JPS627696A - Method and apparatus for liquid-phase epitaxial growth - Google Patents

Method and apparatus for liquid-phase epitaxial growth

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Publication number
JPS627696A
JPS627696A JP14579785A JP14579785A JPS627696A JP S627696 A JPS627696 A JP S627696A JP 14579785 A JP14579785 A JP 14579785A JP 14579785 A JP14579785 A JP 14579785A JP S627696 A JPS627696 A JP S627696A
Authority
JP
Japan
Prior art keywords
mixed crystal
growth
solution
reservoir
soln
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14579785A
Other languages
Japanese (ja)
Other versions
JPH0481550B2 (en
Inventor
Tsunehiro Unno
恒弘 海野
Mineo Wajima
峰生 和島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP14579785A priority Critical patent/JPS627696A/en
Publication of JPS627696A publication Critical patent/JPS627696A/en
Publication of JPH0481550B2 publication Critical patent/JPH0481550B2/ja
Granted legal-status Critical Current

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  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

PURPOSE:To efficiently grow a crystal having an optional mixed crystal ratio by moving the liq. level of a soln. for growth up and down, repeating contact and noncontact of the level with a substrate vertically held above the level and supplying a soln. for a mixed crystal to a soln. reservoir. CONSTITUTION:In a liq. phase epitaxial growth device, a soln. 2 is repeatedly brought into contact and noncontact with a substrate 6 vertically held above the reservoir 3 of a soln. for growth by reciprocating a piston 4 to move the level of the soln. 2 for growth up and down. Meanwhile, a slider 10 provided with a soln. reservoir 11 for transfer is arranged to the rear above a soln.-contg. part 1 and the slider is reciprocated requisite times to add the required amt. of a soln. 7 for growth in a reservoir 8 of a soln. for a mixed crystal into the soln. 2 for growth through the soln. reservoir 11. When contact and noncontact of the soln. 2 with the substrate 6 are repeated, an optional amt. of the soln. 7 for a mixed crystal is supplied and a mixed crystal epitaxial layer having a mixed crystal ratio in the optional direction is grown in the liq. phase.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、混晶エピタキシャル層を形成する液相エピタ
キシャル成長方法及びその装置に係り、特に基板上に成
長する結晶の厚さ方向の混晶比を任意に制御する方法及
びその装置に関するもので、例えば厚さが50μm以上
の混晶エピタキシャル層を有するウェハの生産に適用す
れば重度性において浸れたものとなる。
Detailed Description of the Invention [Industrial Application Field] The present invention relates to a liquid phase epitaxial growth method and apparatus for forming a mixed crystal epitaxial layer, and in particular to a method for forming a mixed crystal epitaxial layer, and particularly to a method for controlling the mixed crystal ratio in the thickness direction of crystals grown on a substrate. This invention relates to a method and an apparatus for arbitrarily controlling the above-mentioned conditions, and if applied to the production of wafers having a mixed crystal epitaxial layer with a thickness of 50 μm or more, for example, it would be extremely serious.

[従来の技術] 例えば、GaAfAsなどの混晶エピタキシャル層を厚
く成長させた場合には、ガリウム中のアルミニウムの偏
析係数が大きすぎて、厚さ方向で混晶比の均一なエピタ
キシャル層を冑るのは非常に難しい。したがって、一般
的な横型炉方式の液相成長法によって 100μm程度
の厚さになるまで成長させたときに、エピタキシャル結
晶と基板の界面でアルミ混晶比が0.6程度あったとし
ても、エピタキシセル層の表面はほとんどゼロになって
しまう。
[Prior Art] For example, when a mixed crystal epitaxial layer such as GaAfAs is grown thickly, the segregation coefficient of aluminum in gallium is too large, making it difficult to form an epitaxial layer with a uniform mixed crystal ratio in the thickness direction. It's very difficult. Therefore, when grown to a thickness of about 100 μm using a general horizontal furnace liquid phase growth method, even if the aluminum alloy ratio is about 0.6 at the interface between the epitaxial crystal and the substrate, the epitaxial The surface of the cell layer becomes almost zero.

