JPS6273551U - - Google Patents

Info

Publication number
JPS6273551U
JPS6273551U JP1985163691U JP16369185U JPS6273551U JP S6273551 U JPS6273551 U JP S6273551U JP 1985163691 U JP1985163691 U JP 1985163691U JP 16369185 U JP16369185 U JP 16369185U JP S6273551 U JPS6273551 U JP S6273551U
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor package
input
output terminals
ceramic plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985163691U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0333074Y2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985163691U priority Critical patent/JPH0333074Y2/ja
Publication of JPS6273551U publication Critical patent/JPS6273551U/ja
Application granted granted Critical
Publication of JPH0333074Y2 publication Critical patent/JPH0333074Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
JP1985163691U 1985-10-24 1985-10-24 Expired JPH0333074Y2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985163691U JPH0333074Y2 (cg-RX-API-DMAC7.html) 1985-10-24 1985-10-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985163691U JPH0333074Y2 (cg-RX-API-DMAC7.html) 1985-10-24 1985-10-24

Publications (2)

Publication Number Publication Date
JPS6273551U true JPS6273551U (cg-RX-API-DMAC7.html) 1987-05-11
JPH0333074Y2 JPH0333074Y2 (cg-RX-API-DMAC7.html) 1991-07-12

Family

ID=31092127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985163691U Expired JPH0333074Y2 (cg-RX-API-DMAC7.html) 1985-10-24 1985-10-24

Country Status (1)

Country Link
JP (1) JPH0333074Y2 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015126168A (ja) * 2013-12-27 2015-07-06 三菱電機株式会社 パワーモジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015126168A (ja) * 2013-12-27 2015-07-06 三菱電機株式会社 パワーモジュール

Also Published As

Publication number Publication date
JPH0333074Y2 (cg-RX-API-DMAC7.html) 1991-07-12

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