JPS625652U - - Google Patents
Info
- Publication number
- JPS625652U JPS625652U JP9716185U JP9716185U JPS625652U JP S625652 U JPS625652 U JP S625652U JP 9716185 U JP9716185 U JP 9716185U JP 9716185 U JP9716185 U JP 9716185U JP S625652 U JPS625652 U JP S625652U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- element mounting
- mounting part
- parts
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 2
- 238000003491 array Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9716185U JPS625652U (fr) | 1985-06-26 | 1985-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9716185U JPS625652U (fr) | 1985-06-26 | 1985-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS625652U true JPS625652U (fr) | 1987-01-14 |
Family
ID=30963818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9716185U Pending JPS625652U (fr) | 1985-06-26 | 1985-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS625652U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02201944A (ja) * | 1989-01-30 | 1990-08-10 | Nec Corp | 半導体装置用リードフレーム |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61101062A (ja) * | 1984-10-24 | 1986-05-19 | Hitachi Yonezawa Denshi Kk | 半導体装置の製造方法 |
-
1985
- 1985-06-26 JP JP9716185U patent/JPS625652U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61101062A (ja) * | 1984-10-24 | 1986-05-19 | Hitachi Yonezawa Denshi Kk | 半導体装置の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02201944A (ja) * | 1989-01-30 | 1990-08-10 | Nec Corp | 半導体装置用リードフレーム |