JPS6251086B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an automatic baking device for Watsufuru, etc., and more specifically, it is an automatic baking device for making Watsufuru, etc. by overlapping two baking molds, one above the other, and continuously heating and baking the confectionery dough filled therein to make Watsufuru, etc. Pertains to automatic baking equipment such as Watsuful that automatically produces cookies.

Watsuful etc. refers to all sweets manufactured by baking confectionery dough in a pair of upper and lower molds. Conventionally, Watsuful sweets are sweets made by mixing flour, milk, eggs, sugar, etc. The dough is baked in a pair of upper and lower baking molds, then folded in half and wrapped in jam, cream, etc.
In order to maintain the baking confectionery stand in the desired shape, baking is carried out with two upper and lower molds placed one on top of the other. This confectionery stand or baking of confectionery is performed manually or semi-automatically, making mass production difficult.

In other words, when baking confectionery inside upper and lower molds, filling the confectionery dough and baking after overlapping the molds can be automated to some extent, but it is difficult to automate processes such as overlapping the baking molds, and the baking equipment for these confectionery is only semi-automated.

The present invention aims to solve the above-mentioned drawbacks of the prior art, and specifically, lower molds are arranged and fixed in a line on an endless intermittent moving band, and the upper end is automatically placed on each of the lower molds in sequence. We propose an automatic baking device that can continuously bake confectionery dough by dropping and stacking it on top of each other.

That is, the present invention is applied to an automatic baking apparatus such as a Watsufuru, in which upper molds are stacked in a direction substantially perpendicular to the locus of movement on a lower mold that moves intermittently, and the upper molds are sequentially stacked on the lower molds from the bottom. , a support arm that can be raised and lowered to support the stacked upper mold group, a rotatable separating claw that is inserted between the lowermost upper mold and the upper mold immediately above it in the upper mold group, and the uppermost mold group. The separating claw is in the interposed position when the lower upper mold is overlapped with the lower mold, and is provided with a turning mechanism in which the separating claw is removed from the interposed position after the overlapping ends and until the next overlapping starts. It is characterized by

Hereinafter, the present invention will be explained in detail based on the drawings.

Note that FIG. 1 is a front view of an automatic baking device according to one embodiment of the present invention, FIG. 2 is a side view of an example of the overlapping portion of the upper and lower molds, and FIGS. b is a front view and a side view of an example of an upper die peeling part.

First, in FIG. 1, numeral 1 indicates the lower mold,
This lower mold 1 moves intermittently in the direction of arrow A,
Usually, as described later, it is fixed on an endless moving band 2 such as a roller chain, and this moving band 2 is moved intermittently. The upper molds 3 to be superimposed on the lower mold 1 are stacked up substantially perpendicularly to the moving direction of the lower molds, and these three groups of upper molds are sequentially dropped to overlap on the lower mold 1. In this case, the upper mold 3 is sequentially superimposed on the lower mold 1 by the superimposing device A, but after that, the upper mold 3 is peeled off from the lower mold 1 by the peeling section B, and after firing, Sweets are collected.

Next, the overlapping section A may be provided with a support arm that can be raised and lowered, a separating claw, and a turning means, but it is usually constructed as shown in FIG. 2.

That is, in FIG. 2, the upper mold 3 is stacked perpendicularly to the moving direction of the lower mold 1, and in this state, the upper mold 3 is stored in the housing part 4, and the housing part 4 has a support arm. 9 is provided, and a separation claw 5 is attached, and the support arm 9 is configured to be able to rise and fall freely, while the separation claw 5 is configured to be freely pivotable. The upper mold 3a located at the lowermost part of the upper mold group in the housing section 4 is removed from the upper mold group and is successively superimposed on the lower mold 1. In other words, the separation claw 5 is integrally provided on the side surface of a cylindrical rotation shaft 6, a connecting rod 7 is fixed to the rotation shaft 6, and the tip of the piston mechanism 8 is attached to the tip of the connecting rod 7. Rotatably connects to.
Therefore, due to the telescopic movement of the piston 8, that is, its ability to rise and fall, the separation claw 5 rotates around the rotation axis 6, and when the piston 8 is extended the most (the highest position), the separation claw 5 is at the solid line position. When the piston 8 is at its most compressed position (lowest position), the separation claw 5 is at the dotted line position, and as the piston 8 moves up and down, the separation claw 5 rotates between these two positions.

Note that this separating claw 5 is attached to the lower mold 3 as shown in FIG.
At least two are formed to support from both sides of the
A vertically long slit 10 is formed in the support arm 9, which will be described later, and the tip thereof is made to protrude into the upper die 3 while being inserted through the slit 10.

