JPS6252981A - Multiple laser application head - Google Patents

Abstract

PURPOSE:To make two laser beams form a V-shape cut line and remove a predetermined shape cut piece by one process by a method wherein the second light converging means is rotated around the first axis, which is one of the two axes crossing with each other, as the center of rotation and also rotated around the second axis as the center of rotation independently. CONSTITUTION:The first rotary bracket 2 is hollow and is attached to the lower end of the first hollow shaft 4 and supported by ball bearings 5 so as to rotate freely against a support frame 6 with the first axis A as the center of rotation. The bracket 2 fixes a sleeve 10 concentrically at the lower end on the A axis line and holds the first light converging means 11 at is lower end. On the top part of the sleeve 10, a semi-transparent reflective mirror 12is fixed against the first axis A. The second rotary bracket 3 is attached to the second hollow shaft 13 and supported by ball bearings 14 so as to rotate freely against a bearing cylinder 2a of the bracket 2 with the second axis B as the center of rotation and driven by a servomotor 17. The bracket 3 holds the second light converging means 18 on the same axis line as the third axis C. Laser beams 20 are applied to the cross point P of the axes A, B and C from two directions simultaneously.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to an irradiation head that utilizes a laser beam,
In particular, the present invention relates to a laser irradiation head for removing large cut pieces in a predetermined shape from a workpiece by intersecting a plurality of laser beams.

2. Description of the Related Art There is a process in which a V-shaped cut groove is formed in a workpiece and that portion is removed as a cut piece of a predetermined shape.

Conventionally, in this type of processing, a single laser beam is used to make a cutting line in the workpiece at a predetermined depth, and then the relative angle between the laser beam and the workpiece is changed to cut the workpiece first. Either make a cut line at a different angle to the bottom and remove the cut piece, or set up two fixed laser beams at right angles to each other and tilt, rotate, or move their respective focal points. The cut piece is removed by applying it to a workpiece supported by means.

However, in the former processing method, in addition to the hassle of setup change, two cutting operations are required, resulting in poor work efficiency. In addition, the latter method does not allow grooving or hole machining, so there is a limit to its practical versatility.

OBJECTS OF THE INVENTION Accordingly, an object of the present invention is to provide a method for laser machining that allows cutting pieces of a predetermined shape to be continuously removed from a workpiece in a single process.

Solution to the Invention Therefore, the present invention provides a laser beam condensing means attached to one first axis of two axes that intersect with each other, and a second condensing means attached to the other second axis. Attached in a rotatable manner toward the intersection of the first axis and the second axis at an intersecting angle, and directing the laser beam to the focusing means toward the intersection of the first axis and the second axis, I'm trying to guide you.

During processing, by rotating the second focusing means about the first axis and independently about the second axis, the two laser beams are directed toward the workpiece.
A 7-shaped cutting line is formed, and a cut piece of a predetermined shape is separated from that part.

In this way, cut pieces of a predetermined shape are continuously formed from the workpiece.

Note that the rotation of the first axis is to always set the laser beam of the second focusing means in the normal direction along the processing trajectory, and the rotation of the second focusing means about the second axis The rotation is for setting the cutting angle of the groove-shaped cutting line.

Structure of the Embodiment FIG. 1 shows a multi-laser irradiation head 1 of the present invention. This multiple laser irradiation head 1 as a whole has a first
It is composed of a rotating bracket 2 and a second rotating bracket 3.

The first rotating bracket 2 has a predetermined shape and is hollow, and its upper end portion is fixed to the lower end portion of the first hollow shaft 4, and the upper and lower ball bearings 5 support the support frame 6. It is rotatably supported around a first axis A. Note that this first hollow shaft 4 is driven by an external first servo motor 9 via a worm 7 and a worm wheel 8 inside the support frame 6.

Further, the first rotating bracket 2 concentrically fixes the sleeve 10 at its lower end portion on the axis line to the first axis, and at its lower end portion the first light condensing means 1 including a condensing lens etc.
It holds 1. Note that this sleeve 10 has a transflective mirror 12 fixed thereon at an inclined angle of, for example, 45 degrees with respect to the first axis A.

Further, the second rotation bracket 3 is partially attached to the lower end portion of the second hollow shaft 13, and similarly to the first hollow shaft 4, the second rotation bracket 3 is attached to the first
It is rotatably supported by the bearing tube 2a of the rotating bracket 2 about a second axis B, and is driven by a worm 15, a worm wheel 16, and a second servo motor 17. The second rotating bracket 3 connects the second condensing means 18 to the third condensing means 18 at its lower part.
It is supported on the same axis as axis C. This third axis C is set toward the intersection P of the first axis A and the second axis B. The intersection angle α between the first axis A and the second axis B is set to 30° in this embodiment, and the second axis B and the third axis C
The intersecting angle β is 30° as in the above case.

Therefore, the second axis B is a bisector of the intersecting angle of the first axis A and the third axis C.

The laser beam 20 is incident along the first axis A from the upper part of the first hollow shaft 4, passes through the semi-transmissive reflecting mirror 12, and is guided to the first condensing means 11. ,
It is divided by the reflecting mirror 12 and moves along the second axis B by the reflecting mirror 19 attached to the first rotating bracket 2,
Furthermore, on this second axis B, a second rotation bracket is formed by a reflecting mirror 21 attached to the second rotating bracket 3, and on the third axis C, a reflecting mirror 22 attached to the second rotating bracket 3.
The light is guided by the condensing means 18 and irradiated simultaneously from two directions toward the intersection P of the first axis A, second axis B, and third axis C.

