JPH0481550B2 - - Google Patents

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Publication number
JPH0481550B2
JPH0481550B2 JP14579785A JP14579785A JPH0481550B2 JP H0481550 B2 JPH0481550 B2 JP H0481550B2 JP 14579785 A JP14579785 A JP 14579785A JP 14579785 A JP14579785 A JP 14579785A JP H0481550 B2 JPH0481550 B2 JP H0481550B2
Authority
JP
Japan
Prior art keywords
growth
mixed crystal
solution
solution reservoir
reservoir
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP14579785A
Other languages
Japanese (ja)
Other versions
JPS627696A (en
Inventor
Tsunehiro Unno
Mineo Wajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP14579785A priority Critical patent/JPS627696A/en
Publication of JPS627696A publication Critical patent/JPS627696A/en
Publication of JPH0481550B2 publication Critical patent/JPH0481550B2/ja
Granted legal-status Critical Current

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  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、混晶エピタキシヤル層を形成する液
相エピタキシヤル成長方法及びその装置に係り、
特に基板上に成長する結晶の厚さ方向の混晶比を
任意に制御する方法及びその装置に関するもの
で、例えば厚さが50μm以上の混晶エピタキシヤ
ル層を有するウエハの生産に適用すれば量産性に
おいて優れたものとなる。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a liquid phase epitaxial growth method and apparatus for forming a mixed crystal epitaxial layer.
In particular, it relates to a method and device for arbitrarily controlling the mixed crystal ratio in the thickness direction of crystals grown on a substrate.For example, if applied to the production of wafers having a mixed crystal epitaxial layer with a thickness of 50 μm or more, mass production is possible. Become superior in sex.

[従来の技術] 例えば、GaAlAsなどの混晶エピタキシヤル層
を厚く成長させた場合には、ガリウム中のアルミ
ニウムの偏析係数が大きすぎて、厚さ方向で混晶
比の均一なエピタキシヤル層を得るのは非常に難
しい。したがつて、一般的な横型炉方式の液相成
長法によつて100μm程度の厚さになるまで成長さ
せたときに、エピタキシヤル結晶と基板の界面で
アルミ混晶比が0.6程度あつたとしても、エピタ
キシヤル層の表面はほとんどゼロになつてしま
う。
[Prior art] For example, when a mixed crystal epitaxial layer such as GaAlAs is grown thickly, the segregation coefficient of aluminum in gallium is too large, making it difficult to form an epitaxial layer with a uniform mixed crystal ratio in the thickness direction. very difficult to obtain. Therefore, when grown to a thickness of about 100 μm using a general horizontal furnace liquid phase growth method, if the aluminum alloy ratio is about 0.6 at the interface between the epitaxial crystal and the substrate. However, the surface of the epitaxial layer becomes almost zero.

そこで、従来、このようなことがないように、
温度勾配を利用してアルミニウムを成長用溶液中
に均一に拡散させる特殊な成長方法が採用され
た。即ち、この方法は、昇温後成長用溶液の上方
に、混入したアルミニウムが溜まる傾向にあるこ
とから、成長用溶液溜め内の成長用溶液にその上
下方向に温度勾配を持たせ、冷却の下げ幅を上方
で大きく下方で小さくするようにしてアルミ混晶
比を厚さ方向で均一にしている 装置面では上述した温度勾配を持たせるため
に、成長用溶液溜めの外周に縦方向に加熱ヒータ
を設けて、この加熱ヒータに流れる電流を制御し
ている。
Therefore, in order to prevent this from happening,
A special growth method was used that uses a temperature gradient to uniformly diffuse aluminum into the growth solution. In other words, in this method, since mixed aluminum tends to accumulate above the growth solution after the temperature is raised, the growth solution in the growth solution reservoir has a temperature gradient in the vertical direction, and cooling is reduced. By making the width larger at the top and smaller at the bottom, the aluminum mixed crystal ratio is made uniform in the thickness direction.On the equipment side, in order to create the temperature gradient mentioned above, a heater is installed vertically around the outer periphery of the growth solution reservoir. is provided to control the current flowing through this heater.

