JPS6265732A - Mechanism for removing deposit layer for shroud - Google Patents

Mechanism for removing deposit layer for shroud

Info

Publication number
JPS6265732A
JPS6265732A JP20596285A JP20596285A JPS6265732A JP S6265732 A JPS6265732 A JP S6265732A JP 20596285 A JP20596285 A JP 20596285A JP 20596285 A JP20596285 A JP 20596285A JP S6265732 A JPS6265732 A JP S6265732A
Authority
JP
Japan
Prior art keywords
shroud
hammer
wall
vacuum
deposit layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20596285A
Other languages
Japanese (ja)
Inventor
Shigeji Ohashi
大橋 茂治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissin Electric Co Ltd
Original Assignee
Nissin Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissin Electric Co Ltd filed Critical Nissin Electric Co Ltd
Priority to JP20596285A priority Critical patent/JPS6265732A/en
Publication of JPS6265732A publication Critical patent/JPS6265732A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/006Processes utilising sub-atmospheric pressure; Apparatus therefor

Abstract

PURPOSE:To remove a deposit layer on the inner wall of a shroud without turning off a vacuum by providing a hammer for hammering the shroud provided in a vacuum vessel from the outside of the vacuum vessel and a bellows for vacuum-sealing the hammer. CONSTITUTION:One end of the hammer 11 is hit by hand, for example, to move the hammer 11 up and down as shown by the arrow A and the shroud 2 is hammered by the other end of the hammer to remove the deposit layer 6 stuck on the inner wall 22 of the shroud 2. Consequently, the deposit layer 6 stuck on the inner wall 22 of the shroud 2 is struck down from the inner wall 22. Since the shroud 2 is usually inclined or directed downward, the deposit layer 6 struck down is dropped from the shroud 2. Besides, an opening 14 for dropping the deposit layer 6, for example, can be provided, as required, at the lower part of the shroud 2.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、例えば分子線エピタキシー装置における液
体窒素シュラウドの内壁に付着した堆積層を、当該シュ
ラウドを収納する成長室の真空を破ることなく除去する
ことができるようにしたシュラウド用堆積層除去機構に
関する。
[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method for removing a deposited layer attached to the inner wall of a liquid nitrogen shroud in, for example, a molecular beam epitaxy apparatus without breaking the vacuum of a growth chamber housing the shroud. The present invention relates to a shroud deposit layer removal mechanism that allows the removal of shroud layers.

〔従来の技術〕[Conventional technology]

第3図は、分子線エピタキシー装置におけるシュラウド
回りの一例を示す概略斜視図である。分子線エピタキシ
ー装置は、超高真空(例えば10−1°Torr程度)
に排気される成長室(真空容器、図示省略)内において
、1または複数の分子線源4からの分子線5を基板3に
入射堆積させてエピタキシャル層を成長させるものであ
り、通常、基板3の周囲は例えば図のような円筒状のシ
ュラウド(液体窒素シュラウド)2で覆っており、これ
によって迷走蒸発物等を吸着除去するようにしている。
FIG. 3 is a schematic perspective view showing an example of a shroud and its surroundings in a molecular beam epitaxy apparatus. Molecular beam epitaxy equipment uses ultra-high vacuum (e.g. about 10-1° Torr)
In a growth chamber (vacuum vessel, not shown) that is evacuated to The periphery is covered with, for example, a cylindrical shroud (liquid nitrogen shroud) 2 as shown in the figure, which adsorbs and removes stray evaporated substances.

