JPS6267670U - - Google Patents
Info
- Publication number
- JPS6267670U JPS6267670U JP15984185U JP15984185U JPS6267670U JP S6267670 U JPS6267670 U JP S6267670U JP 15984185 U JP15984185 U JP 15984185U JP 15984185 U JP15984185 U JP 15984185U JP S6267670 U JPS6267670 U JP S6267670U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- laser beam
- laser
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000779 smoke Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 230000003287 optical effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15984185U JPS6267670U (enrdf_load_stackoverflow) | 1985-10-18 | 1985-10-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15984185U JPS6267670U (enrdf_load_stackoverflow) | 1985-10-18 | 1985-10-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6267670U true JPS6267670U (enrdf_load_stackoverflow) | 1987-04-27 |
Family
ID=31084653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15984185U Pending JPS6267670U (enrdf_load_stackoverflow) | 1985-10-18 | 1985-10-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6267670U (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008277438A (ja) * | 2007-04-26 | 2008-11-13 | Ricoh Microelectronics Co Ltd | 電子部品、基板、並びに、電子部品及び基板の製造方法 |
JP2009156663A (ja) * | 2007-12-26 | 2009-07-16 | Tohken Co Ltd | 被検査物の温度制御機能を有するx線検査装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58168472A (ja) * | 1982-03-31 | 1983-10-04 | Toshiba Corp | レ−ザはんだ付け方法 |
-
1985
- 1985-10-18 JP JP15984185U patent/JPS6267670U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58168472A (ja) * | 1982-03-31 | 1983-10-04 | Toshiba Corp | レ−ザはんだ付け方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008277438A (ja) * | 2007-04-26 | 2008-11-13 | Ricoh Microelectronics Co Ltd | 電子部品、基板、並びに、電子部品及び基板の製造方法 |
JP2009156663A (ja) * | 2007-12-26 | 2009-07-16 | Tohken Co Ltd | 被検査物の温度制御機能を有するx線検査装置 |