JPS6259889B2 - - Google Patents

Info

Publication number
JPS6259889B2
JPS6259889B2 JP20864881A JP20864881A JPS6259889B2 JP S6259889 B2 JPS6259889 B2 JP S6259889B2 JP 20864881 A JP20864881 A JP 20864881A JP 20864881 A JP20864881 A JP 20864881A JP S6259889 B2 JPS6259889 B2 JP S6259889B2
Authority
JP
Japan
Prior art keywords
flow path
refrigerant liquid
container
heating element
cooling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP20864881A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58108759A (ja
Inventor
Kazunari Nakao
Masao Fujii
Haruo Tetsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP20864881A priority Critical patent/JPS58108759A/ja
Priority to KR8201479A priority patent/KR860000253B1/ko
Priority to MX192188A priority patent/MX157055A/es
Priority to US06/366,124 priority patent/US4572286A/en
Priority to DE19823213112 priority patent/DE3213112A1/de
Priority to ES511289A priority patent/ES511289A0/es
Priority to AU82439/82A priority patent/AU551611B2/en
Publication of JPS58108759A publication Critical patent/JPS58108759A/ja
Priority to US06/805,538 priority patent/US4653579A/en
Publication of JPS6259889B2 publication Critical patent/JPS6259889B2/ja
Granted legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP20864881A 1981-04-07 1981-12-22 沸騰冷却装置 Granted JPS58108759A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP20864881A JPS58108759A (ja) 1981-12-22 1981-12-22 沸騰冷却装置
KR8201479A KR860000253B1 (ko) 1981-04-07 1982-04-03 비등 냉각장치(沸騰冷却裝置)
MX192188A MX157055A (es) 1981-04-07 1982-04-06 Mejoras en aparato de enfriamiento por ebullicion para autotransportes
US06/366,124 US4572286A (en) 1981-04-07 1982-04-07 Boiling cooling apparatus
DE19823213112 DE3213112A1 (de) 1981-04-07 1982-04-07 Siedekuehlapparat
ES511289A ES511289A0 (es) 1981-04-07 1982-04-07 Aparato de refrigeracion por ebullicion.
AU82439/82A AU551611B2 (en) 1981-04-07 1982-04-07 Ebullition cooling apparatus
US06/805,538 US4653579A (en) 1981-04-07 1985-12-06 Boiling cooling apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20864881A JPS58108759A (ja) 1981-12-22 1981-12-22 沸騰冷却装置

Publications (2)

Publication Number Publication Date
JPS58108759A JPS58108759A (ja) 1983-06-28
JPS6259889B2 true JPS6259889B2 (enrdf_load_stackoverflow) 1987-12-14

Family

ID=16559722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20864881A Granted JPS58108759A (ja) 1981-04-07 1981-12-22 沸騰冷却装置

Country Status (1)

Country Link
JP (1) JPS58108759A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS58108759A (ja) 1983-06-28

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