JPS627641B2 - - Google Patents
Info
- Publication number
- JPS627641B2 JPS627641B2 JP56215896A JP21589681A JPS627641B2 JP S627641 B2 JPS627641 B2 JP S627641B2 JP 56215896 A JP56215896 A JP 56215896A JP 21589681 A JP21589681 A JP 21589681A JP S627641 B2 JPS627641 B2 JP S627641B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- copper
- silver
- present
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 52
- 239000011347 resin Substances 0.000 claims description 52
- 239000000203 mixture Substances 0.000 claims description 41
- 239000000126 substance Substances 0.000 claims description 37
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 23
- 239000000843 powder Substances 0.000 claims description 22
- 239000002131 composite material Substances 0.000 claims description 14
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 claims description 14
- 239000005749 Copper compound Substances 0.000 claims description 13
- 150000001880 copper compounds Chemical class 0.000 claims description 13
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical group OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 11
- 239000003638 chemical reducing agent Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 27
- 238000002474 experimental method Methods 0.000 description 23
- 239000010949 copper Substances 0.000 description 19
- 229910052802 copper Inorganic materials 0.000 description 18
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 15
- -1 phosphorous acid compound Chemical class 0.000 description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 13
- 239000007788 liquid Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 229910052709 silver Inorganic materials 0.000 description 10
- 239000004332 silver Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 8
- 150000001879 copper Chemical class 0.000 description 8
- 229920001568 phenolic resin Polymers 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000011134 resol-type phenolic resin Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 229960004643 cupric oxide Drugs 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N ethyl acetate Substances CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- GWYFZTJDIQALEB-UHFFFAOYSA-N 2-ethenylbenzene-1,4-diol Chemical compound OC1=CC=C(O)C(C=C)=C1 GWYFZTJDIQALEB-UHFFFAOYSA-N 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- WOXFMYVTSLAQMO-UHFFFAOYSA-N 2-Pyridinemethanamine Chemical compound NCC1=CC=CC=N1 WOXFMYVTSLAQMO-UHFFFAOYSA-N 0.000 description 2
- XCZKKZXWDBOGPA-UHFFFAOYSA-N 2-phenylbenzene-1,4-diol Chemical compound OC1=CC=C(O)C(C=2C=CC=CC=2)=C1 XCZKKZXWDBOGPA-UHFFFAOYSA-N 0.000 description 2
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 2
- VVXLFFIFNVKFBD-UHFFFAOYSA-N 4,4,4-trifluoro-1-phenylbutane-1,3-dione Chemical compound FC(F)(F)C(=O)CC(=O)C1=CC=CC=C1 VVXLFFIFNVKFBD-UHFFFAOYSA-N 0.000 description 2
- JXSRRBVHLUJJFC-UHFFFAOYSA-N 7-amino-2-methylsulfanyl-[1,2,4]triazolo[1,5-a]pyrimidine-6-carbonitrile Chemical compound N1=CC(C#N)=C(N)N2N=C(SC)N=C21 JXSRRBVHLUJJFC-UHFFFAOYSA-N 0.000 description 2
- KDCGOANMDULRCW-UHFFFAOYSA-N 7H-purine Chemical compound N1=CNC2=NC=NC2=C1 KDCGOANMDULRCW-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical compound N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- NTYJJOPFIAHURM-UHFFFAOYSA-N Histamine Chemical compound NCCC1=CN=CN1 NTYJJOPFIAHURM-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- DGTNSSLYPYDJGL-UHFFFAOYSA-N phenyl isocyanate Chemical compound O=C=NC1=CC=CC=C1 DGTNSSLYPYDJGL-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000001603 reducing effect Effects 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- HJUGFYREWKUQJT-UHFFFAOYSA-N tetrabromomethane Chemical compound BrC(Br)(Br)Br HJUGFYREWKUQJT-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- SHXHPUAKLCCLDV-UHFFFAOYSA-N 1,1,1-trifluoropentane-2,4-dione Chemical compound CC(=O)CC(=O)C(F)(F)F SHXHPUAKLCCLDV-UHFFFAOYSA-N 0.000 description 1
- FANFNIQBCCUZFW-UHFFFAOYSA-N 1,4-dihydroxy-2h-naphthalene-1-carbaldehyde Chemical compound C1=CC=C2C(O)=CCC(O)(C=O)C2=C1 FANFNIQBCCUZFW-UHFFFAOYSA-N 0.000 description 1
- YXAOOTNFFAQIPZ-UHFFFAOYSA-N 1-nitrosonaphthalen-2-ol Chemical compound C1=CC=CC2=C(N=O)C(O)=CC=C21 YXAOOTNFFAQIPZ-UHFFFAOYSA-N 0.000 description 1
- WJDJWDHXZBNQNE-UHFFFAOYSA-M 1-octadecylpyridin-1-ium;chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+]1=CC=CC=C1 WJDJWDHXZBNQNE-UHFFFAOYSA-M 0.000 description 1