[発明が解決しようとする問題点] ところが、成長方法が特殊であるため作業性が
悪く、しかも基板を水平にして溶液と接触させる
ので、1度に扱うことができる基板枚数が極端に
少なくなり、ウエハの大型化が難しく、量産性に
劣つていた。
[Problems to be solved by the invention] However, the special growth method makes workability difficult, and since the substrates are brought into contact with the solution horizontally, the number of substrates that can be handled at one time is extremely small. However, it was difficult to increase the size of wafers, and mass productivity was poor.

また加熱ヒータの電流制御によつて所望の温度
勾配を形成するのが難しかつた。
Furthermore, it was difficult to form a desired temperature gradient by controlling the current of the heater.

[発明の目的] 本発明の目的は、前述した従来技術の問題点を
解消し、偏析が問題となり混晶比の制御が難しい
混晶エピタキシヤル層における厚さ方向の混晶比
を同一のみならず任意に制御することが可能で、
しかもウエハの大型化や量産化が容易な液相エピ
タキシヤル成長方法及びその装置を提供すること
である。
[Object of the Invention] The object of the present invention is to solve the problems of the prior art described above, and to improve the mixing crystal ratio in the thickness direction in a mixed crystal epitaxial layer where segregation is a problem and the mixing crystal ratio is difficult to control. It can be controlled arbitrarily without
Moreover, it is an object of the present invention to provide a liquid phase epitaxial growth method and an apparatus therefor, which can easily increase the size of wafers and mass-produce them.

[発明の概要] 上記目的に沿う第1の発明の液相エピタキシヤ
ル成長方法は、実施例に対する第1図に示すよう
に、成長用溶液溜め3の上方に成長用溶液2と非
接触状態で予め起立保持されている基板6に対し
て、成長用溶液溜め3の中の成長用溶液2の液位
を昇降移動させ、基板6と溶液2との接触・非接
触を繰り返す。
[Summary of the Invention] The liquid phase epitaxial growth method of the first invention which meets the above object is as shown in FIG. The liquid level of the growth solution 2 in the growth solution reservoir 3 is moved up and down with respect to the substrate 6 which is held upright in advance, and contact and non-contact between the substrate 6 and the solution 2 are repeated.

この繰り返しの際、すなわち液位を下降させて
基板6と溶液が非接触状態にあるとき、混晶用溶
液溜め8から任意量の混晶用溶液7を成長用溶液
溜めに供給して成長用溶液に添加する。これによ
つて、基板6上に成長する結晶の厚さ方向の混晶
比が任意の値に制御される。
During this repetition, that is, when the liquid level is lowered and the substrate 6 and the solution are in a non-contact state, an arbitrary amount of the mixed crystal solution 7 is supplied from the mixed crystal solution reservoir 8 to the growth solution reservoir. Add to solution. Thereby, the mixed crystal ratio in the thickness direction of the crystal grown on the substrate 6 is controlled to an arbitrary value.

また、上記目的に沿う第2の発明の液相エピタ
キシヤル成長方法は、第1の発明方法を実施する
ための装置であつて複数の基板6を内部に起立保
持する中空の基板ホルダ部5と、ホルダ部の下部
にホルダ部内部と連通するように取り付けられ成
長用溶液を収容する成長用溶液溜め3を備えてい
る。この成長用溶液溜め3には液位昇降手段40
が設けられて、成長用溶液溜め3内の成長用溶液
2の液位を、基板6と接触したり、その接触を断
つたりするように昇降させる。
Further, the liquid phase epitaxial growth method of the second invention which meets the above object is an apparatus for carrying out the first invention method, which includes a hollow substrate holder part 5 that holds a plurality of substrates 6 upright therein; A growth solution reservoir 3 is attached to the lower part of the holder part so as to communicate with the inside of the holder part, and contains a growth solution. This growth solution reservoir 3 has a liquid level raising/lowering means 40.
is provided to raise and lower the liquid level of the growth solution 2 in the growth solution reservoir 3 so as to bring it into contact with the substrate 6 and break the contact therewith.

