JPS6270452U - - Google Patents
Info
- Publication number
- JPS6270452U JPS6270452U JP16219885U JP16219885U JPS6270452U JP S6270452 U JPS6270452 U JP S6270452U JP 16219885 U JP16219885 U JP 16219885U JP 16219885 U JP16219885 U JP 16219885U JP S6270452 U JPS6270452 U JP S6270452U
- Authority
- JP
- Japan
- Prior art keywords
- package
- circuit board
- input
- output terminals
- storing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａおよびｂは本考案の一実施例の斜視図
および側面図を示し、第２図ａおよびｂは従来例
の斜視図および側面図を示す。 １：収納ケース、２，３：入出力端子、４：プ
リント配線基板。
および側面図を示し、第２図ａおよびｂは従来例
の斜視図および側面図を示す。 １：収納ケース、２，３：入出力端子、４：プ
リント配線基板。
Claims (1)
- 半導体集積回路基板を収納するパツケージにお
いて、該パツケージに固定された複数の入出力端
子を、交互にプリント基板上に取付けできるよう
に折り曲げ角度を変えて成形したことを特徴とす
る半導体集積回路用パツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16219885U JPS6270452U (ja) | 1985-10-22 | 1985-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16219885U JPS6270452U (ja) | 1985-10-22 | 1985-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6270452U true JPS6270452U (ja) | 1987-05-02 |
Family
ID=31089233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16219885U Pending JPS6270452U (ja) | 1985-10-22 | 1985-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6270452U (ja) |
-
1985
- 1985-10-22 JP JP16219885U patent/JPS6270452U/ja active Pending