- CVBUKMMMRLOKQR-UHFFFAOYSA-N 1-phenylbutane-1,3-dione Chemical compound CC(=O)CC(=O)C1=CC=CC=C1 CVBUKMMMRLOKQR-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- IXHBSOXJLNEOPY-UHFFFAOYSA-N 2'-anilino-6'-(n-ethyl-4-methylanilino)-3'-methylspiro[2-benzofuran-3,9'-xanthene]-1-one Chemical compound C=1C=C(C2(C3=CC=CC=C3C(=O)O2)C2=CC(NC=3C=CC=CC=3)=C(C)C=C2O2)C2=CC=1N(CC)C1=CC=C(C)C=C1 IXHBSOXJLNEOPY-UHFFFAOYSA-N 0.000 description 1
- CLFRCXCBWIQVRN-UHFFFAOYSA-N 2,5-dihydroxybenzaldehyde Chemical compound OC1=CC=C(O)C(C=O)=C1 CLFRCXCBWIQVRN-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- NBYLBWHHTUWMER-UHFFFAOYSA-N 2-Methylquinolin-8-ol Chemical compound C1=CC=C(O)C2=NC(C)=CC=C21 NBYLBWHHTUWMER-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SYUYTOYKQOAVDW-UHFFFAOYSA-N 2-nitrosonaphthalen-1-ol Chemical compound C1=CC=C2C(O)=C(N=O)C=CC2=C1 SYUYTOYKQOAVDW-UHFFFAOYSA-N 0.000 description 1
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 description 1
- NFVPEIKDMMISQO-UHFFFAOYSA-N 4-[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=C(O)C=C1 NFVPEIKDMMISQO-UHFFFAOYSA-N 0.000 description 1
- LGDFHDKSYGVKDC-UHFFFAOYSA-N 8-hydroxyquinoline-5-sulfonic acid Chemical compound C1=CN=C2C(O)=CC=C(S(O)(=O)=O)C2=C1 LGDFHDKSYGVKDC-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229930024421 Adenine Natural products 0.000 description 1
- GFFGJBXGBJISGV-UHFFFAOYSA-N Adenine Chemical compound NC1=NC=NC2=C1N=CN2 GFFGJBXGBJISGV-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- CSTYAKMFUAXJDV-UHFFFAOYSA-N O=C.OC1=CC=CC=C1.OC1=CC=C(O)C=C1 Chemical compound O=C.OC1=CC=CC=C1.OC1=CC=C(O)C=C1 CSTYAKMFUAXJDV-UHFFFAOYSA-N 0.000 description 1
- 241001311547 Patina Species 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
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The present invention relates to a conductive composition having excellent initial conductivity and sufficient conductivity durability under high humidity. Conductive compositions containing silver powder and resin as main components have been put into practical use because they can easily form conductors in jumper circuits, through-hole filling, capacitor electrodes, and the like. However, conductive compositions and conductors using silver powder are mainly used for economic reasons and because silver migration tends to occur, so base metal powders such as copper and nickel are used, or blends of silver powder and copper powder are used. Or silver-plated copper powder, silver-plated copper powder,
Measures have been considered to reduce the silver content as much as possible by using silver-plated glass beads, alloys of silver and copper or nickel, and composite powders mechanically bonded together. However, it is still insufficient to develop a conductive composition that has good initial conductivity and shows little change in conductivity even under high humidity. The present inventor has discovered that a composition containing (a) metallic copper powder, (b) a copper compound, (c) a reducing agent capable of producing metallic copper by reducing copper in the copper compound, and (d) a resin is conductive. It has been found that a cured resin with good properties can be obtained. However, in this case, if an organic or inorganic phosphorous acid compound such as mono- or diester of phosphorous acid is used as a reducing agent, a cured resin with excellent initial conductivity can be obtained; It has been found that when resin is left at high temperature and high humidity for a long period of time, a verdigris-like substance is formed on the surface of the cured resin, and the conductivity gradually decreases over time. On the other hand, a method using a reducing agent having a dihydroxybenzene ring was also discovered (Japanese Patent Application No. 109737/1982), but this method was still not satisfactory for applications requiring even higher long-term reliability. Generally, in electrical applications, high temperatures,
There is a strong desire for a conductive cured resin whose resistance value hardly changes even when left under high humidity. For this reason, the present inventor has developed a composition that provides a conductive cured resin that has good initial conductivity, does not generate a verdigris-like substance even when left under high temperature and high humidity, and has extremely small change in conductivity. As a result of research, we have achieved this goal and completed the present invention. That is, the present invention comprises (a) copper-silver composite powder, (b) copper compound, (c)