一方、成長用溶液溜め3の上部には混晶用溶液
7を収容する混晶用溶液溜め8が設けられ、この
混晶用溶液溜め底部にスライダ10がスライド自
在に設けられている。そして、このスライダ10
には貫通して形成された移送用溶液溜め11が設
けられてスライダ10を一方向にスライドすると
混晶用溶液溜め8と連通して混晶用溶液7を一定
量収容し、逆方向にスライドすると成長用溶液溜
め3と連通して収容した一定量の混晶用溶液7を
成長用溶液溜め3に落下させる。
On the other hand, a mixed crystal solution reservoir 8 containing a mixed crystal solution 7 is provided above the growth solution reservoir 3, and a slider 10 is slidably provided at the bottom of this mixed crystal solution reservoir. And this slider 10
A transfer solution reservoir 11 is formed through the slider 10, and when the slider 10 is slid in one direction, it communicates with the mixed crystal solution reservoir 8 to accommodate a certain amount of the mixed crystal solution 7, and when the slider 10 is slid in the opposite direction. Then, a certain amount of the mixed crystal solution 7 stored in communication with the growth solution reservoir 3 is dropped into the growth solution reservoir 3.

基板6を起立してセツトすることにより、水平
にセツトする場合と異なり、多数枚の基板がセツ
トできるようになる。また、反応炉を昇温後、成
長用溶液2の液位を上晶させて基板6と成長用溶
液2の接触状態を保持しつつ徐冷していくと、各
基板6上に同時にエピタキシヤル層が成長する。
逆に成長用溶液2の液位を下降させると、基板6
との接触状態が断たれてエピタキシヤル層成長が
終了する。成長終了後または昇温して上記工程を
繰り返すことにより、順次厚いエピタキシヤル層
が基板上に得られる。このように、成長用溶液の
液位の昇降を繰り返すことによりエピタキシヤル
層を成長させるのであり、液位の上昇量を増加す
るに伴なつてより広い面積の基板との接触が確保
される。そして、エピタキシヤル成長を完了した
基板は新しい基板と交換されるが、成長用溶液は
成長用溶液溜めに自重によつて戻るので、交換や
移し替えの必要はない。
By setting the substrates 6 in an upright position, a large number of substrates can be set, unlike the case where they are set horizontally. Furthermore, after raising the temperature of the reactor, if the liquid level of the growth solution 2 is allowed to rise and the substrate 6 is kept in contact with the growth solution 2 while being slowly cooled, epitaxial growth will occur on each substrate 6 at the same time. The layers grow.
Conversely, when the liquid level of the growth solution 2 is lowered, the substrate 6
The epitaxial layer growth is terminated by breaking the contact state with the epitaxial layer. By repeating the above steps after the growth is completed or at elevated temperatures, successively thicker epitaxial layers are obtained on the substrate. In this way, the epitaxial layer is grown by repeatedly raising and lowering the level of the growth solution, and as the amount of rise in the liquid level increases, a wider area of contact with the substrate is ensured. Then, the substrate on which epitaxial growth has been completed is replaced with a new substrate, but since the growth solution returns to the growth solution reservoir under its own weight, there is no need for replacement or transfer.

ところで、成長用溶液2の液位が降下して成長
用溶液溜め3に戻つているときに、スライダ10
を1往復スライドすると一定量の混晶用溶液が成
長用溶液に添加される。これを繰り返すことによ
り任意量の混晶用溶液が補給される。この任意量
の混晶用溶液の補給によつて基板上に成長するエ
ピタキシヤル層の厚さ方向の混晶比が任意に制御
される。
By the way, when the liquid level of the growth solution 2 is falling and returning to the growth solution reservoir 3, the slider 10
When the slider slides back and forth once, a certain amount of the mixed crystal solution is added to the growth solution. By repeating this, an arbitrary amount of the mixed crystal solution is replenished. By replenishing an arbitrary amount of the mixed crystal solution, the mixed crystal ratio in the thickness direction of the epitaxial layer grown on the substrate can be arbitrarily controlled.

