JPS6275064U - - Google Patents
Info
- Publication number
- JPS6275064U JPS6275064U JP16634685U JP16634685U JPS6275064U JP S6275064 U JPS6275064 U JP S6275064U JP 16634685 U JP16634685 U JP 16634685U JP 16634685 U JP16634685 U JP 16634685U JP S6275064 U JPS6275064 U JP S6275064U
- Authority
- JP
- Japan
- Prior art keywords
- substrate support
- substrate
- support device
- heat
- resistant insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 18
- 238000012856 packing Methods 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims 2
- 229910052582 BN Inorganic materials 0.000 claims 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- 239000004809 Teflon Substances 0.000 claims 1
- 229920006362 Teflon® Polymers 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Description
第１図は本考案の蒸着用基板ホルダーの１態様
を、基板装着状態で組立図として示した模式的な
図であり、第２図ａ〜ｇは第１図の分解図であり
第３図ａ〜ｄは本考案において有利なパツキン部
材の第１図または第２図とは別の態様を説明する
ための図であり、第４図ａは従来の基板ホルダー
を用いて形成した薄膜に生ずる樹枝状欠陥を説明
するための図であり、ｂは本考案の実施例で得ら
れた薄膜の状態を示す図である。
〔主な参照番号〕、１，２…基板支持部材、３
，４…基板押え部材、５，６…耐熱絶縁パツキン
グ部材、７…基板。
FIG. 1 is a schematic diagram showing an embodiment of the evaporation substrate holder of the present invention in an assembled state with a substrate attached, FIGS. 2a to 2g are exploded views of FIG. 1, and FIG. Figures a to d are diagrams for explaining an embodiment of the packing member that is advantageous in the present invention, different from that shown in Figures 1 and 2, and Figure 4a is a diagram showing the effect of a thin film formed using a conventional substrate holder. FIG. 3 is a diagram for explaining dendritic defects, and b is a diagram showing the state of a thin film obtained in an example of the present invention. [Main reference numbers], 1, 2...Substrate support member, 3
, 4... Board holding member, 5, 6... Heat resistant insulating packing member, 7... Board.
補正 昭６１．２．１８ 考案の名称を次のように補正する。 考案の名称 蒸着用基板支持器具Correction 18th February 1986 The name of the invention is amended as follows. Name of invention Substrate support device for deposition
Claims (1)
蒸着基板支持用空間を有する基板支持部材におい
て蒸着基板が耐熱絶縁パツキンを介して支持され
、且つ蒸着源側基板支持部材に電気的絶縁性の高
いセラミツクスを用いることを特徴とする蒸着用
基板支持器具。 (2) 前記耐熱絶縁パツキン部材が基板の上下両
面周縁部に配置されるリング状部材であることを
特徴とする実用新案登録請求の範囲第１項記載の
基板支持器具。 (3) 前記耐熱絶縁パツキン部材が、コの字型断
面形状を有する環状部材であることを特徴とする
実用新案登録請求の範囲第１項記載の基板支持器
具。 (4) 前記耐熱絶縁パツキン部材が、テフロンま
たはカプトン製であることを特徴とする実用新案
登録請求の範囲第１項に記載の基板支持器具。 (5) 前記一対の基板支持部材がバネを介して挾
圧されることを特徴とする実用新案登録請求の範
囲第１項に記載の基板支持器具。 (6) 前記蒸着源側基板支持部材が窒化硼素製で
あることを特徴とする実用新案登録請求の範囲第
１項に記載の基板支持器具。[Claims for Utility Model Registration] (1) The vapor deposition substrate is supported via a heat-resistant insulating packing in the substrate support member which can be pressed together and has a space for supporting the vapor deposition substrate in the middle part when they are pinched, and A device for supporting a substrate for deposition, characterized in that a ceramic with high electrical insulation is used for a substrate support member on the side of the deposition source. (2) The substrate support device according to claim 1, wherein the heat-resistant insulating packing member is a ring-shaped member disposed on the peripheral edges of both upper and lower surfaces of the substrate. (3) The substrate support device according to claim 1, wherein the heat-resistant insulating packing member is an annular member having a U-shaped cross section. (4) The substrate support device according to claim 1, wherein the heat-resistant insulating packing member is made of Teflon or Kapton. (5) The substrate support device according to claim 1, wherein the pair of substrate support members are clamped together by a spring. (6) The substrate support device according to claim 1, wherein the deposition source side substrate support member is made of boron nitride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16634685U JPS6275064U (en) | 1985-10-28 | 1985-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16634685U JPS6275064U (en) | 1985-10-28 | 1985-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6275064U true JPS6275064U (en) | 1987-05-14 |
Family
ID=31097228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16634685U Pending JPS6275064U (en) | 1985-10-28 | 1985-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6275064U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012140681A (en) * | 2010-12-28 | 2012-07-26 | Sharp Corp | Fixing jig |
-
1985
- 1985-10-28 JP JP16634685U patent/JPS6275064U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012140681A (en) * | 2010-12-28 | 2012-07-26 | Sharp Corp | Fixing jig |
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