JPS6254927B2 - - Google Patents

Info

Publication number
JPS6254927B2
JPS6254927B2 JP3432882A JP3432882A JPS6254927B2 JP S6254927 B2 JPS6254927 B2 JP S6254927B2 JP 3432882 A JP3432882 A JP 3432882A JP 3432882 A JP3432882 A JP 3432882A JP S6254927 B2 JPS6254927 B2 JP S6254927B2
Authority
JP
Japan
Prior art keywords
specimen
shear
ground
pressure plate
base rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3432882A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58150613A (ja
Inventor
Naotoshi Takada
Tetsuo Kinoshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KENSETSU KIKAKU KONSARUTANTO KK
Original Assignee
KENSETSU KIKAKU KONSARUTANTO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KENSETSU KIKAKU KONSARUTANTO KK filed Critical KENSETSU KIKAKU KONSARUTANTO KK
Priority to JP3432882A priority Critical patent/JPS58150613A/ja
Publication of JPS58150613A publication Critical patent/JPS58150613A/ja
Publication of JPS6254927B2 publication Critical patent/JPS6254927B2/ja
Granted legal-status Critical Current

Links

Classifications

    • EFIXED CONSTRUCTIONS
    • E02HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02DFOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D1/00Investigation of foundation soil in situ
    • E02D1/02Investigation of foundation soil in situ before construction work
    • E02D1/022Investigation of foundation soil in situ before construction work by investigating mechanical properties of the soil

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Soil Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Paleontology (AREA)
  • Civil Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Structural Engineering (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Investigation Of Foundation Soil And Reinforcement Of Foundation Soil By Compacting Or Drainage (AREA)
JP3432882A 1982-03-03 1982-03-03 地盤の現場直接せん断試験方法とその装置 Granted JPS58150613A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3432882A JPS58150613A (ja) 1982-03-03 1982-03-03 地盤の現場直接せん断試験方法とその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3432882A JPS58150613A (ja) 1982-03-03 1982-03-03 地盤の現場直接せん断試験方法とその装置

Publications (2)

Publication Number Publication Date
JPS58150613A JPS58150613A (ja) 1983-09-07
JPS6254927B2 true JPS6254927B2 (enrdf_load_stackoverflow) 1987-11-17

Family

ID=12411082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3432882A Granted JPS58150613A (ja) 1982-03-03 1982-03-03 地盤の現場直接せん断試験方法とその装置

Country Status (1)

Country Link
JP (1) JPS58150613A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0280536U (enrdf_load_stackoverflow) * 1988-12-08 1990-06-21
US7595543B2 (en) 2000-11-29 2009-09-29 Australian National University Semiconductor processing method for increasing usable surface area of a semiconductor wafer

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6175194A (ja) * 1984-09-21 1986-04-17 佐々 恭二 山崩れ調査用現場せん断試験装置
JPS61102535A (ja) * 1984-10-24 1986-05-21 Sankyo Denki Kk 剪断試験機
JPS63286748A (ja) * 1987-05-20 1988-11-24 Toda Constr Co Ltd 鉛直面の原位置せん断試験方法および装置
CN103969131B (zh) * 2014-04-18 2016-01-20 辽宁省水利水电科学研究院 粗粒土液压剪切仪
CN105203409B (zh) * 2015-10-15 2017-11-24 山东科技大学 一种锚固加压的岩体现场直剪试验方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0280536U (enrdf_load_stackoverflow) * 1988-12-08 1990-06-21
US7595543B2 (en) 2000-11-29 2009-09-29 Australian National University Semiconductor processing method for increasing usable surface area of a semiconductor wafer

Also Published As

Publication number Publication date
JPS58150613A (ja) 1983-09-07

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