本発明は、GaAlAsなどの−族化合物半導
体、あるいは−族化合物半導体の混晶エピタ
キシヤルウエハの成長すべてに適用できる。
The present invention is applicable to all types of growth of - group compound semiconductors such as GaAlAs, or mixed crystal epitaxial wafers of - group compound semiconductors.

[実施例] 本発明の実施例を第1図〜第2図に基づいて説
明すれば以下の通りである。
[Example] An example of the present invention will be described below based on FIGS. 1 and 2.

第1図は本発明方法を実施するための液相エピ
タキシヤル装置の一実施例を示す。
FIG. 1 shows an embodiment of a liquid phase epitaxial apparatus for carrying out the method of the invention.

1は成長用溶液2を収容する、上部に開口した
成長用溶液溜め3を形成した溶液収容部である。
この溶液収容部1には液位昇降手段としてのピス
トン4が設けられる。このピストン4は溶液収容
部1の一側から成長用溶液溜め3に横方向に形成
した挿通孔に挿通されて、その先端を成長用溶液
溜め3内に出没させることにより成長用溶液2の
液位を昇降動させるようになつている。
Reference numeral 1 denotes a solution storage part in which a growth solution reservoir 3 having an opening at the top is formed to contain a growth solution 2 .
This solution storage section 1 is provided with a piston 4 as a means for raising and lowering the liquid level. This piston 4 is inserted from one side of the solution storage part 1 into an insertion hole formed in the growth solution reservoir 3 in the horizontal direction, and the tip of the piston 4 is inserted into and out of the growth solution reservoir 3 so that the growth solution 2 can be removed. It is designed to move up and down.

このようなピストン4を出没自在に設けた溶液
収容部1の上部前方(ピストン4の押し出し方向
側)に、上下が開口して、その下部が成長用溶液
溜り2と連通する中空の基板ホルダ部5が取り付
けられ、その基板ホルダ部5内には複数の基板6
を、例えば互いに向い合つた配置で起立保持でき
るようになつている。したがつて、ピストン4を
押し出すと、押し上げられた成長用溶液2は基板
ホルダ部5内に侵入して基板6と接触し、逆にピ
ストン4を没入すると、成長用溶液2の液位が降
下して基板6との接触が断たれるようになつてい
る。
At the front of the upper part of the solution storage part 1 in which such a piston 4 is provided so as to be freely retractable (on the extrusion direction side of the piston 4), there is a hollow substrate holder part whose upper and lower sides are open and whose lower part communicates with the growth solution reservoir 2. 5 is attached, and a plurality of substrates 6 are mounted in the substrate holder section 5.
can be held upright, for example, in an arrangement facing each other. Therefore, when the piston 4 is pushed out, the pushed-up growth solution 2 enters the substrate holder part 5 and comes into contact with the substrate 6, and when the piston 4 is pushed back, the liquid level of the growth solution 2 falls. Thus, contact with the substrate 6 is cut off.

また、溶液収容部1の上部後方に混晶用溶液7
を収容する混晶用溶液溜め8が取り付けられる。
この混晶用溶液溜め8の底部は開口しており、こ
の開口底部には、これに沿つて横方向に形成した
挿通孔9が設けられ、この挿通孔を介して混晶用
溶液溜め8と成長用溶液溜め3とが連通してい
る。挿通孔9には混晶用溶液溜め8の開口底部と
挿通孔を閉塞するスライダ10がピストン4と同
じ方向にスライド自在に挿通されている。
In addition, a mixed crystal solution 7 is provided at the rear of the upper part of the solution storage section 1.
A mixed crystal solution reservoir 8 containing the mixed crystal is attached.
The bottom of this mixed crystal solution reservoir 8 is open, and an insertion hole 9 formed laterally along this open bottom is provided, and the mixed crystal solution reservoir 8 is connected to the mixed crystal solution reservoir 8 through this insertion hole. It communicates with the growth solution reservoir 3. A slider 10 that closes the opening bottom of the mixed crystal solution reservoir 8 and the insertion hole is inserted into the insertion hole 9 so as to be slidable in the same direction as the piston 4.

