JPS6251236A - Wafer processing system - Google Patents

Abstract

PURPOSE:To facilitate automation of a wafer processing line, by using an automatic wafer-carrier conveying vehicle operated by optical communication. CONSTITUTION:An automatic wafer-carrier conveying vehicle 90 makes its optical communications window 93 to face optical communications windows 99 of a wafer prober and performs communications with the wafer prober. The vehicle is moved at a low speed to a position where input light from the optical communications window becomes the maximum value Thus the vehicle is positioned with respect to the wafer prober. Then the conveying vehicle 90 transmits a signal to the wafer prober so as to perform wafer carrier replacement. When the wafer prober receives the signal, the wafer carrier table of a wafer carrier 91, whose inspection is finished, is pushed to the side of the conveying vehicle 90. The sending of the wafer carrier table is transmitted to the conveying vehicle 90 through the optical communications window 99. After the signal is received by the conveying vehicle 90, the wafer carrier 91 on the wafer carrier table is lifted with a wafer-carrier conveying hand 92 and accommodated in the specified position in the conveying vehicle 90. Then, the conveying vehicle 90 mounts the wafer carrier 91, on which wafers that are not inspected yet are placed, on the wafer carrier table of the wafer prober.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to wafer processing systems, and more particularly to optical communication operations. The present invention relates to a way 1 processing system that facilitates automation of a wafer processing line by using a wafer carrier automatic transport vehicle.

[Prior Art] - A hub lober is a device used to measure the characteristics of a large number of IC chips formed on a semiconductor wafer while the wafer remains in its state before being cut and packaged. The actual test is performed by an IC tester, and a wafer prober is a device for accurately electrically contacting the IC tester and each of the above-mentioned IC chips.

Incidentally, in a conventional wafer prober, the wafer transfer system has a configuration shown in FIG. 11. In the figure, 40 is a conveyor prober body, 41 is a wafer prober body, 42 is a supply wafer carrier A7, 43 is a storage wafer carrier, 44 is an uninspected wafer that is supplied to the wafer prober body 41, and 45 is a wafer that has already been measured. The wafers that have been inspected are stored in the wafer carrier 42 after completion of the inspection. In such a transfer system, the supply wafer carrier A742 and the storage wafer carrier A742 were separate, but due to the recent increase in the size of wafers and further automation, a large number of wafer carriers A742 and storage wafer carrier A742 have been used. As a result, the problem of increasing the size of the conveyance system caused by the use of separate J-shape A7s for supply and storage has become a non-negligible problem.

Therefore, in order to solve the above-mentioned problems, a conveyance system having the configuration shown in FIG. 12 was proposed. In the figure, 46, 47 and 4
Reference numeral 8 denotes a supply/storage wafer carrier, 49 a wafer, 50 a T hand for pulling out or pushing a wafer into or out of the holder, and other reference numerals are the same as in FIG. 11. According to this configuration, wafers can be supplied and stored in one single carrier.
Multiple T haki 1 rear 46° 47, 48 each/? For,
There was still a lot of wasted space because an empty area was needed to pull out the wafer.

Therefore, in order to eliminate the drawbacks of the conveyance system shown in FIGS. 11 and 12, the applicant has already proposed the conveyance system shown in FIG. 13. In the figure, reference numeral 51 indicates a supply/storage wafer carrier, 53 indicates a wafer hand, and 54 indicates a wafer hand for pulling out or pushing a wafer from the wafer carrier.

The wafer hand 54 is rotatable as shown in the figure. According to this configuration, the empty area necessary for pulling out wafers from each of the two wafer carriers A751 and 52 shown in the figure is passed through, thereby reducing wasted space and downsizing the apparatus.

FIG. 14 is a diagram showing the surrounding situation of the wafer 1-bar when the transfer system of FIG. 13 is applied to the wafer 1-bar. There is τ゛, and its sign is the same as in Fig. 13.

However, the Unihub [1-bar] with the configuration shown in Figure 14 is
Although it is certainly smaller in size than the wafer prober shown in FIGS. 11 or 12, it has the same drawbacks, namely, the wafer carrier is located far from the operation area 55, resulting in poor operability. be. This drawback was not a major problem up to a size of about 6 inches, but becomes a serious problem when the size of a wafer is 8 inches or more because of the size and weight of the wafer carrier.

