JPS6274338U - - Google Patents

Info

Publication number
JPS6274338U
JPS6274338U JP16777685U JP16777685U JPS6274338U JP S6274338 U JPS6274338 U JP S6274338U JP 16777685 U JP16777685 U JP 16777685U JP 16777685 U JP16777685 U JP 16777685U JP S6274338 U JPS6274338 U JP S6274338U
Authority
JP
Japan
Prior art keywords
plating
plating tank
semiconductor
rotating blade
vortex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16777685U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16777685U priority Critical patent/JPS6274338U/ja
Publication of JPS6274338U publication Critical patent/JPS6274338U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP16777685U 1985-10-29 1985-10-29 Pending JPS6274338U (US07943777-20110517-C00090.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16777685U JPS6274338U (US07943777-20110517-C00090.png) 1985-10-29 1985-10-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16777685U JPS6274338U (US07943777-20110517-C00090.png) 1985-10-29 1985-10-29

Publications (1)

Publication Number Publication Date
JPS6274338U true JPS6274338U (US07943777-20110517-C00090.png) 1987-05-13

Family

ID=31100025

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16777685U Pending JPS6274338U (US07943777-20110517-C00090.png) 1985-10-29 1985-10-29

Country Status (1)

Country Link
JP (1) JPS6274338U (US07943777-20110517-C00090.png)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01128548A (ja) * 1987-11-13 1989-05-22 Fujitsu Ltd メッキ装置
JP2006028629A (ja) * 2004-07-21 2006-02-02 Electroplating Eng Of Japan Co めっき方法及びめっき装置
JP2012126966A (ja) * 2010-12-16 2012-07-05 Mitomo Semicon Engineering Kk カップ型めっき装置及びめっき方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01128548A (ja) * 1987-11-13 1989-05-22 Fujitsu Ltd メッキ装置
JP2006028629A (ja) * 2004-07-21 2006-02-02 Electroplating Eng Of Japan Co めっき方法及びめっき装置
JP2012126966A (ja) * 2010-12-16 2012-07-05 Mitomo Semicon Engineering Kk カップ型めっき装置及びめっき方法

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