JPS6267692U - - Google Patents
Info
- Publication number
- JPS6267692U JPS6267692U JP15800485U JP15800485U JPS6267692U JP S6267692 U JPS6267692 U JP S6267692U JP 15800485 U JP15800485 U JP 15800485U JP 15800485 U JP15800485 U JP 15800485U JP S6267692 U JPS6267692 U JP S6267692U
- Authority
- JP
- Japan
- Prior art keywords
- solder piece
- solder
- joining
- small
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Description
第１図はこの考案の一実施例による半田小片を
示す断面図、第２図はこの考案または従来の半田
小片を用いた半導体素子の組立方法を説明するた
めの工程断面図、第３図は従来の半田小片の断面
図である。 １……半田小片、１１―ａ，１１―ｂ……融点
の低い半田。
示す断面図、第２図はこの考案または従来の半田
小片を用いた半導体素子の組立方法を説明するた
めの工程断面図、第３図は従来の半田小片の断面
図である。 １……半田小片、１１―ａ，１１―ｂ……融点
の低い半田。
Claims (1)
- 両部品の接合に使用する半田小片において、該
半田小片の母材より融点の低い半田を半田小片の
接合面に一体成形したことを特徴とする半田小片
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985158004U JPH0713913Y2 (ja) | 1985-10-16 | 1985-10-16 | 半田小片 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985158004U JPH0713913Y2 (ja) | 1985-10-16 | 1985-10-16 | 半田小片 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6267692U true JPS6267692U (ja) | 1987-04-27 |
| JPH0713913Y2 JPH0713913Y2 (ja) | 1995-04-05 |
Family
ID=31081081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985158004U Expired - Lifetime JPH0713913Y2 (ja) | 1985-10-16 | 1985-10-16 | 半田小片 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0713913Y2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007109834A (ja) * | 2005-10-13 | 2007-04-26 | Fuji Electric Holdings Co Ltd | 半導体装置およびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56155447U (ja) * | 1980-04-17 | 1981-11-20 |
-
1985
- 1985-10-16 JP JP1985158004U patent/JPH0713913Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56155447U (ja) * | 1980-04-17 | 1981-11-20 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007109834A (ja) * | 2005-10-13 | 2007-04-26 | Fuji Electric Holdings Co Ltd | 半導体装置およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0713913Y2 (ja) | 1995-04-05 |