Contains a reducing agent having a 1,4 or 1,2-dihydroxybenzene ring (hereinafter simply referred to as dihydroxybenzene ring) and (d) a resin, or further contains these and (e) a chelate-forming substance. This is a characteristic conductive composition. In the case of a composition that does not contain (e) a chelate-forming substance in the present invention, although the mechanism is unknown, the storage stability of the composition is somewhat poor, and as the storage time elapses, it comes into contact with air. There is a tendency for the surface of the composition to harden, impairing its quality, and eventually rendering it unusable (hereinafter abbreviated as scalding phenomenon). If the composition of the present invention is to be put to practical use in applications that require long shelf life, this scalding phenomenon is inconvenient as it must be used immediately after preparation. (e) It has been found that by adding a chelate-forming substance, the parenchymal epithelial burr phenomenon can be prevented without causing any other problems, although the mechanism is also unclear. The copper-silver composite powder used in the present invention is a metal powder whose metal particles are composed of copper and silver, and includes, for example, a metal powder in which the surface of copper particles is plated with silver, an alloy powder of copper and silver, and the like. In this case, the alloy may be an atomically dissolved solid solution made by adding and melting copper and silver metals, a eutectic state that is simply a mixture of copper and silver, or an alloy between copper and silver metals. There is a state in which an intermetallic compound is formed. It also includes metal powders obtained by mixing copper and silver metal powders and mechanically forcibly joining them using a vibration mill, ball mill, stamp mill, etc. Also, other than copper and silver, for example, precious metals such as platinum, mercury, palladium, gold, nickel, zinc, tin, etc.
Lead, iron, aluminum, manganese, tungsten, titanium, silicon, magnesium, chromium, cadmium, cobalt, molybdenum, antimony,
It may also contain metals such as vanadium. The content of copper in the copper-silver composite powder used in the present invention is preferably 50 to 99.8% for performance and economic reasons.
Particularly preferred is 70-99.5%. The shape of the copper-silver composite powder used in the present invention is not particularly limited, and may be, for example, flaky, dendritic, spherical, or irregularly shaped. The particle size is usually preferably 100 microns or less, but depending on the application,
100Ό to 1mm can also be used. Of course, copper-silver composite powders having different shapes and particle sizes may be mixed and used. The copper-silver composite powder of the present invention may have an oxide film on its surface or be treated with anti-oxidation treatment, or it may be a commercially available powder that has been treated with stearic acid or the like to prevent agglomeration. Copper composite powder may also be used. The composition of the present invention needs to contain (b), (c) and (d) in addition to (a), or (e) in addition to (a), (b),
It is not necessarily necessary to use four or five separate substances corresponding to (c), (d), and (e); (a), (b), (c), (d) by using a commercially available copper-silver composite powder that has a copper film, or by using a resin with a dihydroxybenzene ring that also serves as (c) and (d). ) and (e), it is also possible to achieve the objective simply by mixing four, three, or two types of substances. Hereinafter, various substances used in the present invention will be explained by giving examples. (1) Copper compounds having only the properties specified in (b) Cuprous chloride, cuprous oxide, cupric oxide, copper acetate, copper salicylate, copper stearate. (2) Substances having only the properties of (c) with a dihydroxybenzene ring: Hydroquinone, catechol, 2-methyl-
Hydroquinone, vinylhydroquinone, tertiarybutylhydroquinone, chlorohydroquinone, phenylhydroquinone, and other substances with the following structures.