このスライダ10の途中には、これを縦方向に
貫通する一定容積の移送用溶液溜め11が形成さ
れ、スライダ11を引き方向にスライドすると混
晶用溶液溜め8と連通して混晶用溶液7を一定量
収容し、押し出し方向にスライダ10をスライド
すると成長用溶液溜め3と連通して収容した一定
量の混晶用溶液7を成長用溶液溜め3に落下させ
るようになつている。
A transfer solution reservoir 11 of a fixed volume is formed in the middle of the slider 10 and passes through the slider 10 in the vertical direction. When the slider 11 is slid in the pulling direction, it communicates with the mixed crystal solution reservoir 8 and the mixed crystal solution 7 When the slider 10 is slid in the extrusion direction, a certain amount of the mixed crystal solution 7 is communicated with the growth solution reservoir 3 and dropped into the growth solution reservoir 3.

本実施例では、上記スライダ用の挿通孔9や混
晶用溶液溜め8は、基板ホルダ部5の一側の肉厚
部に一体形成した例を示しているが、別体でもよ
く、また基板ホルダ部5は溶液収容部1に一体的
に取り付けても、あるいは着脱自在に取り付けて
もよい。
In this embodiment, the insertion hole 9 for the slider and the solution reservoir 8 for the mixed crystal are integrally formed in the thick part on one side of the substrate holder part 5, but they may be formed separately or The holder portion 5 may be attached integrally to the solution storage portion 1 or may be detachably attached.

そして上記した成長装置の作業順序をGaAlAs
エピタキシヤル成長方法に適用した具体例につい
て述べる。
Then, the operation order of the above-mentioned growth apparatus was changed to GaAlAs.
A specific example of application to the epitaxial growth method will be described.

予め、基板ホルダ部5に2インチウエハを向か
い合つた配置で30枚セツトし、成長用溶液溜め3
にはGa1,500gとGaAs60gを、混晶用溶液溜め
8にはGa50gとAl5gをそれぞれセツトしてお
き、このようにセツトした本成長装置を横型反応
管(図示せず)に挿入して内部をH2スと置換す
る。
In advance, set 30 2-inch wafers facing each other in the substrate holder part 5, and place them in the growth solution reservoir 3.
1,500g of Ga and 60g of GaAs are set in the mixed crystal solution reservoir 8, and 50g of Ga and 5g of Al are set in the mixed crystal solution reservoir 8.The growth apparatus thus set is inserted into a horizontal reaction tube (not shown) and the inside is opened. Replace with H 2 s.

H2ガスと置換後、最初に反応炉を800℃の成長
開始温度まで昇温し、昇温後スライダ10を10回
往復させてAlの溶けたGa溶液を成長用溶液溜め
3内に落下させる。本実施例では1回の往復で
Al120mgとGa1.2gの溶液が落下する。落下した
Alの溶けたGa溶液は成長用溶液中に拡散する。
落下後、ピストン4を押し出してGaAsの成長用
溶液を押し上げ、基板6と接触させる。接触後5
分したら徐冷を開始し結晶成長を行なう。30分間
接触させた後、ピストン4を没入させると押し上
げられた成長用溶液は降下して成長用溶液溜め3
に自重で戻り、成長は停止する。
After replacing with H 2 gas, first raise the temperature of the reactor to the growth starting temperature of 800°C, and after raising the temperature, move the slider 10 back and forth 10 times to drop the Ga solution containing dissolved Al into the growth solution reservoir 3. . In this example, one round trip is required.
A solution of 120 mg of Al and 1.2 g of Ga falls. fell down
The Ga solution containing dissolved Al diffuses into the growth solution.
After falling, the piston 4 is pushed out to push up the GaAs growth solution and bring it into contact with the substrate 6. After contact 5
After a minute, slow cooling is started and crystal growth is performed. After 30 minutes of contact, when the piston 4 is immersed, the pushed-up growth solution descends into the growth solution reservoir 3.
It returns under its own weight and growth stops.