そこで、従来、このようなことがないように、温度勾配
を利用してアルミニウムを成長用溶液中に均一に拡散さ
せる特殊な成長方法が採用された。
Therefore, in order to avoid this problem, a special growth method has been adopted in which a temperature gradient is used to uniformly diffuse aluminum into a growth solution.

即ち、この方法は、昇温後成長用溶液の上方に、混入し
たアルミニウムが溜まる傾向にあることから、成長用溶
液溜め内の成長用溶液にその上下方向に温度勾配を持た
せ、冷却の下げ幅を上方で太き(下方で小さくするよう
にしてアルミ混晶比を厚さ方向で均一にしている 装置面では上述した温度勾配を持たせるために、成長用
溶液溜めの外周に縦方向に加熱ヒータを設けて、この加
熱ヒータに流れる電流を制御している。
In other words, in this method, since mixed aluminum tends to accumulate above the growth solution after the temperature is raised, the growth solution in the growth solution reservoir has a temperature gradient in the vertical direction, and cooling is reduced. The width is thicker at the top and smaller at the bottom to make the aluminum mixed crystal ratio uniform in the thickness direction.In order to create the above-mentioned temperature gradient, there is a A heater is provided and the current flowing through the heater is controlled.

[発明が解決しようとする問題点] ところが、成長方法が特殊であるため作業性が悪く、し
かも基板を水平にして溶液と接触さけるので、1度に扱
うことができる基板枚数が極端に少なくなり、ウェハの
大型化が難しり、量産性に劣っていた。
[Problems to be solved by the invention] However, since the growth method is special, workability is poor, and since the substrates are kept horizontal to avoid contact with the solution, the number of substrates that can be handled at one time is extremely small. However, it was difficult to increase the size of the wafer, and mass productivity was poor.

また加熱ヒータの電流制御によって所望の温度勾配を形
成するのが難しかった。
Furthermore, it was difficult to form a desired temperature gradient by controlling the current of the heater.

[発明の目的] 本発明の目的は、前述した従来技術の問題点を解消し、
偏析が問題となり混晶比の制御が難しい混晶エピタキシ
ャル層における厚さ方向の混晶比を同一のみならず任意
に制御することが可能で、しかもウェハの大型化や量産
化が容易な液相エピタキシセル成長方法及びその装置を
提供することである。
[Object of the invention] The object of the present invention is to solve the problems of the prior art described above,
In a mixed crystal epitaxial layer where segregation is a problem and the mixed crystal ratio is difficult to control, it is possible to control the mixed crystal ratio in the thickness direction not only at the same level but also at any desired level, and in addition, it is easy to increase the size of wafers and mass production. An object of the present invention is to provide an epitaxy cell growth method and apparatus.

[発明の概要] 上記目的に沿う第1の発明の液相エピタキシャル成長方
法は、実施例に対応する第1図に示すように、成長用溶
液溜め3の上方に成長用溶液2と非接触状態で予め起立
保持されている基板6に対して、成長用溶液溜め3の中
の成長用溶液2の液位を昇降移動させ、基板6と溶液2
との接触・非接触を繰り返す。
[Summary of the Invention] The liquid phase epitaxial growth method of the first invention which meets the above object is as shown in FIG. The liquid level of the growth solution 2 in the growth solution reservoir 3 is moved up and down with respect to the substrate 6 which is held upright in advance, and the substrate 6 and the solution 2 are moved up and down.
Repeated contact and non-contact.

この繰り返しの際、すなわち液位を下降させて基板6と
溶液が非接触状態にあるとき、混晶用溶液溜め8から任
意量の混晶用溶液7を成長用溶液溜めに供給して成長用
溶液に添加する。これによって、基板6上に成長する結
晶の厚さ方向の混晶比が任意の値に制御される。
During this repetition, that is, when the liquid level is lowered and the substrate 6 and the solution are in a non-contact state, an arbitrary amount of the mixed crystal solution 7 is supplied from the mixed crystal solution reservoir 8 to the growth solution reservoir. Add to solution. Thereby, the mixed crystal ratio in the thickness direction of the crystal grown on the substrate 6 is controlled to an arbitrary value.

