of the workpiece by a backing copper plate along the groove during single-sided welding, the backing material is made of at least two layers, and the backing material of the lower layer is is a backing material for single-sided welding characterized by being made of a material with a higher melting point than the upper layer backing material.
ことを特徴とする特許請求の範囲第(1)項記載の片面
溶接用裏当材。(2) The backing material for single-sided welding according to claim 1, wherein the backing material is granular or solid flux.
とを特徴とする特許請求の範囲第(1)項記載の片面溶
接用裏当材。(3) The backing material for single-sided welding according to claim (1), wherein the backing material is a glass fiber tape.
であることを特徴とする特許請求の範囲第(1)項記載
の片面溶接用裏当材。(4) The backing material for single-sided welding according to claim 1, wherein the bottom layer of the backing material is solid flux.
ーテープであることを特徴とする特許請求の範囲第(1
)項記載の片面溶接用裏当材。(5) Claim No. 1 (1) characterized in that the lowermost backing material of the backing material is a glass fiber tape.
) Backing material for single-sided welding as described in item.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21489585A JPS6277199A (en) | 1985-09-30 | 1985-09-30 | Backing material for one-side welding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21489585A JPS6277199A (en) | 1985-09-30 | 1985-09-30 | Backing material for one-side welding |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6277199A true JPS6277199A (en) | 1987-04-09 |
JPH0411316B2 JPH0411316B2 (en) | 1992-02-28 |
Family
ID=16663340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21489585A Granted JPS6277199A (en) | 1985-09-30 | 1985-09-30 | Backing material for one-side welding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6277199A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5395142A (en) * | 1992-05-07 | 1995-03-07 | Hmc H. Meyer & Co. Spezialstahl Gmbh | Welding joint and backing sleeve therefore |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4831929U (en) * | 1971-08-18 | 1973-04-18 | ||
JPS51141745A (en) * | 1975-06-02 | 1976-12-06 | Nippon Steel Corp | Method of fluxxcopper bucking single arc welding |
JPS5433225A (en) * | 1977-08-20 | 1979-03-10 | Mitsui Mining & Smelting Co | Stock apparatus for distributing ingot |
-
1985
- 1985-09-30 JP JP21489585A patent/JPS6277199A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4831929U (en) * | 1971-08-18 | 1973-04-18 | ||
JPS51141745A (en) * | 1975-06-02 | 1976-12-06 | Nippon Steel Corp | Method of fluxxcopper bucking single arc welding |
JPS5433225A (en) * | 1977-08-20 | 1979-03-10 | Mitsui Mining & Smelting Co | Stock apparatus for distributing ingot |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5395142A (en) * | 1992-05-07 | 1995-03-07 | Hmc H. Meyer & Co. Spezialstahl Gmbh | Welding joint and backing sleeve therefore |
Also Published As
Publication number | Publication date |
---|---|
JPH0411316B2 (en) | 1992-02-28 |
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