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ç©ã[Formula] A substance that produces a reducing agent having a dihydroxybenzene ring as described above by further heating or adding other substances, such as an adduct of catechol, hydroquinone, etc. and phenyl isocyanate, 2-methyl Substances such as adducts of 2 moles of hydroquinone and 1 mole of tolylene diisocyanate. (3) Resin, that is, a substance that has only the properties as (d) The resin in the present invention is one that has already become a polymer before it is finally cured, or one that becomes a polymer substance through a reaction during curing. It refers to a substance that is a substance that is conductive and that produces an electrically conductive cured product when the composition of the present invention is cured. Specifically, urea formaldehyde resin, melamine formaldehyde resin, phenol formaldehyde resin, unsaturated polyester resin, thermosetting saturated polyester resin, polycarbonate resin, polyphenylene oxide resin, polyphenylene sulfide resin, fatty acid alkyd resin. , polyamide resin, polyimide resin, epoxy acrylate resin, aryl resin (diallyl phthalate resin, etc.), epoxy resin, urethane resin, polyoxymethylene resin, spiroacetal resin, silicone resin, xylene resin, ketone resin, polysulfide rubber, acrylic Resin, styrene resin, olefin resin, vinyl alkanoate resin, butadiene rubber,
Isobutylene rubber, ethylene-propylene rubber, chloroprene rubber, epichlorohydrin rubber, cellulose resin, rosin resin, fluorine resin, phosphonitrile chloride resin,
Ethyl silicate polymer. (4) a copper compound having a dihydroxybenzene ring,
That is, a substance that serves both (b) and (c); a copper salt of the substance in item (2) above; copper salt. (5) Resin-like copper compounds, i.e. substances that serve as both (b) and (d) Copper salts of saturated or unsaturated polyester resins, copper salts of vinyl chloride-vinyl acetate-maleic acid copolymers, sulfoethyl methacrylate-ethyl acrylate copper salts, copper salts of rosin resins. (6) Resin having dihydroxybenzene ring, i.e.
Substances that serve both (c) and (d) Vinyl hydroquinone polymers and copolymer resins, hydroquinone-formaldehyde phenolic resins, hydroquinone-phenol-formaldehyde phenolic resins, catechol-formaldehyde phenolic resins,
1,4-dihydroxynaphthalene-formaldehyde resin. Furthermore, as in the case of (2) above, resins that generate dihydroxybenzene rings by heating or reaction with other substances, such as adducts of vinyl hydroquinone polymer and phenyl isocyanate, and J. Polymer Sci. , part A-1, 7 ,
A mixture of bislactone and diamine of hydroquinone-2,5-bis(ethyl-2'-carboxylic acid) published by N.NAKABAYASHI et al. in 1275-1278 (1969). (7) A resinous copper compound having a dihydroxybenzene ring, that is, a substance that also serves as (b), (c), and (d): a copper salt of a vinylhydroquinone-methacrylic acid copolymer, a copper salt of the resin described in item (6) above. Among the substances that serve as (c) and (c) of the present invention described above, substances that serve as (c) and (d), and substances that serve as (b), (c), and (d) are preferable, and only (c) When using a substance that functions as (b) and (c), the change in conductivity may be a little large when the cured conductive resin is immersed in a solder bath, or the initial conductivity may be slightly inferior. This may result in performance deterioration. (8) Chelate-forming substances, that is, substances exhibiting properties as (e) Chelate-forming substances suitable for the present invention include:
The logarithm value of the stability constant Kma for divalent copper ions at 25° C. and ionic strength of 0.1 is 3 or more, preferably 5 or more. These substances include the following: 8-1 Aliphatic amines and their derivatives Ethylenediamine, N-(2-hydroxyethyl)ethylenediamine, trimethylenediamine, 1,2-diaminocyclohexane,
Triethylenetetramine, 2-aminomethylpyridine. 8-2 Aromatic polyamine Purine, adenine, 2-aminomethylpyridine, histamine. 8-3 β-diketone acetylacetone, trifluoroacetylacetone, 4,4,4-trifluoro-1-
Phenyl-1,3-butanedione, hexafluoroacetylacetone, benzoylacetone, dibenzoylmethane, 5,5-dimethyl-1,3-cyclohexanedione. 8-4 Phenolic acid compound oxine, 2-methyloxine, oxine-5-sulfonic acid, dimethylglyoxime,
1-Nitroso-2-naphthol, 2-nitroso-1-naphthol, salicylaldehyde. 8-5 Others 2,2'-dipyridine, 1,10-phenanthroline. Of course, it is also possible to use substances that have the property (e) and other properties such as (b), (c), and (d). The proportion of the copper compound used in the present invention is such that the copper content of the copper compound relative to the copper-silver composite powder is 0.1 to 30% by weight, preferably 0.2 to 10% by weight. The proportion of the reducing agent having a dihydroxybenzene ring used in the present invention is preferably 80 equivalent % or more, particularly preferably 95 equivalent % or more, based on the amount sufficient to reduce all the copper in the copper compound. The proportion of the resin used in the present invention is 5 to 60% by weight, preferably 8 to 45% by weight based on the total nonvolatile content of the composition used in the present invention. The resin used in the present invention may be solid per se, but it may be one that becomes substantially or apparently liquid upon curing by itself or in the presence of an organic solvent, water, plasticizer, etc. . Usage forms of resin include solvent type dissolved in organic solvent, water soluble type, water emulsion type, solvent emulsion type,
It may be either a 100% liquid resin type or a 100% solid resin type that becomes liquid at the temperature during curing, and is not particularly limited. The following methods may be used to cure each of these resins. That is, if these are cured while evaporating volatile substances by drying, such as room temperature drying type resins (Latzker type), or if they have (a) thermosetting properties, depending on the type, ( 1) cured by heat or (2) for resins cured by vinyl polymerization, such as unsaturated polyester resins and acrylate resins, azobisisobutyronitrile, di-t-
In the case of epoxy resins, triethylenetetramine, polyamide polyamine, diaminodicyclohexylmethane, diaminodiphenylmethane, adipic acid dihydrazide, imidazole derivatives, dicyandiamide, etc. , boron trifluoride/ethylamine complex,
Using known curing agents such as polymercapto compounds, polyhydric carboxylic acids and their anhydrides, and in the case of phenolic resins, hexamethylenetetramine,
By using a curing agent or curing accelerator such as paraformaldehyde, P-toluenesulfonic acid, etc., or by using a known dryer such as naphthenate, cobalt octylate, etc. in the case of oxidative curing type resin. (b) In the case of thermoplastic,
What is necessary is just to harden by a well-known means, respectively, by cooling after heating. In short, the resin may be cured by any known means depending on the type and nature of the resin. Note that the reducing action in the present invention is preferably exerted at the stage of curing the resin, and if this reduction reaction is too rapid or slow compared to the curing, the purpose obtained by the method of the present invention may be impaired. Since it affects the durability of the conductivity of the material, the reduction temperature is usually not high enough due to the curing conditions and workability in practical use.