その場合、シュラウド2の外壁21、内壁22間に、冷
媒として例えば液体窒素が供給される。
In that case, liquid nitrogen, for example, is supplied as a refrigerant between the outer wall 21 and the inner wall 22 of the shroud 2.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

運転継続に伴って上記シュラウド2の内壁22には、例
えばヒ素、リン等の堆積層6が吸着・蓄積される。これ
を放置すると当該シュラウド2の吸着能力が低下して真
空劣化等の原因になるだけでなく、堆積層6の一部が薄
片(フレーク)となって剥離して基板3に付着してその
表面に形成される結晶に欠陥を生じさせたり、配置によ
っては分子線源4内にも落下して蒸発材料中に不純物を
混入させたりする原因にもなる。
As the operation continues, a deposited layer 6 of, for example, arsenic, phosphorus, etc. is adsorbed and accumulated on the inner wall 22 of the shroud 2. If this is left unattended, not only will the adsorption capacity of the shroud 2 decrease and cause vacuum deterioration, but also a portion of the deposited layer 6 will become flakes and peel off, adhering to the substrate 3 and its surface. This may cause defects in the crystals formed, or depending on the arrangement, it may fall into the molecular beam source 4 and cause impurities to be mixed into the evaporation material.

これを防止するためには、時々堆積層6の除去作業を行
う必要がある。しかしながらそのためには従来は、シュ
ラウド2等を収納している成長室の真空を一旦破ってそ
の除去作業をする必要があり、しかも作業後は成膜室の
真空を再立上げするのに非常に長時間(例えば10−”
 To r r程度に立上げるのに1週間程度)を要す
るため非常に能率が悪いといった問題があった。
In order to prevent this, it is necessary to remove the deposited layer 6 from time to time. However, in order to do this, conventionally, it was necessary to once break the vacuum in the growth chamber that houses the shroud 2, etc., and remove it, and it was extremely difficult to restore the vacuum in the deposition chamber after the work. for a long time (e.g. 10-”
There was a problem in that the efficiency was very low because it took about one week to raise the temperature to about Torr.

そこでこの発明は、シュラウドを収納する真空容器の真
空を破ることなく真空容器の内壁に付着した堆積層を除
去することができるシュラウド用堆積層除去機構を提供
することを目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide a shroud deposit layer removal mechanism that can remove the deposited layer adhered to the inner wall of a vacuum container without breaking the vacuum of the vacuum container housing the shroud.

〔問題点を解決するだめの手段〕[Failure to solve the problem]

この発明のシュラウド用堆積層除去殿構は、真空容器内
に設けられたシュラウドを真空容器外から叩くためのハ
ンマーと、当該ハンマーを真空シールするベローズとを
備えることを特徴とする。
The deposited layer removing structure for a shroud of the present invention is characterized by comprising a hammer for hitting a shroud provided in a vacuum vessel from outside the vacuum vessel, and a bellows for vacuum sealing the hammer.

〔作用〕 ハンマーによって、大気側から真空容器の真空気密を保
った状態でシュラウドを叩くことができ、これによって
シュラウド内壁に付着していた堆積層はそこから叩き落
とされる。従って堆積層除去作業の能率が非常に良い。
[Operation] The shroud can be struck from the atmosphere side with a hammer while keeping the vacuum container vacuum-tight, thereby knocking off the deposited layer adhering to the inner wall of the shroud. Therefore, the efficiency of removing the deposited layer is very high.

〔実施例〕〔Example〕

第1図は、成長室にこの発明の一実施例に係るシュラウ
ド用堆積層除去機構を取り付けた例を示す概略断面図で
ある。第3図と同等部分には同一符号を付してその説明
を省略する。
FIG. 1 is a schematic sectional view showing an example in which a shroud deposited layer removing mechanism according to an embodiment of the present invention is attached to a growth chamber. Components equivalent to those in FIG. 3 are given the same reference numerals and their explanations will be omitted.

真空容器である例えば円筒状をした成長室8内に上述し
たようなシュラウド2が設けられている。
A shroud 2 as described above is provided in a growth chamber 8, which is a vacuum container and has a cylindrical shape, for example.

7は前述した液体窒素である。そしてこの例では、成長
室8の上方に設けられたフランジ9に、堆積層除去機構
10が取り付けられている。
7 is the liquid nitrogen mentioned above. In this example, a deposited layer removing mechanism 10 is attached to a flange 9 provided above the growth chamber 8.