また、上記目的に沿う第2の発明の液相エピタキシャル
成長装置は、第1の発明方法を実施するための装置であ
って複数の基板6を内部に起立保持する中空の基板ホル
ダ部5と、ホルダ部の下部にホルダ部内部と連通ずるよ
うに取り付けられ成長用溶液を収容する成長用溶液溜め
3を備えている。この成長用溶液溜め3には液位昇降手
段40が設けられて、成長用溶液溜め3内の成長用溶液
2の液位を、基板6と接触したり、その接触を断ったり
するように昇降させる。
Further, a liquid phase epitaxial growth apparatus according to a second invention in accordance with the above object is an apparatus for carrying out the method of the first invention, and includes a hollow substrate holder part 5 that holds a plurality of substrates 6 upright therein, and a holder. A growth solution reservoir 3 is installed at the lower part of the holder so as to communicate with the inside of the holder and accommodates a growth solution. This growth solution reservoir 3 is provided with a liquid level raising/lowering means 40, which raises and lowers the liquid level of the growth solution 2 in the growth solution reservoir 3 so as to bring it into contact with the substrate 6 or break the contact. let

一方、成長用溶液溜め3の上部には混晶用溶液7を収容
する混晶用溶液溜め8が設けられ、この混晶用溶液溜め
底部にスライダ10がスライド自在に設けられている。
On the other hand, a mixed crystal solution reservoir 8 containing a mixed crystal solution 7 is provided above the growth solution reservoir 3, and a slider 10 is slidably provided at the bottom of this mixed crystal solution reservoir.

そして、このスライダ1゜には貫通して形成された移送
用溶液溜め11が設けられてスライダ10を一方向にス
ライドすると混晶用溶液溜め8と連通して混晶用溶液7
を一定量収容し、逆方向にスライドすると成長用溶液溜
め3と連通して収容した一定量の混晶用溶液7を成長用
溶液溜め3に落下させる。
This slider 1° is provided with a transfer solution reservoir 11 formed through it, and when the slider 10 is slid in one direction, it communicates with the mixed crystal solution reservoir 8 and the mixed crystal solution 7 is transferred.
A certain amount of mixed crystal solution 7 is accommodated therein, and when it slides in the opposite direction, it communicates with the growth solution reservoir 3 and drops a certain amount of the accommodated mixed crystal solution 7 into the growth solution reservoir 3 .

基板6を起立してセットすることにより、水平にセット
する場合と異なり、多数枚の基板がセットできるように
なる。また、反応炉を昇温後、成長用溶液2の液位を上
昇させて基板6と成長用溶液2の接触状態を保持しつつ
徐冷していくと、各基板6上に同時にエピタキシャル層
が成長する。
By setting the board 6 in an upright position, a large number of boards can be set, unlike the case where the board 6 is set horizontally. Furthermore, after raising the temperature of the reactor, the liquid level of the growth solution 2 is raised and the growth solution 2 is slowly cooled while maintaining the contact state between the substrate 6 and the growth solution 2, thereby forming an epitaxial layer on each substrate 6 at the same time. grow up.

逆に成長用溶液2の液位を下降させると、基板6との接
触状態が断たれてエピタキシャル層成長が終了する。成
長終了後また昇温して上記工程を繰り返すことにより、
順次厚いエピタキシャル層が基板上に得られる。このよ
うに、成長用溶液の液位の昇降を繰り返すことによりエ
ピタキシャル層を成長させるのであり、液位の上昇量を
増加するに伴なってより広い面積の基板との接触が確保
される。そして、エピタキシャル成長を完了した基板は
新しい基板と交換されるが、成長用溶液は成長用溶液溜
めに自重によって戻るので、交換や移し替えの必要はな
い。
Conversely, when the liquid level of the growth solution 2 is lowered, the contact with the substrate 6 is broken and epitaxial layer growth is completed. By raising the temperature again after growth and repeating the above steps,
Successively thicker epitaxial layers are obtained on the substrate. In this way, the epitaxial layer is grown by repeatedly raising and lowering the liquid level of the growth solution, and as the amount of rise in the liquid level increases, a wider area of contact with the substrate is ensured. Then, the substrate on which epitaxial growth has been completed is replaced with a new substrate, but since the growth solution returns to the growth solution reservoir under its own weight, there is no need for replacement or transfer.

