JPS6273563U - - Google Patents
Info
- Publication number
- JPS6273563U JPS6273563U JP16629185U JP16629185U JPS6273563U JP S6273563 U JPS6273563 U JP S6273563U JP 16629185 U JP16629185 U JP 16629185U JP 16629185 U JP16629185 U JP 16629185U JP S6273563 U JPS6273563 U JP S6273563U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- convex lens
- emitting element
- optical axis
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16629185U JPS6273563U (me) | 1985-10-28 | 1985-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16629185U JPS6273563U (me) | 1985-10-28 | 1985-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6273563U true JPS6273563U (me) | 1987-05-11 |
Family
ID=31097124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16629185U Pending JPS6273563U (me) | 1985-10-28 | 1985-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6273563U (me) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004042833A1 (ja) * | 2002-11-05 | 2004-05-21 | Matsushita Electric Industrial Co., Ltd. | 発光ダイオード |
| JP2013529392A (ja) * | 2010-06-09 | 2013-07-18 | ベイジン アイルタッチ システムズ カンパニー，リミティド | 赤外線発光ダイオードとタッチスクリーン |
-
1985
- 1985-10-28 JP JP16629185U patent/JPS6273563U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004042833A1 (ja) * | 2002-11-05 | 2004-05-21 | Matsushita Electric Industrial Co., Ltd. | 発光ダイオード |
| JP2013529392A (ja) * | 2010-06-09 | 2013-07-18 | ベイジン アイルタッチ システムズ カンパニー，リミティド | 赤外線発光ダイオードとタッチスクリーン |