堆積除去機構10は、シュラウド2を、より具体的には
シュラウド2の外壁21を、成長室8外から下方に叩く
ためのハンマー11と、当該ハンマー11を真空シール
する伸縮自在のベローズ12とを備えており、更にこの
例ではへローズ12の伸びを抑えてハンマー11を中立
位置に保ち易くするばね13を備えている。
The deposition removal mechanism 10 includes a hammer 11 for hitting the shroud 2, more specifically, the outer wall 21 of the shroud 2 downward from outside the growth chamber 8, and a retractable bellows 12 for vacuum-sealing the hammer 11. Further, in this example, a spring 13 is provided which suppresses the expansion of the hollow steel 12 and makes it easier to keep the hammer 11 in a neutral position.

作用を説明すると、シュラウド2の内壁22に付着した
堆積層6を除去するには、大気側からハンマー11の一
端を例えば手で打ってハンマー11を矢印Aのように上
下させてその他端でシュラウド2を叩く。これによって
、シュラウド2の内壁22に付着していた堆積層6(工
当該内壁22から叩き落とされる。シュラウド2は、通
常、例えば第3図のように傾斜したりあるいは下方を向
いたりしているため、叩き落とされた堆積層6は当該シ
ュラウド2から下方へ落下させられる。なお必要に応し
て、シュラウド2の下部に例えば図示のような堆積層6
落下用の開口14を設けておいても良い。
To explain the operation, in order to remove the deposited layer 6 attached to the inner wall 22 of the shroud 2, one end of the hammer 11 is struck by hand from the atmosphere side, the hammer 11 is moved up and down as shown by arrow A, and the other end is used to remove the deposited layer 6 from the shroud 2. Hit 2. As a result, the deposited layer 6 adhering to the inner wall 22 of the shroud 2 is knocked off from the inner wall 22 to be worked. The shroud 2 is normally tilted or directed downward, as shown in FIG. 3, for example. Therefore, the deposited layer 6 that has been knocked off is caused to fall downward from the shroud 2. If necessary, the deposited layer 6 as shown in the figure may be provided at the bottom of the shroud 2.
An opening 14 for dropping may be provided.

上述のような操作の結果、シュラウド2の表面が現れて
クライオ吸着効果が良くなり、その結果成長室8の真空
度も良くなる。また結晶の欠陥の原因となるフレーク等
も取り除かれるので、基板3上の膜質の向上にも役立つ
。しかも上記操作は、エピタキシャル成長の合間に成長
室8の超高真空を保ったままで行うことかできるので非
常に能率が良く、従って分子線エビクキシー装置の生産
性向上にも貢献するところ大である。
As a result of the above-described operation, the surface of the shroud 2 appears, improving the cryo-adsorption effect, and as a result, the degree of vacuum in the growth chamber 8 also improves. Furthermore, since flakes and the like that cause crystal defects are removed, the quality of the film on the substrate 3 is also improved. Moreover, the above operation can be performed while maintaining the ultra-high vacuum in the growth chamber 8 between epitaxial growths, so it is very efficient, and therefore greatly contributes to improving the productivity of the molecular beam eviction apparatus.

尚、上述とは違って、ハンマー11によって堆積層6の
付着している内壁22を叩くようにして。
Note that, unlike the above, the hammer 11 is used to strike the inner wall 22 to which the deposited layer 6 is attached.

も良い。そのようにすれば堆積層6の除去作業がより容
易になる。その例を第2図に示す。即ち、シュラつド2
に設けられた開口15を内壁22に取り付けられた板1
6で覆い、これをハンマー11で叩くことによって等測
的に内壁22を叩くようにしている。その場合、板16
の一方端側のみを内壁22に固定することによって、板
16の他方端側で内壁22を言わばはじくようにしても
良い。
Also good. In this way, the work of removing the deposited layer 6 becomes easier. An example is shown in FIG. That is, Shuratsudo 2
The opening 15 provided in the plate 1 attached to the inner wall 22
6, and by hitting this with a hammer 11, the inner wall 22 is struck isometrically. In that case, plate 16
By fixing only one end of the plate 16 to the inner wall 22, the other end of the plate 16 may flip the inner wall 22, so to speak.

