JPS625648U - - Google Patents
Info
- Publication number
- JPS625648U JPS625648U JP9667185U JP9667185U JPS625648U JP S625648 U JPS625648 U JP S625648U JP 9667185 U JP9667185 U JP 9667185U JP 9667185 U JP9667185 U JP 9667185U JP S625648 U JPS625648 U JP S625648U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor integrated
- integrated circuit
- circuit board
- printed circuit
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9667185U JPS625648U (bs) | 1985-06-27 | 1985-06-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9667185U JPS625648U (bs) | 1985-06-27 | 1985-06-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS625648U true JPS625648U (bs) | 1987-01-14 |
Family
ID=30962661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9667185U Pending JPS625648U (bs) | 1985-06-27 | 1985-06-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS625648U (bs) |
-
1985
- 1985-06-27 JP JP9667185U patent/JPS625648U/ja active Pending
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