JPS6262460U - - Google Patents
Info
- Publication number
- JPS6262460U JPS6262460U JP15348785U JP15348785U JPS6262460U JP S6262460 U JPS6262460 U JP S6262460U JP 15348785 U JP15348785 U JP 15348785U JP 15348785 U JP15348785 U JP 15348785U JP S6262460 U JPS6262460 U JP S6262460U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- vacuum chamber
- chip
- cryogenic
- room
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003507 refrigerant Substances 0.000 claims description 5
- 239000000470 constituent Substances 0.000 claims 2
- 239000010409 thin film Substances 0.000 claims 2
Description
第1図は、本考案による信号処理装置の実施例
を示す略線的断面図である。第2図は、その腰部
の略線的断面図である。第3図は、従来の信号処
理装置を示す略線的断面図である。
1……真空槽、2……排気用管、3……極低温
用冷媒用容器、4……冷媒導出入管、5……極低
温用冷媒、6……真空容器、7……排気用管、8
……電子回路基板、9……主面、10……常温動
作電子回路構成チツプ、11……極低温動作電子
回路構成チツプ、12……ヒータ、13……薄膜
線路、21……ヒートシンク。
FIG. 1 is a schematic cross-sectional view showing an embodiment of a signal processing device according to the present invention. FIG. 2 is a schematic cross-sectional view of the waist. FIG. 3 is a schematic cross-sectional view showing a conventional signal processing device. 1... Vacuum chamber, 2... Exhaust pipe, 3... Container for cryogenic refrigerant, 4... Refrigerant inlet/output pipe, 5... Refrigerant for cryogenic temperature, 6... Vacuum container, 7... Exhaust pipe , 8
. . . Electronic circuit board, 9 .
Claims (1)
設けている極低温用冷媒用容器と、 主面上に、常温動作電子回路を構成している常
温動作電子回路構成チツプと、極低温動作電子回
路を構成している極低温動作電子回路構成チツプ
とを位置を異にして装架し、且つ上記常温動作電
子回路構成チツプ及び上記極低温動作電子回路構
成チツプ間に延長している薄膜線路を少なくとも
含んでいる薄膜線路を形成している電子回路基板
とを有し、 上記電子回路基板が、上記常温動作電子回路構
成チツプを上記真空槽外に位置せしめ、上記極低
温動作電子回路構成チツプを上記真空槽内に位置
せしめ且つ上記ヒートシンクに圧接させた状態で
、上記真空槽に保持されている信号処理装置。[Scope of Claim for Utility Model Registration] A vacuum chamber, a cryogenic refrigerant container disposed within the vacuum chamber and provided with a heat sink on its outer surface, and a room-temperature refrigerant container on its main surface constituting a room-temperature operating electronic circuit. An operating electronic circuit configuration chip and a cryogenic operation electronic circuit configuration chip constituting the cryogenic operation electronic circuit are mounted at different positions, and the above-mentioned room temperature operation electronic circuit configuration chip and the above cryogenic operation electronic circuit are mounted. an electronic circuit board forming a thin film line including at least a thin film line extending between constituent chips, the electronic circuit board having the normal temperature operating electronic circuit constituent chip located outside the vacuum chamber; and a signal processing device held in the vacuum chamber with the cryogenically operating electronic circuit chip positioned within the vacuum chamber and pressed against the heat sink.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15348785U JPH0325419Y2 (en) | 1985-10-07 | 1985-10-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15348785U JPH0325419Y2 (en) | 1985-10-07 | 1985-10-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6262460U true JPS6262460U (en) | 1987-04-17 |
JPH0325419Y2 JPH0325419Y2 (en) | 1991-06-03 |
Family
ID=31072415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15348785U Expired JPH0325419Y2 (en) | 1985-10-07 | 1985-10-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0325419Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02123774A (en) * | 1988-11-02 | 1990-05-11 | Fujitsu Ltd | Package for superconducting element |
-
1985
- 1985-10-07 JP JP15348785U patent/JPH0325419Y2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02123774A (en) * | 1988-11-02 | 1990-05-11 | Fujitsu Ltd | Package for superconducting element |
Also Published As
Publication number | Publication date |
---|---|
JPH0325419Y2 (en) | 1991-06-03 |
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