These reflecting mirrors 12.19.21.22 constitute laser beam guiding means.

Next, FIG. 2 shows an example in which the plurality of laser irradiation heads 1 are incorporated into a planar rectangular coordinate processing apparatus Z24.

The multiple laser irradiation head 1 of the present invention has a support frame 6 that allows for
It is attached to the vertical slide section 25. The vertical slide portion 25 is supported movably in the Z direction relative to the saddle 26, and is positioned in the height direction by a servo motor 27 and a feed screw unit (not shown). Note that the laser beam 20 from the laser oscillator 23 passes through the inside of the guide tube 28 and is guided onto the first axis A by a beam bender 29 or the like.

The saddle 26 is attached to the cross beam 30 so as to be movable in the Y direction, and is driven in the Y direction by a servo motor 31 and a feed screw unit (not shown). Note that the cross beam 30 is supported by left and right columns 34 on the machine base 33 while straddling the table 32.

The table 32 is supported on the bed 35 so as to be movable in the X direction, and is driven in the X direction by a servo motor 36 and a feed screw unit (not shown). The workpiece 37 is placed on the table 32 in a fixed state. Note that these servo motors 27, 31, and 36 are driven by the control device 38 to move the multiple laser irradiation head 1 in the Y direction and the Z direction.
direction, and the workpiece 37 is moved in the X direction.

The action control device 38 of the embodiment sets the plurality of laser irradiation heads 1 to a predetermined height based on a control program input in advance, and then continuously applies motion in the Y direction, and simultaneously moves the workpiece 37. also gives motion in the X direction. by this,
The multiple laser irradiation head 1 moves the intersection point (processing point) P along a processing trajectory as shown in FIG. 3, for example.

On the other hand, during such movement, the first servo motor 9 rotates the first hollow shaft 4 in a predetermined direction, thereby constantly directing the laser beam 20 on the third axis C to each point on the trajectory. Set it in the normal direction.

During this time, the first condensing means 11 and the second condensing means 18
The two laser beams 20 are irradiated toward the intersection (processing point) P, and the workpiece 37 is thermally fused along the V-shaped cutting line. The cutting angle (α+β) at this time is
By rotating the second servo motor 17, the angle can be set arbitrarily within the range of the maximum intersection angle (60°). That is, when the second condensing means 18 is set at an angle as shown in FIG. 1, the cutting angle is set to the maximum. However, when the second condensing means 18 rotates about the second axis B, the fusing angle can be freely set in the range from 60° to the minimum angle in this embodiment. Here, the minimum angle is the relative angle of the optical axes of the first condensing means 11 and the second condensing means 18 when they are closest to each other without interfering with each other.

This cutting angle is usually not changed during one continuous process, but it can also be changed.

Note that these first servo motor 9 and second servo motor 17 are controlled by a dedicated control device, or
Alternatively, the control device 38 may control another servo motor 2.
It is controlled in the same way as 7.31.36.

Modifications of the Invention The above embodiments show an example in which the maximum intersection angle is set to 606, but this maximum machining angle can be set appropriately depending on the application. Further, the intersecting angles α and β may be set equally as in the embodiment, or may be set differently depending on the processing content.

Effect of the invention The present invention provides the following effects.

First, three-dimensional cut pieces can be efficiently removed from the workpiece in a single process. Additionally, since the machining depth and the intersection angle during machining can be set arbitrarily during operation, it is possible to machine V-shaped grooves, steep holes, and even grooves on the workpiece at any angle. becomes. In addition, parts of a predetermined shape can be cut out from a single block of difficult-to-cut material by rough machining, and parts of complex shapes such as molds can be manufactured by rough machining with high efficiency.

[Brief explanation of the drawing]

FIG. 1 is a vertical cross-sectional view of a multiple laser irradiation head of the present invention;
FIG. 2 is a perspective view of a processing apparatus having a plurality of laser irradiation heads according to the present invention, FIG. 3 is a plan view of a processing trajectory, and FIG. 4 is an enlarged sectional view of a processing portion. 1... Multiple laser irradiation heads, 2... First rotating bracket, 3... Second rotating bracket, 4... First hollow shaft, 6
...Support frame, 9..First servo motor, 11..First condensing means, 12..Semi-transparent reflector, 13..Second hollow shaft, 17..Second servo motor, 18.・Second condensing means, 19...Reflector, 20...Laser beam, 21.22
...Reflector, 23.. Laser oscillator, 24.. Processing device, 37.. Workpiece. Patent applicant: Nippei Toyama Co., Ltd.
Person Patent Attorney Kunio Nakagawa Figure 2

Claims (1)

[Claims] a first rotation bracket rotatably supported on a first axis; a first light condensing means attached to the first rotation bracket on the first axis; and a predetermined intersection angle with respect to the first axis. a second rotating bracket rotatably supported by the first rotating bracket on a second axis that intersects with the first axis; The second focusing means is attached toward the intersection with the two axes, and the laser beam guiding means guides the laser beam incident from the laser oscillator to the first focusing means and the second focusing means. Features multiple laser irradiation heads.