JPS6265840U - - Google Patents
Info
- Publication number
- JPS6265840U JPS6265840U JP15791385U JP15791385U JPS6265840U JP S6265840 U JPS6265840 U JP S6265840U JP 15791385 U JP15791385 U JP 15791385U JP 15791385 U JP15791385 U JP 15791385U JP S6265840 U JPS6265840 U JP S6265840U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- power supply
- utility
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
- H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
- H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
- H01L2224/02165—Reinforcing structures
- H01L2224/02166—Collar structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985157913U JPH073642Y2 (ja) | 1985-10-16 | 1985-10-16 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985157913U JPH073642Y2 (ja) | 1985-10-16 | 1985-10-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6265840U true JPS6265840U (US07923587-20110412-C00022.png) | 1987-04-23 |
| JPH073642Y2 JPH073642Y2 (ja) | 1995-01-30 |
Family
ID=31080903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985157913U Expired - Lifetime JPH073642Y2 (ja) | 1985-10-16 | 1985-10-16 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073642Y2 (US07923587-20110412-C00022.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003289104A (ja) * | 2002-03-28 | 2003-10-10 | Ricoh Co Ltd | 半導体装置の保護回路及び半導体装置 |
| JP2006245596A (ja) * | 2006-04-03 | 2006-09-14 | Ricoh Co Ltd | 半導体装置 |
| JP2013238453A (ja) * | 2012-05-14 | 2013-11-28 | Nippon Soken Inc | 磁気センサ |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5226189A (en) * | 1975-08-25 | 1977-02-26 | Hitachi Ltd | Semi-conductor unit of multilayer wiring structure |
-
1985
- 1985-10-16 JP JP1985157913U patent/JPH073642Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5226189A (en) * | 1975-08-25 | 1977-02-26 | Hitachi Ltd | Semi-conductor unit of multilayer wiring structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003289104A (ja) * | 2002-03-28 | 2003-10-10 | Ricoh Co Ltd | 半導体装置の保護回路及び半導体装置 |
| JP2006245596A (ja) * | 2006-04-03 | 2006-09-14 | Ricoh Co Ltd | 半導体装置 |
| JP2013238453A (ja) * | 2012-05-14 | 2013-11-28 | Nippon Soken Inc | 磁気センサ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH073642Y2 (ja) | 1995-01-30 |
