JPS6269269A - Mask for exposure - Google Patents

Abstract

PURPOSE:To obtain an exposure mask which is hardly peeled off again by bringing a supplementary film into direct contact with an insulator substrate which is exposed by removing selectively a defect and a deficit part of a pattern film. CONSTITUTION:The supplementary film 8a provided after the defect and deficit parts and their peripheries of the metallic pattern film are removed is a chromimum film. The supplementary film 3a contacts directly the surface of the substrate 1 at the defect and deficit parts of the pattern 2, so it is stuck more tightly. Further, the same effect is obtained by removing only part of the defect and deficit parts.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an exposure mask ζ in which a pattern defect correction portion is made difficult to peel off again.

[Conventional technology]

FIG. 2 is a cross-sectional view showing an exposure mask for correcting a conventional pattern loss defect disclosed in, for example, Japanese Unexamined Patent Publication No. 56-9111824. In the figure, (1) is an insulating substrate; Here, the quartz substrate, (21 is a pattern film, here is a metal pattern M such as chromium, and ta+ is a defect defect formed by melting the vicinity of a defective part generally called a 1ζ pinhole in the metal pattern film (2) with a laser beam. This is a modified part that has been filled in.

Conventional exposure masks are made by correcting the defective portions of the Cζ pattern as described above, so they reduce the light leaking from the Cζ defective portions during exposure of the photoresist during the semiconductor manufacturing process, and eliminate unintended exposed portions. It is designed to eliminate the occurrence.

[Problem that the invention seeks to solve]

The conventional exposure mask as described above has a problem in that the repaired portion (3) is likely to be peeled off again during ultrasonic cleaning.

The reason for this is that there is a residue on the surface of the insulator substrate (1) at the defective part of the patterned film +21, and this is repaired by re-melting and attaching the material of the pattern @ (21) around the defective part using a laser. It is considered that the adhesion force of portion (3) to the substrate fζ is reduced.

This invention was made in order to solve the above-mentioned problems, and it selectively removes defective parts of the pattern film (2), eliminates the decrease in adhesion, and makes it difficult to peel off again. The purpose is to obtain a mask.

[Means for solving problems]

The exposure mask according to the present invention 1ζ is such that a patterned film is provided on an insulating substrate, and the missing defective portion Fζ of the patterned film that is selectively removed until the surface of the insulating substrate is exposed is filled up. It is.

[Effect]

In this invention iζ, the compensation film selectively removes the missing defective portion of the pattern film and is brought into direct contact with the exposed insulating substrate so that it is more firmly attached.

〔Example〕

FIG. 1 is a cross-sectional view showing an embodiment of the present invention.
a) is a filling film filled with ζ after removing the defective part of the metal pattern film (2) and the surrounding parts, which corresponds to the corrected part (3) fζ of the conventional one,
In this embodiment, it is a chromium film, and all other symbols are the same as those of the conventional one.

An example of the manufacturing process for obtaining the structure shown in FIG. 1 will be explained using FIGS. 8(a) to ω. First, the hot exposed portion (4a) of the positive photoresist t4+ is obtain. In this case, it is preferable to use an ultraviolet ray or an X-ray laser whose irradiation position can be freely controlled according to the size and position of the defect determined in advance in the pattern defect inspection process. When this is developed, the defective area (8
b) Resist +41 pattern with larger openings is obtained. The pattern (2) portion is removed by mask 1ζ dry ion etching or the like as shown in Figure (e). The entire surface fζ chromium IE(ae)lP[J(1) is deposited by sputtering or the like. 1/When cyst (4) is removed,
The chromium film on this is removed and the chromium film (
8C), the above-mentioned filling film (8C) is embedded in the dry-etched portion Cζ in pattern (2).
a) is left and the structure shown in FIG. 1 described above is obtained.

Since this example was constructed as described above, the filling film (3a)
Since the mask fills up the defective portion, a corrected exposure mask similar to the conventional one can be obtained.

As can be seen from the above explanation, the filling film (8a) has a pattern (
It is clear that since the defective portion 2) is in direct contact with the surface of the substrate (1), fζ can be more firmly attached and the above-mentioned problem can be solved.

In the above example, the missing defective part of pattern (2) and its surroundings were removed and the 1ζ filling film (8a) was filled in, but the same effect could be obtained even if only a part of the missing defective part was removed. It is clear that it has.

Furthermore, in the above embodiment, the case where Eζ is described is that both the filling film (8a) and the metal pattern film (2) are made of chromium, but each may be made of other opaque materials such as metals such as molybdenum tungsten or carbides thereof. A-] has the same effect.

Further, in the above embodiment, the supplementary film (3a) is the patterned film (2).
The removed part 1ζ was able to fit exactly, but
It may protrude beyond this part.

〔Effect of the invention〕

As explained above, in this invention, the defective portion of the patterned film is selectively removed and the compensation film is brought into direct contact with the exposed insulating substrate, so that the compensation film adheres more firmly to εζ, thereby preventing re-peeling. This has the effect of providing a cheap exposure mask.

[Brief explanation of drawings]

@ Figure 1 is a sectional view showing an embodiment of this invention, Figure 2 is a sectional view showing a conventional exposure mask, and Figure 3 (a) or 2) shows the structure of Figure 1 of this invention. It is a series of sectional views showing an example of a manufacturing process. In the figure (ζ), (1) is an insulating substrate, (2) is a pattern film, and (8a) is a supplementary film. In each figure, the same reference numerals indicate the same or corresponding parts.

Claims (1)

[Claims] (1) An exposure mask comprising a pattern film provided on an insulator substrate and a compensation film that fills in the defective portion of the pattern film that has been selectively removed until the surface of the insulator substrate is exposed.