In other words, it is difficult to perform operations such as removing and setting the wafer carrier 51 on the back side from the front of the unihub [1-bar], and it becomes necessary to perform such operations from the side of the wafer prober.

Therefore, in a wafer prober having such a transfer system, a passage 56 for setting a J-carrier is required beside the wafer prober, as shown in FIG. For this reason, it becomes impossible to arrange the wafer prober in the laboratory as shown in FIG. 15, and the arrangement is limited to that shown in FIG. 16. Comparing Figures 15 and 16, we find that
It is clear that the diagram is better in terms of efficient use of space.

Also, in FIG. 12, the supply/storage evaporator carrier 46
．． 47 and 48 are mounted on a single plate, and when replacing the wafer carrier, the plate is pulled out and all the wafer carriers 46.
A device in which the wafer carriers 47 and 48 can be pulled out to the front is also known, but in this case, the disadvantage is that when the rear wafer carrier 46 is replaced, the operation of the apparatus regarding the front wafer carriers 47 and 48 is also interrupted. there were.

In addition, supply and storage wafer carriers T746.47 and 4
In step 8, it is necessary to measure the exact position of the T in the evaporator carrier in order to ensure that the wafer is pulled out or pushed in. However, in the all-wafer one-rear pull-out system, when one evaporator carrier is replaced, the wafers in other wafer carriers also move, making the accurate t (turn) measurement carried out before then meaningless. There was also a drawback.

Furthermore, in conventional U-Hub probers, the pre-alignment section and unload stop section occupy a relatively large area within the device, and this was one of the reasons for the increase in the size of the U-Ni-Hub. .Here, the pre-alignment section aligns the wafer pulled out from the wafer carrier V with
The first stop on the Y stage performs pre-alignment before placing the wafer on the wafer chuck. This is the position where the wafer is temporarily placed for viewing.

[Object of the Invention] The present invention has been made in order to eliminate the drawbacks of the prior art mentioned above, and can easily cope with the automation of the wafer processing line, and moreover, it is possible to install a two-way processing system within the T-field. The purpose of the present invention is to provide a wafer processing system that can effectively utilize space.

The above purpose is to notify the wafer processing apparatus that all wafers in one of the wafer carriers have been processed when the wafer carriers are placed at the front of the apparatus.

This is achieved by providing an optical communication means for transmitting the information, and detecting a signal from the optical communication means from the outside to move the sea urchin cutter 12 in and out.

[Explanation of Examples] Hereinafter, the present invention will be explained in detail based on examples.

FIG. 1 shows a schematic diagram of a wafer opening according to an embodiment of the present invention. In the figure, 1 is the wafer carrier entrance/exit, 2
3 is a wafer carrier; 4 is an unload stop position where a wafer is placed when visually inspecting a wafer with a blobbing curve; 5 is a wafer in an unload stop state; 6 is an operation panel; 7 is a wafer carrier stand with a sliding mechanism; One: [
- a pre-alignment station for performing phase alignment of the wafer, 8 a wafer undergoing pre-alignment, 10 a wafer chuck that holds the wafer by vacuum, 11 a wafer in a measurement state, 12 a probe card inside (not shown). ) The head plate 71-113 holding the stereo microscope used for setting 114 etc. of the 1-day book card, 1
Reference numeral 4 denotes a monitor used for displaying parameters set in the wafer prober and setting a reference image (hereinafter referred to as a template) used for auto-alignment.

FIG. 2 is an internal schematic diagram of the wafer prober shown in FIG. 1. In the figure, 15 is a pantograph hand capable of pulling out, inserting, and inserting a wafer from any position on the wafer carrier 3, 16 is a pantograph hand up-and-down mechanism that drives the pantograph hand up and down, and 11 is a wafer chuck 10 from the pre-alignment station 7. 18 is a θ7 stage that rotates or drives the wafer chuck 10 in the height direction; 19 and 20 are an X stage and a Y stage, respectively; 21 is a wafer circumference measurement and a wafer surface height A capacitive sensor 22 is an auto-alignment microscope that captures a pattern on the wafer surface for automatic wafer alignment (hereinafter referred to as auto-alignment 1).

FIG. 3 is a schematic external view of the wafer prober shown in FIG. 1, where 30 is a flat keyboard (operation unit) used for setting parameters, etc., and 31 and 32 are transparent covers.

