JPS6249238U - - Google Patents
Info
- Publication number
- JPS6249238U JPS6249238U JP1985141234U JP14123485U JPS6249238U JP S6249238 U JPS6249238 U JP S6249238U JP 1985141234 U JP1985141234 U JP 1985141234U JP 14123485 U JP14123485 U JP 14123485U JP S6249238 U JPS6249238 U JP S6249238U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- thermal expansion
- expansion coefficient
- intermediate metal
- pellets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985141234U JPS6249238U (enFirst) | 1985-09-13 | 1985-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985141234U JPS6249238U (enFirst) | 1985-09-13 | 1985-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6249238U true JPS6249238U (enFirst) | 1987-03-26 |
Family
ID=31048831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985141234U Pending JPS6249238U (enFirst) | 1985-09-13 | 1985-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6249238U (enFirst) |
-
1985
- 1985-09-13 JP JP1985141234U patent/JPS6249238U/ja active Pending