ところで、成長用溶液2の液位が降下して成長用溶液溜
め3に戻っているときに、スライダ10を1往復スライ
ドすると一定量の混晶用溶液が成長用溶液に添加される
。これを繰り返すことにより任意量の混晶用溶液が補給
される。この任意量の混晶用溶液の補給によって基板上
に成長するエピタキシャル層の厚さ方向の混晶比が任意
に制御される。
By the way, when the slider 10 is slid back and forth once while the liquid level of the growth solution 2 is falling and returning to the growth solution reservoir 3, a certain amount of the mixed crystal solution is added to the growth solution. By repeating this, an arbitrary amount of the mixed crystal solution is replenished. By replenishing an arbitrary amount of the mixed crystal solution, the mixed crystal ratio in the thickness direction of the epitaxial layer grown on the substrate can be arbitrarily controlled.

本発明は、GaAlAsなどのIII−V族化合物半導
体、あるいは■−■族化合物半導体の混晶エピタキシャ
ルウェハの成長すべてに適用できる。
The present invention is applicable to all types of growth of mixed crystal epitaxial wafers of III-V group compound semiconductors such as GaAlAs or ■-■ group compound semiconductors.

[実施例] 本発明の実施例を第1図〜第2図に基づいて説明すれば
以下の通りである。
[Example] An example of the present invention will be described below based on FIGS. 1 and 2.

第1図は本発明方法を実施するための液相エピタキシャ
ル装置の一実施例を示す。
FIG. 1 shows an embodiment of a liquid phase epitaxial apparatus for carrying out the method of the invention.

1は成長用溶液2を収容する、上部に開口した成長用溶
液溜め3を形成した溶液収容部である。
Reference numeral 1 denotes a solution storage part in which a growth solution reservoir 3 having an opening at the top is formed to contain a growth solution 2 .

この溶液収容部1には液位昇降手段としてのピストン4
が設けられる。このピストン4は溶液収容部1の一側か
ら成長用溶液溜め3に横方向に形成した挿通孔に挿通さ
れて、その先端を成長用溶液溜め3内に出没させること
により成長用溶液2の液位を昇降動させるようになって
いる。
This solution storage section 1 has a piston 4 as a means for raising and lowering the liquid level.
is provided. This piston 4 is inserted from one side of the solution storage part 1 into an insertion hole formed in the growth solution reservoir 3 in the horizontal direction, and the tip of the piston 4 is inserted into and out of the growth solution reservoir 3 so that the growth solution 2 can be removed. It is designed to move up and down.

このようなピストン4を出没自在に設けた溶液収容部1
の上部前方(ピストン4の押し出し方向側)に、上下が
開口して、その下部が成長用溶液溜り2と連通ずる中空
の基板ホルダ部5が取り付けられ、その基板ホルダ部5
内には複数の基板6を、例えば互いに向い合った配置で
起立保持できるようになっている。したがって、ピスト
ン4を押し出すと、押し上げられた成長用溶液2は基板
ホルダ部5内に侵入して基板6と接触し、逆にピストン
4を没入すると、成長用溶液2の液位が降下して基板6
との接触が断たれるようになっている。
A solution storage part 1 in which such a piston 4 is provided so as to be freely retractable
A hollow substrate holder part 5 which is open at the top and bottom and whose lower part communicates with the growth solution reservoir 2 is attached to the front of the upper part (on the extrusion direction side of the piston 4).
Inside, a plurality of substrates 6 can be held upright, for example, facing each other. Therefore, when the piston 4 is pushed out, the pushed-up growth solution 2 enters the substrate holder part 5 and comes into contact with the substrate 6, and when the piston 4 is pushed back, the liquid level of the growth solution 2 falls. Board 6
Contact with the government has been cut off.

また、溶液収容部1の上部後方に混晶用溶液7を収容す
る混晶用溶液溜め8が取り付けられる。
Further, a mixed crystal solution reservoir 8 for containing a mixed crystal solution 7 is attached to the upper rear part of the solution storage section 1 .