4th. The figure is a side sectional view of the pantograph hand 15 shown in Figure 2. In the figure, 3 is a wafer carrier, 60 is a wafer, 70 is a semiconductor laser with a collimator used as a light source for detecting the presence or absence of a protrusion and measuring the position of the wafer, and 71 is for detecting the laser light reflected by a plane mirror 73. 72 is a half mirror; 114 is a telescopic drive unit for the pantograph hand 15; and 75 is a rotary drive unit that rotates the entire pantograph hand 15.

5 and 6 are top views of the pantograph hand 15, showing the pantograph hand 15 in an extended state and a contracted state, respectively, by the operation of the telescopic drive section 74. FIG. The symbols are the same as in FIG.

FIG. 7 is a schematic diagram of the area around the pre-alignment station. In the figure, 80 is a linear pulse motor that moves the carrying hand 17 in the Y-axis direction, 81 is a scale that becomes the stator of the linear pulse motor, 82 is a carrying hand vertical drive unit that moves the carrying hand up and down, and 83 is a wafer during pre-alignment. 84 is a pantograph hand finger, 85 is a pre-alignment wafer rotation mechanism for rotating the wafer during pre-alignment, and 86 is a lift from the T-shaped chuck that holds the wafer. This is a wafer chuck bin.

8 and 9 are diagrams for explaining the pre-alignment operation. FIG. 8 shows a state in which the outline of the wafer on the pantograph hand 15 is detected by the wafer sensor 83, and FIG. FIG. 3 is a diagram showing a pre-alignment execution state.

The operation of the wafer 11-bar having the above configuration will be explained below.

First, the settings of the T-haki 11 rear 3 will be explained.

Referring to FIG. 1, to set the wafer carrier 3, a carrier set switch (not shown) on the operation panel 6 is pressed. At this point, a wafer carrier stand 2 comes out from the wafer carrier entrance/exit 1 located at the front of the apparatus.

In this embodiment, the movement of the stand 2 is carried out by a linear pulse motor. Although FIG. 1 shows the left side T-shaped carrier stand 2 in a state where it is out, the right-hand side T-shaped carrier stand 2 can also move in the same way. After setting the wafer carrier 3 on the wafer carrier table 2, the wafer carrier table 2 is moved into the apparatus by pressing the carry/7 set switch again, and in this state, the fully loaded decoy enters a start waiting state.

Next, the probe test operation will be explained.

In the start holding state, when the start switch on the operation panel 6 is pressed, the pantograph hand 15 remains in the retracted state (see FIG. 6) and faces the specified wafer carrier, and the pantograph hand vertical mechanism section 16
to move from top to bottom. As shown in FIG. 4, the pantograph hand 15 has a semiconductor laser 70 and a hole detector 71 for wafer sensing inside, and these detect the presence or absence of a wafer in the wafer carrier and its exact position. It is possible to detect it. With such a function, the pantograph hand 15 can pull out the wafer 60 from any position in the wafer carrier 3. A state in which the wafer 60 is pulled out from the wafer carrier 3 is shown in FIGS. 5 and 6.

After the pantograph hand 15 pulls out the wafer 60 from the wafer carrier 3, the pantograph hand vertical mechanism section 1
6, the wafer is turned upside down, and further rotated by the pantograph hand rotation drive unit 15 to position the wafer above the pre-alignment station 7 as shown in FIG.

Here, the prealignment operation will be explained with reference to FIGS. 7 to 9.

When the wafer on the pantograph hand finger 84 is positioned on the pre-alignment station 7, the carry-in hand 11 having the wafer sensor 83 starts scanning below the wafer (below the pantograph hand finger 84). At this time, the wafer sensor J83 senses the peripheral area of the wafer on the pantograph hand finger 84 to obtain data on the peripheral position of the wafer in the Y-axis direction. Thereafter, the pantograph hand 15 is expanded and contracted in the X-axis direction shown in FIG. 7, and the peripheral area is sensed in the same manner as described above to detect the outer peripheral position of this wafer in the X-axis direction. This situation is shown in FIG. After this, the center position of the wafer is determined from the wafer outer circumferential position data obtained as described above, and this center is located at the seventh point.
The expansion and contraction state of the pantograph hand 15 is set so as to coincide with the center of the wafer rotation mechanism section 85 for pre-alignment in the X-axis direction shown in the figure, and then the wafer is placed in the wafer rotation mechanism section 85 by lowering the pantograph hand 15. Move. Incidentally, before this operation, the carry-in hand 17 is moved to the position shown in FIG. 9. After the pantograph hand 15 transfers the wafer to the wafer rotation mechanism section 85, the pantograph hand 15 enters a contracted state as shown in FIG. 9 and finishes the operation of carrying the wafer into the pre-alignment station 7.

