JPS6255367U - - Google Patents
Info
- Publication number
- JPS6255367U JPS6255367U JP14842385U JP14842385U JPS6255367U JP S6255367 U JPS6255367 U JP S6255367U JP 14842385 U JP14842385 U JP 14842385U JP 14842385 U JP14842385 U JP 14842385U JP S6255367 U JPS6255367 U JP S6255367U
- Authority
- JP
- Japan
- Prior art keywords
- board
- conductor
- solder
- copper foil
- foils
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 3
- 229910000679 solder Inorganic materials 0.000 claims 2
- 239000011888 foil Substances 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14842385U JPS6255367U (US20020051482A1-20020502-M00057.png) | 1985-09-27 | 1985-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14842385U JPS6255367U (US20020051482A1-20020502-M00057.png) | 1985-09-27 | 1985-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6255367U true JPS6255367U (US20020051482A1-20020502-M00057.png) | 1987-04-06 |
Family
ID=31062677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14842385U Pending JPS6255367U (US20020051482A1-20020502-M00057.png) | 1985-09-27 | 1985-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6255367U (US20020051482A1-20020502-M00057.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0479173A (ja) * | 1990-07-23 | 1992-03-12 | Matsushita Electric Ind Co Ltd | 表裏箔接続部品 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS552904A (en) * | 1978-06-22 | 1980-01-10 | Tokyo Shibaura Electric Co | Reactor core element |
| JPS5511165U (US20020051482A1-20020502-M00057.png) * | 1978-07-10 | 1980-01-24 | ||
| JPS5570087A (en) * | 1978-11-20 | 1980-05-27 | Matsushita Electric Ind Co Ltd | Circuit board and method of manufacturing same |
| JPS5813369B2 (ja) * | 1977-03-17 | 1983-03-14 | 住友ゴム工業株式会社 | シ−ラント材料のタイヤ内面への圧着方法とその装置 |
-
1985
- 1985-09-27 JP JP14842385U patent/JPS6255367U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5813369B2 (ja) * | 1977-03-17 | 1983-03-14 | 住友ゴム工業株式会社 | シ−ラント材料のタイヤ内面への圧着方法とその装置 |
| JPS552904A (en) * | 1978-06-22 | 1980-01-10 | Tokyo Shibaura Electric Co | Reactor core element |
| JPS5511165U (US20020051482A1-20020502-M00057.png) * | 1978-07-10 | 1980-01-24 | ||
| JPS5570087A (en) * | 1978-11-20 | 1980-05-27 | Matsushita Electric Ind Co Ltd | Circuit board and method of manufacturing same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0479173A (ja) * | 1990-07-23 | 1992-03-12 | Matsushita Electric Ind Co Ltd | 表裏箔接続部品 |