The temperature is 250°C or less, preferably room temperature to 200°C, particularly preferably 50°C to 180°C. Therefore, in order to satisfy such conditions, a reducing agent having a dihydroxybenzene ring, a copper-silver composite powder, a copper compound, a resin,
What is necessary is to select a chelate-forming substance or the like. Further, the atmosphere for curing the composition of the present invention may be any atmosphere such as nitrogen, an inert gas such as carbon dioxide gas, or air, and there is no particular restriction on the atmosphere. When curing the resin in the method of the present invention,
Various known additives such as those listed below may be added in advance. For example, molecular weight regulators such as mercaptopropionic acid, carbon tetrabromide, stabilizers such as p-benzoquinone, phenothiazine, reactive diluents such as butyl glycidyl ether, phenyl glycidyl ether, dibutyl phthalate, tricresyl phosphate, etc. Noble metals belonging to group B and groups of the periodic table such as gold, silver, and palladium, and their compounds; inorganic bases such as lithium hydroxide and potassium hydroxide; dimethylbenzylamine, ethanolamine, and tris(N.N. - amino compounds such as (dimethylaminomethyl)phenol, N/N-dimethylaniline, acids such as acetic acid, oxalic acid, benzoic acid, PH regulators such as sodium orthophosphate, borax, potassium acetate, polyvinyl alcohol, polyvinylpyrrolidone. Viscosity modifiers such as potassium oleate,
Surfactants such as sodium dodecylbenzenesulfonate, polyoxyethylene lauryl ether, octadecylpyridinium chloride, solvents such as water, toluene, methyl ethyl ketone, ethylene glycol monoethyl ether, paraffin wax, carbon black, methyl ethyl ketoxime, lubricants, These include flame retardants, colorants, blowing agents, and thixotropic agents. When curing the composition of the present invention, various substrates such as polysulfone resin sheets, phenolic resin laminates, epoxy resin laminates, polyimide films, organic materials such as non-woven fabrics, glass, inorganic materials such as alumina, painted iron plates, coatings, etc. It may be applied or printed on an aluminum plate or the like and cured, or it may be formed by placing it in a mold. The conductive cured product obtained by curing the composition of the present invention may be subjected to various known protective treatments as described below, taking into consideration the intended use, environment of use, enhancement of reliability, etc. That is, such treatments include electrical or chemical plating with nickel, copper, etc., coating with epoxy resin, phenolic resin, rosin-based substances, polyethylene film, etc., surface treatment with imidazole-based processing agents, silicone-based processing agents, etc. There is. The composition of the present invention can be used in paints, adhesives, printing inks, molded products, etc., and is used in conductive circuits, crossover circuits, high frequency protection circuits, heat dissipation circuits, through-hole parts, etc. in the electrical and electronic industrial fields. It has a wide range of practical applications, such as filling, adhesion of parts, etc. in the automobile industry, dew condensation prevention circuits on windows, and heaters in the housing field, and is extremely useful industrially. Examples will be described below. Parts and % hereinafter mean parts by weight and % by weight, respectively, and concentrations described in the examples represent the proportion of the component in all components in % by weight. The "printed material by screen printing method" in the examples described below was formed by the following method. An S-shaped linear printed material having a total length of 200 mm and a width of 0.5 mm with a line interval of 0.5 mm was formed on the surface of the printing material by the following method. In other words, a film was made directly on a 180-mesh Tetron screen using a photographic engraving method so that the film thickness of the entire screen was 145 ÎŒm, and the structure was such that the screen was closed except for the necessary image lines. Create a screen for screen printing and apply the conductive composition used in each experiment to the rubber hardness.
A squeegee using No. 70 urethane rubber was used to print on the surface of the printing material, and then the material was cured under the curing conditions of each experiment to form a printed material. In addition, the resistance value and specific resistance value listed as a guide for conductivity are measured using a tester (manufactured by Yokogawa Electric Corporation, Type
â3201) Wheatstone Bridge (manufactured by Yokogawa Electric Corporation,
Type-2755) was used to measure the resistance value by contacting both ends of the cured product of the printed material, and the thickness of the cured product,
