JPS6255887U - - Google Patents
Info
- Publication number
- JPS6255887U JPS6255887U JP14760685U JP14760685U JPS6255887U JP S6255887 U JPS6255887 U JP S6255887U JP 14760685 U JP14760685 U JP 14760685U JP 14760685 U JP14760685 U JP 14760685U JP S6255887 U JPS6255887 U JP S6255887U
- Authority
- JP
- Japan
- Prior art keywords
- socket
- lid
- semiconductor device
- pins
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14760685U JPS6255887U (en:Method) | 1985-09-26 | 1985-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14760685U JPS6255887U (en:Method) | 1985-09-26 | 1985-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6255887U true JPS6255887U (en:Method) | 1987-04-07 |
Family
ID=31061119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14760685U Pending JPS6255887U (en:Method) | 1985-09-26 | 1985-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6255887U (en:Method) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06260541A (ja) * | 1993-03-04 | 1994-09-16 | Nippon Maikuronikusu:Kk | 半導体チップソケット |
| JP2008171749A (ja) * | 2007-01-15 | 2008-07-24 | Sensata Technologies Inc | 半導体装置用ソケット |
-
1985
- 1985-09-26 JP JP14760685U patent/JPS6255887U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06260541A (ja) * | 1993-03-04 | 1994-09-16 | Nippon Maikuronikusu:Kk | 半導体チップソケット |
| JP2008171749A (ja) * | 2007-01-15 | 2008-07-24 | Sensata Technologies Inc | 半導体装置用ソケット |