JPS6267550A - Exposuring mask - Google Patents

Abstract

PURPOSE:To obtain an exposuring mask impervious to reseparation by providing a filling film burying the damaged defective part of a metallic film pattern. CONSTITUTION:A positive photoresist 4 is applied to the entire surface of the exposure mask where a pattern 2 has the damaged defective part 3b. The spot exposure part 4a of the resist 4 is obtained in such a way as to cover the overall defective part 3b. At this time, exposure is preferably made through the use of ultraviolet or X-ray laser which can freely control an irradiation position in accordance with the size and position of the defect previously obtained in a pattern defect inspection step. The pattern of the resist 4 having a larger opening than the defect part 3b. The part of the pattern 2 is removed by dry etching, etc. When a chromium carbide film 3c deposits on the entire surface by spattering, etc., to remove the resist 4, it is simultaneously removed, and the filling film 3a buried in a part previously dry-etched in the pattern 2 remains in the entire chromium carbide 3c.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an exposure mask in which a pattern defect repaired portion is made difficult to peel off again.

[Conventional technology]

FIG. 2 is a sectional view showing an exposure mask for correcting a conventional pattern defect shown in, for example, Japanese Patent Application Laid-Open No. 56-93324, in which (1) is an insulating substrate; Here, a quartz substrate, (2) a metal film pattern,
(3) is a repaired portion of the metal film pattern (2) in which the vicinity of a defective portion generally called a pinhole is melted with a laser beam to fill the defective portion.

As mentioned above, the conventional exposure mask is a mask that corrects the defective parts of the pattern, so when exposing the photoresist during the semiconductor manufacturing process, it reduces the light leaking from the defective parts and prevents unintended exposed parts. It is designed to eliminate the occurrence of

[Problem that the invention seeks to solve]

In the conventional exposure mask as mentioned above, the correction part (3)
However, there was a problem in that it was easy to peel off again during ultrasonic cleaning. The reason for this is that the pattern (2) is made of metal and has a significantly different coefficient of thermal expansion from the quartz of the substrate (1). ) is thought to have insufficient adhesion for some reason, leading to peeling.

The present invention was made to solve this problem, and an object of the present invention is to provide an exposure mask that is less likely to be peeled off again.

[Means for solving problems]

The exposure mask according to the present invention includes a metal pattern film provided on an insulating substrate, and a metal carbide filling film filled in the defective portion of the metal film pattern.

[For production]

In this invention, the compensation film that fills the defective portion of the metal film pattern is made of metal carbide whose coefficient of thermal expansion is relatively similar to that of the insulating substrate, and its internal stress can be made relatively small, so that it does not peel off from the insulating substrate. Make it difficult.

〔Example〕

FIG. 1 is a cross-sectional view showing one embodiment of the present invention, (3
a) is a compensation film filled after removing the missing defective part of the metal film pattern (2) and the surrounding part,
This part corresponds to the modified part (3) of the conventional one, and is a chromium carbide (CrsC*) film in this embodiment, and all other symbols are the same as those of the conventional one.

An example of the manufacturing process for obtaining the structure shown in FIG. 1 will be explained using FIGS. 3(a) to 3(a). First, a positive type 7 photoresist (4) is applied to the entire surface of the exposure mask where the defective portion (3b) exists in the pattern (2) shown in FIG. 3(a), as shown in FIG. As shown in Figure (C), a spot exposed portion (4a) of the resist (4) is obtained so as to cover the entire defective portion (3b). At that time, according to the size and position of the defect determined in advance in the pattern defect inspection process,
It is desirable to perform exposure using ultraviolet rays or an X-ray laser whose irradiation position can be freely controlled. If we imagine this, we can obtain a pattern of resist l-(41) with a larger opening than the defective part (3b) as shown in Figure (d). Using this as a mask, we perform dry ion etching, etc., as shown in Figure (e). , remove the pattern (2). A chromium carbide film (3C) is deposited on the entire surface by sputtering or the like as shown in Figure (f). When the resist (4) is removed, the chromium carbide film (3C) on the resist (4) is removed. ) was also removed at the same time, and as shown in Figure (g), the above-mentioned compensation film (3a) embedded in the dry ion etched portion of the pattern (2) of the chromium carbide film (3c) was left behind. , the structure shown in FIG. 1 mentioned above is obtained.

Since this example was constructed as described above, the filling film (3a
) closes the missing defective portion (3b) in the same way as in the conventional one, thereby eliminating the occurrence of unintended exposed portions during exposure of the photoresist during the semiconductor manufacturing process.

As can be seen from the above explanation, the supplementary film (3 &) is the substrate (
It is made to contact not only the part where the defect (1) has occurred (this part is likely to peel off easily for some reason), but also the surrounding parts, and the quartz etc. of the substrate (1) Since it is made of chromium carbide, which does not have a large difference in coefficient of thermal expansion between the insulator and the metal such as chromium of the metal film pattern (2), re-peeling is less likely to occur than with conventional products. It is clear that the above problems will be solved.

In the above embodiment, the material of the filling film (3a) is chromium carbide, but for example, molybdenum, molybdenum,
It may also be a carbide of other metals such as tungsten.

Further, in the above embodiment, the filling film (3a) is filled in the area where the defective part of the pattern (2) and its surroundings have been removed.
1) It goes without saying that even if the residue of the pattern (2) on the surface is not removed, the effect of using metal carbide as the material of the filling film (3a) can be obtained.

〔Effect of the invention〕

As explained above, the present invention has the effect of providing an exposure mask that is less likely to be peeled off again by reducing the internal stress of the compensation film that fills the defective portion of the metal film pattern.

[Brief explanation of drawings]

In the figure, (1) is an insulating substrate, (2) is a metal film pattern, and (3a) is a supplementary film. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Claims] (1) An exposure mask comprising a metal film pattern provided on an insulating substrate and a metal carbide compensation film that fills in the defective portions of the metal film pattern.