次に、炉を再度800℃まで昇温する。このとき
に、またスライダ10を往復動させて上記したの
と等量となるように不足分のAlの溶けたGa溶液
を成長用溶液に補給する。昇温後20分したら直ち
にピストン4を押し出して成長用溶液と基板6と
を接触させる。このとき、炉がまだ安定していな
いため基板表面が多少メルトバツクされる傾向が
ある。接触後5分したら徐冷を開始し再度成長を
行なう。
Next, the temperature of the furnace is raised to 800°C again. At this time, the slider 10 is reciprocated again to replenish the growth solution with the insufficient amount of the Ga solution in which Al has been dissolved so as to have the same amount as described above. Immediately after 20 minutes after the temperature rise, the piston 4 is pushed out to bring the growth solution into contact with the substrate 6. At this time, since the furnace is not yet stable, the surface of the substrate tends to melt back to some extent. Five minutes after contact, slow cooling is started and growth is performed again.

以上の工程を繰り返すことにより、厚膜の
GaAlAsエピタキシヤルウエハを得ることができ
る。本実施例では昇温工程を20回繰り返すことに
より、厚さ150μm、表面混晶比0.25で厚さ方向に
均一性の極めて良好なGaAlAs混晶エピタキシヤ
ル層を成長させることができた。
By repeating the above steps, thick film
GaAlAs epitaxial wafers can be obtained. In this example, by repeating the temperature raising step 20 times, it was possible to grow a GaAlAs mixed crystal epitaxial layer with a thickness of 150 μm, a surface mixed crystal ratio of 0.25, and extremely good uniformity in the thickness direction.

このように、本実施例によれば1度に2インチ
サイズで30枚程度の厚さ50μm以上の混晶エピタ
キシヤル成長が可能であり、このようなウエハの
大型化と量産化を達成することができるのは、基
板を起立してセツトすると共に成長用溶液の液位
の昇降を繰り返すことにより、エピタキシヤル層
の厚さを増加させるようにしたからであり、ま
た、厚さ方向の混晶比を均一化させることができ
るのは、成長用溶液が溶液溜めに戻つているとき
に、混晶用溶液の不足分を補給することによつて
混晶比を調整しているからである。
As described above, according to this embodiment, it is possible to grow mixed crystal epitaxially on about 30 2-inch wafers with a thickness of 50 μm or more at a time, and it is possible to achieve larger size and mass production of such wafers. This is possible because the thickness of the epitaxial layer is increased by raising and lowering the growth solution while setting the substrate upright, and also by increasing the thickness of the epitaxial layer. The reason why the ratio can be made uniform is that when the growth solution is returned to the solution reservoir, the mixed crystal ratio is adjusted by replenishing the missing amount of the mixed crystal solution.

なお、上記、実施例においては、混晶比が厚さ
方向で均一なエピタキシヤルウエハの場合につい
て述べたが、混晶用溶液の添加量により、第2図
に示すように、混晶比が厚さ方向で増加したり、
あるいは減少したり、更には2段ステツプになつ
たり等、いろいろな種類のプロフアイルをもつた
エピタキシヤル層の成長が可能である。また数
μmの付近の薄い厚さであれば、急激に混晶比が
増加するエピタキシヤル層の成長も可能である。
In the above examples, the case of an epitaxial wafer in which the mixed crystal ratio is uniform in the thickness direction was described, but depending on the amount of the mixed crystal solution added, the mixed crystal ratio can be changed as shown in Fig. 2. increases in the thickness direction,
It is possible to grow epitaxial layers with various types of profiles, such as reduced or even two-step profiles. Furthermore, if the thickness is as small as several μm, it is possible to grow an epitaxial layer in which the mixed crystal ratio increases rapidly.