堆積層除去機構10の取り付は場所は、上記のような成
長室8の上方に限られることはなく、例えば成長室8の
側方や下方等の適当な場所としても良い。また上記堆積
層除去機構10は、上述したような円筒状のシュラウド
2や成長室8に適用が限定されるものではなく、様々な
形状・構造のものに広く適用することができるのは勿論
である。
The location where the deposited layer removal mechanism 10 is installed is not limited to the above-described location above the growth chamber 8, but may be mounted at any appropriate location, such as on the side or below the growth chamber 8. Further, the application of the deposited layer removing mechanism 10 is not limited to the cylindrical shroud 2 or the growth chamber 8 as described above, but can of course be widely applied to various shapes and structures. be.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明によれば、シュラウドの内壁に付
着した堆積層を、大気側から当該シュラウドを収納する
真空容器の真空を破ることなく除去することができる。
As described above, according to the present invention, the deposited layer adhering to the inner wall of the shroud can be removed from the atmosphere side without breaking the vacuum of the vacuum container housing the shroud.

従って除去作業の能率が非常に良い。Therefore, the efficiency of removal work is very high.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、成長室にこの発明の一実施例に係るシュラウ
ド用堆積層除去機構を取り付けた例を示す概略断面図で
ある。第2図は、シュラウド部分の他の例を示す部分断
面図である。第3図は、分子線エピタキシー装置におけ
るシュラウド回りの一例を示す概略斜視図である。 2・・・シュラウド、21・・・外壁、22・・・内壁
、6・・・堆積層、8・・・成長室(真空容器)、10
19.堆積層除去機構、11・・・ハンマー、12・・
・ベローズ
FIG. 1 is a schematic sectional view showing an example in which a shroud deposited layer removing mechanism according to an embodiment of the present invention is attached to a growth chamber. FIG. 2 is a partial sectional view showing another example of the shroud portion. FIG. 3 is a schematic perspective view showing an example of a shroud and its surroundings in a molecular beam epitaxy apparatus. 2...Shroud, 21...Outer wall, 22...Inner wall, 6...Deposition layer, 8...Growth chamber (vacuum container), 10
19. Deposited layer removal mechanism, 11...hammer, 12...
・Bellows

Claims (1)

【特許請求の範囲】[Claims] (1)真空容器内に設けられたシュラウドを真空容器外
から叩くためのハンマーと、当該ハンマーを真空シール
するベローズとを備えることを特徴とするシュラウド用
堆積層除去機構。
(1) A deposited layer removal mechanism for a shroud, comprising a hammer for hitting a shroud provided in a vacuum vessel from outside the vacuum vessel, and a bellows for vacuum sealing the hammer.
JP20596285A 1985-09-17 1985-09-17 Mechanism for removing deposit layer for shroud Pending JPS6265732A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20596285A JPS6265732A (en) 1985-09-17 1985-09-17 Mechanism for removing deposit layer for shroud

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20596285A JPS6265732A (en) 1985-09-17 1985-09-17 Mechanism for removing deposit layer for shroud

Publications (1)

Publication Number Publication Date
JPS6265732A true JPS6265732A (en) 1987-03-25

Family

ID=16515589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20596285A Pending JPS6265732A (en) 1985-09-17 1985-09-17 Mechanism for removing deposit layer for shroud

Country Status (1)

Country Link
JP (1) JPS6265732A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06272027A (en) * 1993-03-17 1994-09-27 Fuji Photo Film Co Ltd Method for automatically cleaning vacuum deposition tank and device therefor
JP2005530042A (en) * 2002-06-18 2005-10-06 リベル Material evaporation chamber with differential vacuum pumping

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06272027A (en) * 1993-03-17 1994-09-27 Fuji Photo Film Co Ltd Method for automatically cleaning vacuum deposition tank and device therefor
JP2005530042A (en) * 2002-06-18 2005-10-06 リベル Material evaporation chamber with differential vacuum pumping
JP4918221B2 (en) * 2002-06-18 2012-04-18 リベル Material evaporation chamber with differential vacuum pumping
US8894769B2 (en) 2002-06-18 2014-11-25 Riber Material evaporation chamber with differential vacuum pumping

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