The length and width were measured and the specific resistance value was calculated. The durability tests in the examples described below were carried out using a constant temperature and humidity tester (ETAC's tabletop temperature and humidity tester JLH-
An accelerated test was conducted using a 400-40 type under the conditions of 50â, RH95%, and 1000 hours.The printed material was taken out at each time, and after being left at room temperature for 1 hour, changes in resistance and appearance were measured. did. Example 1 Each of the liquid compositions obtained in Experiment Nos. 1 to 7 below was printed by the above-mentioned "screen printing method" on the surface of each of six glass plates (thickness 1.7 mm) whose one surface had been cleaned with ethyl acetate. Each printed body obtained in this way was pre-dried at 100°C for 20 minutes in a thermostat in an air atmosphere, and then dried at 165°C. The cured coating film obtained by heating and curing for 90 minutes was left to cool at room temperature, and the resistance and specific resistance values of each were measured, and the test specimens were subsequently subjected to a durability test. Further, 100 g of each of the liquid compositions obtained in Experiment Nos. 1 to 7 below was placed in a 100 ml polyethylene container, the container was tightly stoppered, and the container was left at room temperature to observe the skinning phenomenon on the surface. The results are shown in Table 1. Experiment No. 1 (Comparative Example) (a) 110 parts of industrial copper powder (amorphous, average particle size 15ÎŒ, containing about 2% copper oxide), (b) hydroquinone modification with 80% resin dissolved in ethylene glycol monobutyl ether 42 parts of resol type phenolic resin (obtained by reacting formalin containing 2 moles of hydroquinone, 0.5 moles of phenol, and 6 moles of formaldehyde in the presence of an ammonia catalyst), A liquid composition prepared by mixing 0.2 parts of methyl)phenol and 10 parts of ethyl (d)acetoacetate. Experiment No. 2 (Example of the present invention) Other than using 110 parts of copper-silver alloy (copper content 60%, flaky shape, average particle size 13ÎŒ) and 0.5 part cupric oxide as (a) in Experiment No. 1 above. is a liquid composition having the same composition as Experiment No. 1. Experiment number 3 (example of the present invention) In the above experiment number 2, as (d) 4.4.4-
A liquid composition having the same composition except that 10 parts of trifluoro-1-phenyl-1,3-butanedione is used. Experiment No. 4 (Example of the present invention) In Experiment No. 1, copper-silver composite powder (85
Powder made by mechanically joining % electrolytic copper powder and 15% silver powder using a vibrating mill, average particle size 15 Ό, copper oxide 0.58%, flake form) The composition is the same except that 110 parts are used. Liquid composition. Experiment No. 5 (Example of the Present Invention) A liquid composition having the same composition as Experiment No. 4 except that 5 parts of 2,2'-dipyridyl and (v) 5 parts of diethylene glycol monomethyl ether were used as (d). Experiment No. 6 (Example of the present invention) In Experiment No. 2, modified resol type phenolic resin with a resin content of 80% (1.2 mol of methylhydroquinone, 0.3 mol of catechol, 0.5 mol of tert-butylphenol) dissolved in diethylene glycol monoethyl ether as (b) (obtained by reacting an aqueous formalin solution containing 4 moles of formaldehyde in the presence of an ammonia catalyst). Experiment No. 7 (Example of the Present Invention) A liquid composition having the same composition as (b) in Experiment No. 3 except that 45 parts of the modified resol type phenolic resin used in Experiment No. 6 was used. Example 2 Each liquid composition obtained in Experiment Nos. 6 and 7 in Example 1 and Experiment No. 8 below was screen printed on the surface of a glass-epoxy resin laminate having a thickness of 1.7 mm in the same manner as in Example 1. Then, the mixture was cured by heating to obtain a conductive cured coating film. Next, after measuring the resistance value of the cured coating film, it was immersed in a 260°C solder bath for a certain period of time, and after cooling to room temperature, the resistance value was measured to evaluate the solder heat resistance. The results obtained are summarized in Table 2. Experiment number 8 (a) Copper-silver alloy 110 used in experiment number 2
(b) A formalin aqueous solution containing a resol type phenolic resin (1.5 mol of phenol, 0.5 mol of tert-butylphenol, and 4 mol of formaldehyde) with a solid content of 80% dissolved in diethylene glycol monoethyl ether is reacted in the presence of an ammonia catalyst. ), (c) 7 parts of catechol, (d) 18 parts of methylhydroquinone, (v) 6 parts of diethylene glycol monomethyl ether, (h) tris(Nã»N'-dimethylaminomethyl)phenol 0.2
10 parts of ethyl (tri)acetoacetate.