- In the above description, the third 1-
Although A-loading in full automatic operation has been described, this wafer can also be loaded and unloaded extremely easily and quickly by manual operation. In this example, when performing manual operation, one of the wafers is
- To do this, raise the flat keyboard 30 on the right front of the apparatus shown in FIG.
5- Just attack the wafer. At this time, the carry-in hand 17 is located at the pre-alignment station as shown in FIG.

When a wafer is placed automatically or manually, the wafer rotation mechanism section 85 vacuum-adsorbs the wafer and begins a rotation operation. If the placed wafer is a cracked or deformed wafer, the wafer is moved to the wafer rotation mechanism section 8.
At this time, the carry-in hand 17 detects the orientation flat portion by tracing the outer periphery of the wafer by the operation of the linear pulse motor 80.

and (c) The rotation mechanism section 85 directs the orientation flat portion of the wafer in a predetermined direction.

In addition, if the rotation mechanism section 85 from the pantograph hand 15
If the center position of the T passed to the wafer rotation mechanism section 85 has a large error in the Y-axis direction shown in FIG. This error can be removed by lifting it up again with the hand 17, moving it in the Y-axis direction to correct this error, and then lowering it back onto the wafer rotation mechanism section 85. Such an operation not only makes it possible to align the center of the J-shape with the rotation center of the J-ha rotation mechanism section 85, but also enables more stable rotation.
The above-described orientation flat portion can be easily detected by the wafer sensor 83 at high speed and with high accuracy.

In this embodiment, a reflection type optical sensor is used as the wafer sensor 83, but a transmission type optical sensor, a capacitance type sensor, or the like may also be used.

After the detection of the orientation flat part is completed by the wafer rotation mechanism section 85.1-, the wafer is further rotated so that the orientation flat part faces in the specified direction, and then lifted from the pre-alignment station 7 by the carry-in hand 17. , Sea urchin bee 1 waiting at the position shown in Figure 7? It is carried on top of the truck 10.

The carry-in hand 10 has three wafer chuck pins 86 that can protrude from its surface.
When receiving wafers from 7, the wafer chuck bin 86
protrudes from the wafer chuck.

In this state, the carry-in hand 17 is moved to the carry-in hand-L lower moving part 8.
2, and thereby the wafer on the loading door 17 is transferred onto the wafer chuck pin 86 protruding from the wafer chuck 10. 17.
The wafer returns to the Briar Alignment 1 to the station 7 side, and the wafer chuck bin 86 protruding from the wafer chuck 10 is lowered, so that the wafer is transferred to the wafer chuck 10.
and fixed by vacuum suction.

In this embodiment, the wafer chuck bin 86 is made to protrude from the hatch chuck 10 when loading wafers, but even if the wafer chuck bin 86 is fixed and the wafer chuck 10 is lowered, this embodiment will not work. Similar movements are possible.

Here, the operation after the wafer is transferred onto the wafer chuck 10 on the XY stage 19.20 will be explained with reference to FIG.

When the wafer is transferred onto the wafer chuck 10, the wafer chuck 10 performs a scanning operation under the capacitive sensors 2 and 1 to detect the outer peripheral position of the wafer and perform more accurate orientation of the flat portion. Measure the center of the wafer.

The direction of the orientation flat portion at this position is adjusted by rotating the θZ stage 18 by θ. Further -1] is the more accurate Bria? After the implantation, the wafer chuck 10 performs a scanning operation again under the capacitive sensor 21 to detect the wafer surface in the longitudinal direction. This detection in the height direction is to obtain correction data for keeping the contact pressure between the probe card set and the wafer constant at all positions on the evaporator.

Thereafter, the wafer chuck 10 is moved so that a predetermined position on the wafer is located below the auto-alignment microscope 22. At this position, the chucking technician compares the pre-stored template on the evaporator with the pattern observed by the O-1 alignment microscope 22 when the wafer is actually placed at this position. It is detected how far the pattern deviates from a predetermined position in the XYh directions.