In addition, the support arm 9 is configured to be able to rise and fall freely;
It is sufficient that this elevating mechanism is constituted by a piston 11 or the like. To explain in more detail, the piston 11 moves up and down, rising from the lowest position (solid line position in Figure 2) to the highest position (dotted line position in Figure 2), and during this upward and downward movement, the upper die group is stacked. In particular, while descending from the highest position to the lowest position, the separating claw 5 turns from the dotted line position to the solid line position, and the separation claw 5 rotates between the upper mold 3a at the lowermost part and the upper mold 3b immediately above it. is interposed. Therefore, when the separating claw 5 is in the insertion position, the separating claw 5 temporarily supports the upper mold group stacked above the upper mold 3b directly above the upper mold, and the lowermost upper mold 3
Only part a is separated and carried by support arms 9 on both sides. Therefore, when the support arm 9 descends in this state, that is, in a state where the lowermost upper mold 3a is supported, the lowermost upper mold 3a is seated on the lower mold 1 and overlapped, and after being overlapped, the moving band 2 moves by a unit pitch, a pair of overlapping upper and lower molds 1 and 3
Since the support arm 9 does not become an obstacle, the support arm 9 can rise, and the upper mold group above the upper mold 3b directly above is supported by the support arm 9. In this case, the separation claw 5 moves from the insertion position to the dotted line Turn to the position and leave.

As mentioned above, the overlapping part A is provided with a lifting mechanism for the support arm and a rotating mechanism for the separation claw, and these mechanisms are synchronized.
This synchronization mechanism is synchronized so that it is transferred onto the support arm 9 at the same time as it is removed by insertion, but this synchronization mechanism can be configured in any manner depending on the configuration of the elevating and lowering mechanism and the rotating mechanism.

Next, the upper and lower molds 3 and 1 overlapped as described above.
are sequentially and intermittently transferred in the direction of arrow A by the moving band 2 as shown in FIG.
Heating is performed from above and below by upper and lower baking zones a and 12b (note that heating zones can be provided on either one depending on the confectionery to be baked). After firing, the upper mold 3 is peeled off from the lower mold 1, and the peeling part B can be configured in any manner, but it is usually sufficient to configure it as shown in FIGS. 3a and 3b.

That is, the peeling section B includes a housing section 13 that sequentially stacks and accommodates the upper molds 3 after peeling, and a pair of peeling pieces 1.
4, an upper mold and a locking member 15, and each peeling piece 14 is configured to be movable up and down by a piston 16. Furthermore, the locking member 15 is connected to the support shaft 17.
It is rotatably supported by.

Therefore, when the peeling piece 14 descends to the position shown in FIGS. The moving band 2 stops, and at this time, the pair of peeling pieces 14 rises from the lowest position to lift only the upper die 3 and house it in the housing part 13.

Note that the locking member 15 is for supporting the upper mold 3 lifted by the pair of peeling pieces 14, and the third
It is configured to be able to rotate upward together with the support shaft 17 from the lowermost position shown by the solid line in FIG. In addition, each locking member 15
The rotational force is usually applied by a spring 15a, and the configuration is such that it always automatically returns to the lowest position. Therefore, even if the upper mold 3 rises, it can freely pass through each locking member 15, and then The locking member 15 is automatically returned to the lowest position by the spring 15a.

Note that it is sufficient to transfer the upper mold from the peeling device B to the superposition device A by pressing the rear part of each upper mold 3 one after another.

As explained in detail above, the device of the present invention encloses confectionery dough in upper and lower baking molds, like Watsuful confectionery, and allows the overlapping of the upper and lower molds to be performed without manual labor and under complete mechanical automation. In a short time,
It is possible to bake large quantities of clean, high-quality baked goods.

[Brief explanation of the drawing]

FIG. 1 is a front view of an automatic baking device according to one embodiment of the present invention, FIG. 2 is a side view of an example of the overlapping part of the upper and lower molds, and FIGS. 3 a and b are upper mold peeling FIG. 4 is a front view and a side view of an example of the section. Code, 1...Lower die, 2...Moving band, 3...Upper die, 4, 13...Accommodating section, 3a...Upper die at the bottom, 3b...Upper die directly above, 5... Separation claw, 6...
...Rotating shaft, 7...Connecting rod, 8, 11, 16...Piston, 9...Support arm, 10...Slit,
12a, 12b... Firing zone, 14... Peeling piece, 1
5... Locking member, 15a... Spring, 17... Support shaft.

Claims (1)

[Claims] 1. In an automatic baking device such as a Watsuful, in which upper molds are piled up in a direction approximately perpendicular to the locus of movement on a lower mold that moves intermittently, the upper molds are sequentially stacked on the lower molds from the bottom. A support arm that can be raised and lowered to support the upper mold group, a rotatable separation claw that is inserted between the lowermost upper mold and the upper mold directly above it in the upper mold group, and the lowermost upper mold. When the is overlapped with the lower mold, this separation claw is in the insertion position,
An automatic baking device for Watsuful, etc., characterized by comprising a turning mechanism that separates from the insertion position after the end of this overlapping until the start of the next overlapping.