この混晶用溶液溜め8の底部は開口しており、この開口
底部には、これに沿って横方向に形成した挿通孔9が設
(ブられ、この挿通孔を介して混晶用溶液溜め8と成長
用溶液溜め3とが連通している。
The bottom of this mixed crystal solution reservoir 8 is open, and an insertion hole 9 formed laterally along the opening is provided at the bottom of the opening. 8 and the growth solution reservoir 3 are in communication.

挿通孔9には混晶用溶液溜め8の開口底部と挿通孔を閉
塞するスライダ10がピストン4と同じ方向にスライド
自在に挿通されている。
A slider 10 that closes the opening bottom of the mixed crystal solution reservoir 8 and the insertion hole is inserted into the insertion hole 9 so as to be slidable in the same direction as the piston 4.

このスライダ10の途中には、これを縦方向に貫通する
一定容積の移送用溶液溜め11が形成され、スライダ1
1を引き方向にスライドすると混晶用溶液溜め8と連通
して混晶用溶液7を一定量収容し、押し出し方向にスラ
イダ10をスライドすると成長用溶液溜め3と連通して
収容した一定層の混晶用溶液7を成長用溶液溜め3に落
下させるようになっている。
In the middle of this slider 10, a solution reservoir 11 for transfer having a constant volume is formed that passes through the slider 10 in the vertical direction.
When the slider 10 is slid in the pulling direction, it communicates with the mixed crystal solution reservoir 8 to accommodate a certain amount of the mixed crystal solution 7, and when the slider 10 is slid in the extrusion direction, it communicates with the growth solution reservoir 3 to accommodate a fixed amount of the mixed crystal solution 7. The mixed crystal solution 7 is dropped into the growth solution reservoir 3.

本実施例では、上記スライダ用の挿通孔9や混晶用溶液
溜め8は、基板ホルダ部5の一側の肉厚部に一体形成し
た例を示しているが、別体でもよく、また基板ホルダ部
5は溶液収容部1に一体的に取り付けても、あるいは着
脱自在に取り付けてもよい。
In this embodiment, the insertion hole 9 for the slider and the solution reservoir 8 for the mixed crystal are integrally formed in the thick part on one side of the substrate holder part 5, but they may be formed separately or The holder portion 5 may be attached integrally to the solution storage portion 1 or may be detachably attached.

そして上記した成長装置の作業順序をQaΔ2Asエピ
タキシャル成長方法に適用した具体例について述べる。
A specific example will be described in which the above-described operating order of the growth apparatus is applied to the QaΔ2As epitaxial growth method.

予め、基板ホルダ部5に2インチウェハを向かい合った
配置で30枚セットし、成長用溶液溜め3にはQal、
500gとGaAs60gを、混晶用溶液溜め8にはQ
 a50gとAI!5aをそれぞれセットしておき、こ
ようにセットした本成長装置を横型反応管(図示せず)
に挿入して内部をH2ガスと置換する。
In advance, 30 2-inch wafers were set in the substrate holder part 5 in a facing arrangement, and the growth solution reservoir 3 was filled with Qal,
500g and 60g of GaAs, and Q in the mixed crystal solution reservoir 8.
a50g and AI! 5a, and put the growth apparatus set in this way into a horizontal reaction tube (not shown).
and replace the inside with H2 gas.

]12ガスと置換後、最初に反応炉を800℃の成長開
始温度まで貸温し、昇温後スライダ10を10回往復さ
せてAρの溶けたGa溶液を成長用溶液溜め3内に落下
させる。本実施例では1回の往復でA I! 120m
gとGa1,2aの溶液が落下する。落下したAβの溶
けたGa溶液は成長用溶液中に拡散する。落下侵、ピス
トン4を押し出してGaASの成長用溶液を押し上げ、
基板6と接触させる。
] After replacing the gas with 12 gases, first heat the reactor to the growth starting temperature of 800°C, and after raising the temperature, move the slider 10 back and forth 10 times to drop the Ga solution containing Aρ into the growth solution reservoir 3. . In this embodiment, AI! is completed in one round trip. 120m
The solution of g and Ga1,2a falls. The fallen Aβ-dissolved Ga solution diffuses into the growth solution. Drop erosion, push out the piston 4 to push up the GaAS growth solution,
It is brought into contact with the substrate 6.