ãè¡šããtableã
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70éšãå·¥æ¥çšé
ç²ïŒãã¬ãŒã¯ç¶ã325ã¡ãã·ãŠïŒ
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é10ïŒ
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žé
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ã«ãšã³æ··å溶å€ïŒæ··å容éæ¯1/1ïŒ20mlãååã«
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žïŒéšãæ·»å æ··åãå°é»
çšçµæç©ãåŸãã
ãã®å°é»çšçµæç©ãçšããŠæ¬çºæã®å®æœäŸïŒå
ã³ïŒã®æ¹æ³ã§å°å·åã³ç¡¬åããã®ã¡ãèä¹
æ§è©Šéš
åã³ãã³ãèç±æ§ã®è©äŸ¡ãè¡ã€ãã50âã95ïŒ
RHã1000æéã®è湿æ§è©Šéšã§ã¯åææµæå€400Ω
ïŒæ¯æµæå€ïŒÃ10-3Ωã»cmïŒã50KΩïŒçŽ100åïŒ
ã«äžæãããåè湿æ§è©ŠéšåŸã®ç¡¬åç©ã«ã¯ç·éãš
æãããééãå
šé¢ã«çºçããŠãããäžæ¹260â
ã®ãã³ã济ã«20ç§é浞挬ãããšãåææµæå€400
Ωã4KΩïŒ10åïŒã«äžæããã[Table] Comparative Example 2 Alcohol-soluble room temperature curing resol type phenolic resin with methanol content of 10% and cured resin content of 72% liquid
70 parts, industrial copper powder (flake form, 325 mesh)
Add phosphorus to a well-stirred mixture of 50 parts of metallic copper powder from which oxides on the surface of 4 parts of acid were added and mixed to obtain a conductive composition. After printing and curing using the conductive composition according to the methods of Examples 1 and 2 of the present invention, a durability test and an evaluation of solder heat resistance were conducted. 50â, 95%
RH, initial resistance value 400Ω in 1000 hours moisture resistance test
(specific resistance value 5Ã10 -3 Ωã»cm) is 50KΩ (approximately 100 times)
rose to Furthermore, after the moisture resistance test, the cured product had a patina that appeared to be greenish blue on the entire surface. Meanwhile 260â
When immersed in a solder bath for 20 seconds, the initial resistance value is 400.
Ω increased to 4KΩ (10 times).
Claims (1)
ïŒã»ïŒâãžãããã·ãã³ãŒã³ç°ãæããéå å€ã
(d)æš¹èãå«æããããšãç¹åŸŽãšããå°é»çšã®çµæ
ç©ã ïŒ (a)é éè€åç²ã(b)é ååç©ã(c)ïŒã»ïŒåã¯
ïŒã»ïŒâãžããããã·ãã³ãŒã³ç°ãæããéå
å€ã(d)æš¹èã(e)ãã¬ãŒã圢æç©è³ªãå«æããããš
ãç¹åŸŽãšããå°é»çšã®çµæç©ã[Claims] 1 (a) copper-silver composite powder, (b) copper compound, (c) reducing agent having a 1,4- or 1,2-didroxybenzene ring,
(d) A conductive composition characterized by containing a resin. 2 Contains (a) copper-silver composite powder, (b) copper compound, (c) reducing agent having 1,4 or 1,2-dihydroxybenzene ring, (d) resin, and (e) chelate-forming substance. Characteristic conductive compositions.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21589681A JPS58117605A (en) | 1981-12-29 | 1981-12-29 | Conductive composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21589681A JPS58117605A (en) | 1981-12-29 | 1981-12-29 | Conductive composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58117605A JPS58117605A (en) | 1983-07-13 |
JPS627641B2 true JPS627641B2 (en) | 1987-02-18 |
Family
ID=16680044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21589681A Granted JPS58117605A (en) | 1981-12-29 | 1981-12-29 | Conductive composition |
Country Status (1)
Country | Link |
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JP (1) | JPS58117605A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5161545A (en) * | 1974-11-27 | 1976-05-28 | Mitsui Toatsu Chemicals | |
JPS5193394A (en) * | 1975-02-13 | 1976-08-16 | DODENYO SOSEIBUTSU |
-
1981
- 1981-12-29 JP JP21589681A patent/JPS58117605A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5161545A (en) * | 1974-11-27 | 1976-05-28 | Mitsui Toatsu Chemicals | |
JPS5193394A (en) * | 1975-02-13 | 1976-08-16 | DODENYO SOSEIBUTSU |
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Publication number | Publication date |
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JPS58117605A (en) | 1983-07-13 |
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