更に、Al以外の偏析係数の大きなドーパント
を入れても、厚さ方向でキヤリア濃度が均一な厚
膜エピタキシヤル層の成長が可能となる。
Furthermore, even if a dopant other than Al with a large segregation coefficient is added, a thick epitaxial layer with a uniform carrier concentration in the thickness direction can be grown.

[発明の効果] 以上要するに本発明によれば次のような優れた
効果を発揮する。
[Effects of the Invention] In summary, the present invention exhibits the following excellent effects.

(1) 成長用溶液に温度勾配を持たせる必要もな
く、成長用溶位の液位の昇降と混晶用溶液の補
給との繰り返しにより、任意の厚さで任意の混
晶比のエピタキシヤル層を基板上に成長させる
ことができる。また、基板を起立させたことに
より1回に扱える枚数は任意であり、同時に多
数の基板をセツトすることが可能で、しかも原
料溶液が基板の下方に戻るため、基板を交換す
るだけで原料溶液は交換も移し換えも不要で何
度でもそのまま使用できるので、従来の方法に
比べて作業性もよく、ウエハの大型化が可能で
量産向きとなる。
(1) There is no need to create a temperature gradient in the growth solution, and by repeatedly raising and lowering the growth solution level and replenishing the mixed crystal solution, epitaxial growth of any thickness and any mixed crystal ratio can be achieved. A layer can be grown on the substrate. In addition, by standing up the substrates, any number of substrates can be handled at one time, and many substrates can be set at the same time.Moreover, since the raw material solution returns to the bottom of the substrate, just by replacing the substrate, the raw material solution can be removed. Because it does not require replacement or transfer and can be used as is, it is easier to work with than conventional methods, and allows for larger wafers, making it suitable for mass production.

(2) 一定量の混晶用溶液を成長用溶液溜めに落下
させるには、混晶用溶液溜め内にピストンを押
し出し、この押し出しによる混晶用溶液溜め上
部からの溢流液を利用してもよいが、前述した
本発明装置を使用し、移送用溶液溜め付きスラ
イダを往復動させるようにすれば、ストローク
の調節をすることなく、所定量の混晶用溶液を
補給できるようになつて、作業は一層容易で供
給落下量の秤量精度を上げることができる。ま
た、温度勾配用の加熱ヒータも不要で、その電
流制御も行なう必要がなく、単純な機械的構成
のみから成つているので、従来の装置に比して
耐久性、操作性が良い。
(2) To drop a certain amount of mixed crystal solution into the growth solution reservoir, push a piston into the mixed crystal solution reservoir, and use the overflow from the top of the mixed crystal solution reservoir due to this extrusion. However, if the device of the present invention described above is used and the slider with the transfer solution reservoir is moved back and forth, a predetermined amount of mixed crystal solution can be replenished without adjusting the stroke. , the work is easier and the accuracy of weighing the amount of falling supply can be improved. Furthermore, there is no need for a heater for temperature gradients, there is no need to control its current, and the device has only a simple mechanical configuration, so it has better durability and operability than conventional devices.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係る液相エピタキシヤル成長
装置の一実施例を示す縦断面図、第2図は本発明
を実施した場合に可能な混晶比の厚さ方向のプロ
フアイルを示す線図である。 図中、2は成長用溶液、3は成長用溶液溜め、
4はピストン、5は基板ホルダ部、6は基板、7
は混晶用溶液、8は混晶用溶液溜め、10はスラ
イダ、11は移送用溶液溜め、40は液位昇降手
段である。
FIG. 1 is a vertical cross-sectional view showing an embodiment of a liquid phase epitaxial growth apparatus according to the present invention, and FIG. 2 is a line showing a profile of the possible mixed crystal ratio in the thickness direction when the present invention is implemented. It is a diagram. In the figure, 2 is a growth solution, 3 is a growth solution reservoir,
4 is a piston, 5 is a substrate holder part, 6 is a substrate, 7
8 is a mixed crystal solution, 8 is a mixed crystal solution reservoir, 10 is a slider, 11 is a solution reservoir for transportation, and 40 is a liquid level raising/lowering means.