接触後5分したら徐冷を開始し結晶成長を行なう。Five minutes after contact, slow cooling is started and crystal growth is performed.

30分間接触させた後、ピストン4を没入させると押し
上げられた成長用溶液は降下して成長用溶液溜め3に自
重で戻り、成長は停止する。
After 30 minutes of contact, when the piston 4 is immersed, the pushed-up growth solution descends and returns to the growth solution reservoir 3 under its own weight, and growth stops.

次に、炉を再度800℃まで昇温する。このときに、ま
たスライダ10を往復動させて上記したのと等量となる
ように不足分のA(の溶けたGa溶液を成長用溶液に補
給する。昇温後20分したら直ちにピストン4を押し出
して成長用溶液と基板6とを接触させる。このとき、炉
がまだ安定していないため基板表面が多少メルトバック
される傾向がある。接触後5分したら徐冷を開始し再度
成長を行なう。
Next, the temperature of the furnace is raised to 800°C again. At this time, the slider 10 is reciprocated again to replenish the growth solution with the insufficient amount of A (dissolved Ga solution) so as to have the same amount as described above. Immediately after 20 minutes after raising the temperature, the piston 4 is The growth solution is extruded and brought into contact with the substrate 6. At this time, since the furnace is not yet stable, the surface of the substrate tends to melt back to some extent. 5 minutes after contact, slow cooling is started and growth is performed again. .

以上の工程を繰り返すことにより、序膜のGaAffi
Asエピタキシせルウエバを得ることができる。本実施
例では昇温工程を20回繰り返すことにより、厚さ15
0μm1表面混晶比0.25で厚さ方向に均一性の極め
て良好なGaAβAs混晶エピタキシャル層を成長させ
ることができた。
By repeating the above steps, the GaAffi
An As epitaxial selvedge web can be obtained. In this example, by repeating the temperature raising process 20 times, the thickness was 15 mm.
It was possible to grow a GaAβAs mixed crystal epitaxial layer with extremely good uniformity in the thickness direction at a surface mixed crystal ratio of 0 μm and 0.25.

このように、本実施例によれば1度に2インチサイズで
30枚程度の厚さ50μm以上の混晶エピタキシャル成
長が可能であり、このようなウェハの大型化と量産化を
達成することができるのは、基板を起立してセットする
と共に成長用溶液の液位の昇降を繰り返すことにより、
エピタキシャル層の厚さを増加させるようにしたからで
あり、また、厚さ方向の混晶比を均一化させることがで
きるのは、成長用溶液が溶液溜めに戻っているときに、
混晶用溶液の不足分を補給することによって混晶比を調
整しているからである。
As described above, according to this embodiment, it is possible to grow mixed crystal epitaxially on about 30 2-inch wafers with a thickness of 50 μm or more at a time, and it is possible to increase the size and mass production of such wafers. By setting the substrate upright and repeatedly raising and lowering the level of the growth solution,
This is because the thickness of the epitaxial layer is increased, and the mixed crystal ratio in the thickness direction can be made uniform when the growth solution is returned to the solution reservoir.
This is because the mixed crystal ratio is adjusted by replenishing the insufficient amount of the mixed crystal solution.

なお、上記実施例においては、混晶比が厚さ方向で均一
なエピタキシャルウェハの場合について述べたが、混晶
用溶液の添加量により、第2図に示すように、混晶比が
厚さ方向で増加したり、あるいは減少したり、更には2
段ステップになったり等、いろいろな種類のプロファイ
ルをもったエピタキシャル層の成長が可能である。また
数μmの付近の薄い厚さであれば、急激に混晶比が増加
するエピタキシャル層の成長も可能である。
In the above example, the epitaxial wafer has a uniform mixed crystal ratio in the thickness direction, but depending on the amount of the mixed crystal solution added, the mixed crystal ratio varies depending on the thickness as shown in increase or decrease in the direction, or even 2
It is possible to grow epitaxial layers with various types of profiles, such as stepwise. Furthermore, if the thickness is as small as several micrometers, it is possible to grow an epitaxial layer in which the mixed crystal ratio increases rapidly.