Note that this error detection in the xY direction is automatically performed by an error position detection device (not shown) using pattern matching provided at the bottom of the device. This operation is similarly performed at another predetermined position on the wafer for error detection in the θ direction.

As described above, the errors in the x, Y, and θ directions of the pattern on the wafer are extracted from the error detection in the xY directions at two points, and the θ component error is corrected by rotating the wafer chuck 10. If there is a component error, the XY stage is corrected and driven to remove this error component during blobbing.

When the O-component error correction operation and the XY-component error detection are completed under the auto-alignment microscope 22, the first IC chip on the evaporator (hereinafter referred to as the first chip) is fixed to the head plate 12. Move it under the probe card (not shown). This operation is performed by the XY stages 19 and 20, and at this time, as described above, the XY component errors detected during autoalignment are also corrected at the same time. After the chitsub has moved below the probe card, the 7 drive mechanism of the θ7 stage 18 moves the J Hachisec 10 upward for a predetermined stroke.
Contact is made between the bonding pads of the IC chips on the wafer and the probe needles of the probe card. In this state, the wafer 111-bar is placed on an external tester (1!
When the tester sends a test h start signal to the IC chip, the tester starts testing this IC chip. The result of this test
If the chip is determined to be good, the tester sends a test end signal to the J haprober. If the IC chip is determined to be defective, the tester sends a test completion signal and a signal indicating defectiveness. When the wafer prober receives this test end signal, it determines whether the IC chip is good or bad depending on whether a signal indicating a defect is received or not, and if it is defective, it marks the IC chip with an inker (not shown).

When the series of operations for testing the first chip is completed as described below, the XY stages 19 and 20 are moved to sequentially position untested IC chips under the probe card and process them in the same way as the first chip.

When all the IC chips on the wafer have been tested, the wafer chuck 10 returns to the initial position (not shown in FIG. 2), stops the vacuum comb suction, and causes the three wafer chuck bins 86 to protrude from the wafer chuck 10, thereby removing the wafer. It is lifted from the wafer chuck 10. In this state, the pantograph hand 15 is in a contracted/v state and faces the h direction of the wafer chuck 10 shown in FIG. Then, the pantograph hand 15 rises slightly and then retracts to collect the wafer from the wafer chuck 10.

If the pantograph hand 15 is set to the unlow toss (hep position 4)
After a preset time has elapsed or after a manual instruction to store the wafer, the wafer is retrieved from the unload stop position 4. On the other hand, if the unload stop operation is not set, the wafer is directly transferred to the wafer cleaner V3. Return this wafer to the position it was in before inspection.

Note that while the wafer in the wafer stack 10-L is being blown, the next wafer is pulled out from inside the wafer carrier 3 by the pantograph hand 15 and delivered to the pre-alignment station 7. Thereafter, the same prealignment operation as described above is performed at the prealignment station 7. In other words, when a wafer is unloaded from the Urchin Hachi 1 hook 10, the next wafer is waiting for the Briar Alignment 1 at the station 7 with pre-alignment completed, and the next wafer is loaded into the wafer chuck 10 for pre-alignment etc. It is executed without wasting time.

When all the wafers in one wafer carrier have been tested by the above operations, the carrier set switch (not shown) on the operation panel 6 is turned into a blinking state, notifying the operator that the wafer test for one wafer carrier has been completed. If the operator presses the carrier set switch in this state, the wafer carriers 17 2 come forward, making it easy to remove and replace the wafer carriers. Note that when the operator replaces the carrier V, if the other
If a wafer carrier containing a wafer to be tested is set on the 1st floor 2 of the cleaning knife, the wafer prober automatically performs the above-described probe test operation on the wafers in this wafer carrier.

Next, an example of automation of a wafer prober line to which the wafer prober of the present invention is applied will be explained based on FIG. In the diagram, 90 is the Bakaset automated guided vehicle, 91 is the T-carrier, and 9? is a wafer carrier transfer hand, 93
9 is the optical communication window of the transport vehicle, and 99 is the optical communication window of the wafer proper.

