JPS6258142B2 - - Google Patents
Info
- Publication number
- JPS6258142B2 JPS6258142B2 JP7010078A JP7010078A JPS6258142B2 JP S6258142 B2 JPS6258142 B2 JP S6258142B2 JP 7010078 A JP7010078 A JP 7010078A JP 7010078 A JP7010078 A JP 7010078A JP S6258142 B2 JPS6258142 B2 JP S6258142B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- gas
- silicon oxide
- oxide film
- silicon substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 claims description 32
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 28
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 27
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 22
- 229910052710 silicon Inorganic materials 0.000 claims description 22
- 239000010703 silicon Substances 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 22
- 238000006243 chemical reaction Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 14
- 238000001020 plasma etching Methods 0.000 claims description 11
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 claims 1
- 239000007789 gas Substances 0.000 description 35
- 239000010408 film Substances 0.000 description 28
- 238000009832 plasma treatment Methods 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7010078A JPS54161277A (en) | 1978-06-09 | 1978-06-09 | Plasma etching method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7010078A JPS54161277A (en) | 1978-06-09 | 1978-06-09 | Plasma etching method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54161277A JPS54161277A (en) | 1979-12-20 |
| JPS6258142B2 true JPS6258142B2 (enExample) | 1987-12-04 |
Family
ID=13421767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7010078A Granted JPS54161277A (en) | 1978-06-09 | 1978-06-09 | Plasma etching method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54161277A (enExample) |
-
1978
- 1978-06-09 JP JP7010078A patent/JPS54161277A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54161277A (en) | 1979-12-20 |
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