更に、A″ββ以外析係数の大ぎなドーパントを入れて
も、厚さ方向でキャリア濃度が均一なJl膜エピタキシ
ャル層の成長が可能となる。
Furthermore, even if a dopant having a large analytical coefficient other than A″ββ is added, it is possible to grow a Jl film epitaxial layer with a uniform carrier concentration in the thickness direction.

[発明の効果1 以上要するに本発明によれば次のような優れた効果を発
揮する。
[Effects of the Invention 1 In summary, the present invention exhibits the following excellent effects.

(1)  成長用溶液に温度勾配を持たせる必要もなく
、成長用旧位の液位の昇降と混晶用溶液の補給との繰り
返しにより、任意の厚さで任意の混晶比のエピタキシャ
ル層を基板上に成長させることができる。また、基板を
起立させたことにより1回に扱える枚数は任意であり、
同時に多数の基板をセットすることが可能で、しかも原
料溶液が基板の下方に戻るため、基板を交換するだけで
原nwJ液は交換も移し換えも不要で何度でもそのまま
使用できるので、従来の方法に比べて作業性もよく、ウ
ェハの大型化が可能で量産向きとなる。
(1) There is no need to create a temperature gradient in the growth solution, and by repeatedly raising and lowering the liquid level at the growth stage and replenishing the mixed crystal solution, an epitaxial layer can be formed with any thickness and any mixed crystal ratio. can be grown on the substrate. In addition, by standing up the board, the number of boards that can be handled at one time is arbitrary.
It is possible to set a large number of substrates at the same time, and since the raw material solution returns to the bottom of the substrate, just by replacing the substrate, the raw NWJ solution can be used as many times as it is without the need for replacement or transfer. Compared to other methods, this method has better workability and allows for larger wafers, making it suitable for mass production.

(2)  一定量の混晶用溶液を成長用溶液溜めに落下
させるには、混晶用溶液溜め内にピストンを押し出し、
この押し出しによる混晶用溶液溜め上部からの溢流液を
利用してもよいが、前述した本発明装置を使用し、移送
用溶液溜め付きスライダを往v1紡させるようにすれば
、スト0−りの調節をすることなく、所定aの混晶用溶
液を補給できるようになって、作業は一層容易で供給落
下員の秤mgi度を上げることができる。また、m 1
11勾配用の加熱ヒータも不要で、その電流$り罪も行
なう必要がなく、i$114iな機械的構成のみから成
ついるので、従来の装置に比して耐久性、操作性が良い
(2) To drop a certain amount of mixed crystal solution into the growth solution reservoir, push the piston into the mixed crystal solution reservoir,
The overflowing liquid from the upper part of the mixed crystal solution reservoir due to this extrusion may be used, but if the device of the present invention described above is used and the slider with the transfer solution reservoir is made to spin once and for all, it is possible to Since it is now possible to replenish a predetermined amount of mixed crystal solution without adjusting the amount, the work becomes easier and the scale mgi of the supply dropper can be increased. Also, m 1
There is no need for a heater for the 11 gradient, there is no need to control the current, and since it consists only of an inexpensive mechanical structure, it has better durability and operability than conventional devices.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明に係る液相エピタキシャル成長装置の一
実施例を示す縦断面図、第2図は本発明を実施した場合
に可能な混晶比の厚さ方向のプロファイルを示す線図で
ある。 図中、2は成長用溶液、3は成長用溶液溜め、4はピス
トン、5は基板ホルダ部、6は基板、7は混晶用溶液、
8は混晶用溶液溜め、10はスライダ、11は移送用溶
液溜め、40は液位昇降手段である。 特許出願人    日立電線株式会社 代理人弁理士   絹  谷  信  雄第1図 は) 第 1? 、f f山 (b)“ a図
FIG. 1 is a longitudinal cross-sectional view showing an embodiment of a liquid phase epitaxial growth apparatus according to the present invention, and FIG. 2 is a diagram showing a possible profile of the mixed crystal ratio in the thickness direction when the present invention is implemented. . In the figure, 2 is a growth solution, 3 is a growth solution reservoir, 4 is a piston, 5 is a substrate holder part, 6 is a substrate, 7 is a mixed crystal solution,
8 is a mixed crystal solution reservoir, 10 is a slider, 11 is a solution reservoir for transfer, and 40 is a liquid level raising/lowering means. Patent Applicant Hitachi Cable Co., Ltd. Representative Patent Attorney Nobuo Kinutani Figure 1) 1? , f f mountain (b) "a figure

