JPS625645U - - Google Patents
Info
- Publication number
- JPS625645U JPS625645U JP1985096765U JP9676585U JPS625645U JP S625645 U JPS625645 U JP S625645U JP 1985096765 U JP1985096765 U JP 1985096765U JP 9676585 U JP9676585 U JP 9676585U JP S625645 U JPS625645 U JP S625645U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- heat sink
- peripheral edge
- along
- hybrid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985096765U JPH046209Y2 (https=) | 1985-06-27 | 1985-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985096765U JPH046209Y2 (https=) | 1985-06-27 | 1985-06-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS625645U true JPS625645U (https=) | 1987-01-14 |
| JPH046209Y2 JPH046209Y2 (https=) | 1992-02-20 |
Family
ID=30962893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985096765U Expired JPH046209Y2 (https=) | 1985-06-27 | 1985-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH046209Y2 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56174859U (https=) * | 1980-05-26 | 1981-12-23 | ||
| JPS5839018A (ja) * | 1981-09-02 | 1983-03-07 | Mitsubishi Electric Corp | 混成集積回路の組立方法 |
-
1985
- 1985-06-27 JP JP1985096765U patent/JPH046209Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56174859U (https=) * | 1980-05-26 | 1981-12-23 | ||
| JPS5839018A (ja) * | 1981-09-02 | 1983-03-07 | Mitsubishi Electric Corp | 混成集積回路の組立方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH046209Y2 (https=) | 1992-02-20 |