In the same figure, the transport vehicle 90 always travels along the transport vehicle passage 94 (
), and during this movement, the optical communication window 93 is placed opposite the optical communication window 99 of the UNI HUB while communicating with the UNI HUB. This unity of communication,
If any wafer prober detects that testing of the wafers in one wafer carrier 91 has been completed, the transport vehicle 90 stops in front of that wafer prober. Furthermore, by moving at a low speed until the input light from the optical communication window reaches a maximum of 4 dM, positioning for one haplober is performed.

Thereafter, the transport vehicle 90 transmits to the wafer prober that the wafer carrier will be replaced. When the wafer prober receives this signal, it pushes out the wafer carrier stand 2 of the inspected V rear 91 toward the transport vehicle 90 side, and notifies the transport vehicle 90 through the optical communication window 99 that the wafer carrier stage 2 has been taken out. and send.

After receiving this signal, the transport vehicle 90 lifts the C wafer carrier 91 using the wafer carrier transport hand 92 and stores it in a predetermined position within the transport vehicle 90. Further, the transport vehicle 90 uses the wafer carrier transport hand 92 to place the wafer carrier 91 containing the uninspected wafer on the wafer carrier stand 2 of the "C wafer proper".
Sends the completion of wafer carrier exchange to the wafer blower. When the wafer prober receives this signal, it returns the wafer carrier stand 2 into the main body and completes the exchange of the wafer carrier 91.

Although the wafer prober is shown only on one side of the transport vehicle passage 94 in FIG. 10, it is naturally possible to arrange the wafer prober on both sides of this passage.

[Effects of the Invention] As explained above, the wafer processing system of the present invention has the following effects:
Since the wafer carrier containing the processed wafers can be automatically replaced by connecting the wafer to the optical communication means, the wafer processing line can be easily automated and the wafers can be processed quickly. . In addition, the 1-wafer processing equipment has a wafer carrier placed at the front of the equipment body, making the equipment more compact and requiring no extra space for exchanging wafer carriers, allowing effective use of space within the T field. I can figure it out.

[Brief explanation of the drawing]

FIG. 1 is a schematic configuration diagram of a wafer proper according to an embodiment of the present invention. FIG. 2 is an internal schematic diagram of the wafer prober shown in FIG. 1. FIG. 3 is a schematic external view of the wafer prober shown in FIG. 1. Figures 4 to 6 are explanatory diagrams of the structure and operation of the pantograph hand in Figure 2. Figure 7 is a schematic perspective view of the pre-alignment station in Figure 2. Figures 8 and 9 are illustrations of the pantograph hand in Figure 2. FIG. 10 is a schematic configuration diagram of a wafer prober line to which the wafer prober of FIG. 1 is applied. FIGS. FIG. 14 is a diagram illustrating the surrounding situation of a wafer prober using the transfer system of FIG. 13, and FIGS. 15 and 16 are diagrams showing an example of the arrangement of the Unihub daybar in a factory. 1: Wafer carrier entrance/exit, 2: Wafer carrier stand, 3: Wafer carrier, 4: Unload stop position, 6: Operation panel, 7: Pre-alignment station, 10: Hatch, 12: Head plate, 13:
Stereo microscope, 14: Monitor, 15: Pantograph hand, 17: Carrying hand, 18:
07 stage, 19: Y stage, 20: × stage,
21: Capacitive sensor, 22: Auto alignment microscope, 90: Wafer carrier automatic transport vehicle.

Claims (1)

[Claims] 1. Unprocessed wafers are taken out from a desired wafer storage position of one or more wafer carriers and transported to a predetermined wafer delivery position, and processed wafers are collected at the wafer delivery position and transferred to the desired wafer storage position. The wafer carrier is equipped with a wafer transport means for transporting and storing the wafer carrier to a predetermined storage position, and an optical communication means for notifying that all the wafers in one of the wafer carriers have been processed. A wafer processing system comprising: a plurality of wafer processing apparatus main bodies disposed; and a wafer carrier automatic transport vehicle that detects a signal from the optical communication means and takes out and takes out the wafer carrier. 2. The wafer according to claim 1, wherein the optimum stopping position for loading and unloading the wafer carrier of the wafer carrier automatic transport vehicle is a position where the signal received from the optical communication means is maximized. processing system. 3. The wafer processing according to claim 1, wherein the wafer processing main body also includes a wafer insertion/removal mechanism portion for inserting and removing a wafer into the wafer carrier of the wafer transport means, which is disposed on the front side of the apparatus main body. system.