Claims (1)

【特許請求の範囲】 1 成長用溶液溜めの上方に成長用溶液と非接触
状態で起立保持されている基板に対し、成長用溶
液の液位を昇降移動させて基板との接触・非接触
を繰り返し、この繰り返しの際に混晶用溶液溜め
から任意量の混晶溶液を成長用溶液溜めに供給す
ることにより、基板上に成長する結晶の厚さ方向
の混晶比を任意に制御することを特徴とする液相
エピタキシヤル成長方法。 2 複数の基板を内部に起立保持する中空基板ホ
ルダ部と、該ホルダ部の下部にホルダ部内部と連
通するように取り付けられ成長用溶液を収容する
成長用溶液溜めと、該成長用溶液溜めに設けられ
成長用溶液の液位を昇降する液位昇降手段と、上
記成長用溶液溜めの上部に設けられ混晶用溶液を
収容する混晶用溶液溜めと、該混晶用溶液溜め底
部にスライド自在に設けられたスライダと、該ス
ライダを貫通して形成され、スライダを一方向に
スライドすると混晶用溶液溜めと連通して混晶用
溶液を一定量収容し、逆方向にスライドすると成
長用溶液溜めと連通して収容した一定量の混晶用
溶液を成長用溶液溜めに落下させる移送用溶液溜
めとで構成されていることを特徴とする液相エピ
タキシヤル成長装置。
[Claims] 1. With respect to a substrate that is held upright above a growth solution reservoir in a non-contact state with the growth solution, the liquid level of the growth solution is moved up and down to make contact and non-contact with the substrate. By repeatedly supplying an arbitrary amount of mixed crystal solution from the mixed crystal solution reservoir to the growth solution reservoir during this repetition, the mixed crystal ratio in the thickness direction of the crystal grown on the substrate can be arbitrarily controlled. A liquid phase epitaxial growth method characterized by: 2. A hollow substrate holder part that holds a plurality of substrates upright therein, a growth solution reservoir attached to the lower part of the holder part so as to communicate with the inside of the holder part and containing a growth solution, and a growth solution reservoir in the growth solution reservoir. a liquid level raising/lowering means provided for raising and lowering the liquid level of the growth solution; a mixed crystal solution reservoir provided above the growth solution reservoir for accommodating a mixed crystal solution; and a slide at the bottom of the mixed crystal solution reservoir. A freely provided slider is formed through the slider, and when the slider is slid in one direction, it communicates with the mixed crystal solution reservoir to accommodate a certain amount of mixed crystal solution, and when it is slid in the opposite direction, it is connected to the mixed crystal solution reservoir, and when it is slid in the opposite direction, it is used for growth. 1. A liquid phase epitaxial growth apparatus comprising a transfer solution reservoir that communicates with the solution reservoir and drops a fixed amount of mixed crystal solution contained therein into the growth solution reservoir.
JP14579785A 1985-07-04 1985-07-04 Method and apparatus for liquid-phase epitaxial growth Granted JPS627696A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14579785A JPS627696A (en) 1985-07-04 1985-07-04 Method and apparatus for liquid-phase epitaxial growth

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14579785A JPS627696A (en) 1985-07-04 1985-07-04 Method and apparatus for liquid-phase epitaxial growth

Publications (2)

Publication Number Publication Date
JPS627696A JPS627696A (en) 1987-01-14
JPH0481550B2 true JPH0481550B2 (en) 1992-12-24

Family

ID=15393370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14579785A Granted JPS627696A (en) 1985-07-04 1985-07-04 Method and apparatus for liquid-phase epitaxial growth

Country Status (1)

Country Link
JP (1) JPS627696A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6221792A (en) * 1985-07-18 1987-01-30 Hitachi Cable Ltd Device for liquid-phase epitaxial growth

Also Published As

Publication number Publication date
JPS627696A (en) 1987-01-14

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