Claims (2)

【特許請求の範囲】[Claims] (1)成長用溶液溜めの上方に成長用溶液と非接触状態
で起立保持されている基板に対し、成長用溶液の液位を
昇降移動させて基板との接触・非接触を繰り返し、この
繰り返しの際に混晶用溶液溜めから任意量の混晶溶液を
成長用溶液溜めに供給することにより、基板上に成長す
る結晶の厚さ方向の混晶比を任意に制御することを特徴
とする液相エピタキシャル成長方法。
(1) The substrate is held upright above the growth solution reservoir in a non-contact state with the growth solution, and the liquid level of the growth solution is moved up and down to repeatedly make contact and non-contact with the substrate, and this process is repeated. At this time, by supplying an arbitrary amount of mixed crystal solution from the mixed crystal solution reservoir to the growth solution reservoir, the mixed crystal ratio in the thickness direction of the crystal grown on the substrate can be arbitrarily controlled. Liquid phase epitaxial growth method.
(2)複数の基板を内部に起立保持する中空基板ホルダ
部と、該ホルダ部の下部にホルダ部内部と連通するよう
に取り付けられ成長用溶液を収容する成長用溶液溜めと
、該成長用溶液溜めに設けられ成長用溶液の液位を昇降
する液位昇降手段と、上記成長用溶液溜めの上部に設け
られ混晶用溶液を収容する混晶用溶液溜めと、該混晶用
溶液溜め底部にスライド自在に設けられたスライダと、
該スライダを貫通して形成され、スライダを一方向にス
ライドすると混晶用溶液溜めと連通して混晶用溶液を一
定量収容し、逆方向にスライドすると成長用溶液溜めと
連通して収容した一定量の混晶用溶液を成長用溶液溜め
に落下させる移送用溶液溜めとで構成されていることを
特徴とする液相エピタキシャル成長装置。
(2) A hollow substrate holder part that holds a plurality of substrates upright therein, a growth solution reservoir attached to the lower part of the holder part so as to communicate with the inside of the holder part and containing a growth solution, and the growth solution a liquid level raising/lowering means provided in the reservoir for raising and lowering the liquid level of the growth solution; a mixed crystal solution reservoir provided above the growth solution reservoir for accommodating a mixed crystal solution; and a bottom portion of the mixed crystal solution reservoir. A slider that can be slid freely on the
It was formed through the slider, and when the slider was slid in one direction, it communicated with the mixed crystal solution reservoir and contained a certain amount of the mixed crystal solution, and when the slider was slid in the opposite direction, it communicated with and accommodated the growth solution reservoir. A liquid phase epitaxial growth apparatus comprising a transfer solution reservoir for dropping a fixed amount of a mixed crystal solution into a growth solution reservoir.
JP14579785A 1985-07-04 1985-07-04 Method and apparatus for liquid-phase epitaxial growth Granted JPS627696A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14579785A JPS627696A (en) 1985-07-04 1985-07-04 Method and apparatus for liquid-phase epitaxial growth

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14579785A JPS627696A (en) 1985-07-04 1985-07-04 Method and apparatus for liquid-phase epitaxial growth

Publications (2)

Publication Number Publication Date
JPS627696A true JPS627696A (en) 1987-01-14
JPH0481550B2 JPH0481550B2 (en) 1992-12-24

Family

ID=15393370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14579785A Granted JPS627696A (en) 1985-07-04 1985-07-04 Method and apparatus for liquid-phase epitaxial growth

Country Status (1)

Country Link
JP (1) JPS627696A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6221792A (en) * 1985-07-18 1987-01-30 Hitachi Cable Ltd Device for liquid-phase epitaxial growth

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6221792A (en) * 1985-07-18 1987-01-30 Hitachi Cable Ltd Device for liquid-phase epitaxial growth
JPH0532359B2 (en) * 1985-07-18 1993-05-14 Hitachi Cable

Also Published As

Publication number Publication date
JPH0481550B2 (en) 1992-12-24

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