JPS6247155U - - Google Patents
Info
- Publication number
- JPS6247155U JPS6247155U JP1985139672U JP13967285U JPS6247155U JP S6247155 U JPS6247155 U JP S6247155U JP 1985139672 U JP1985139672 U JP 1985139672U JP 13967285 U JP13967285 U JP 13967285U JP S6247155 U JPS6247155 U JP S6247155U
- Authority
- JP
- Japan
- Prior art keywords
- metal base
- light source
- utility
- light emitting
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Exposure Or Original Feeding In Electrophotography (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985139672U JPH0412698Y2 (US20100223739A1-20100909-C00005.png) | 1985-09-12 | 1985-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985139672U JPH0412698Y2 (US20100223739A1-20100909-C00005.png) | 1985-09-12 | 1985-09-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6247155U true JPS6247155U (US20100223739A1-20100909-C00005.png) | 1987-03-23 |
| JPH0412698Y2 JPH0412698Y2 (US20100223739A1-20100909-C00005.png) | 1992-03-26 |
Family
ID=31045795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985139672U Expired JPH0412698Y2 (US20100223739A1-20100909-C00005.png) | 1985-09-12 | 1985-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412698Y2 (US20100223739A1-20100909-C00005.png) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008135508A (ja) * | 2006-11-28 | 2008-06-12 | Seiko Epson Corp | 光源装置、プロジェクタ及びモニタ装置 |
| JP2008270462A (ja) * | 2007-04-19 | 2008-11-06 | Stanley Electric Co Ltd | 光デバイス |
| JP2010226733A (ja) * | 2010-04-21 | 2010-10-07 | Mitsubishi Electric Corp | 画像読取装置 |
| JP2011523180A (ja) * | 2008-06-04 | 2011-08-04 | フォーエバー・バルブ・リミテッド・ライアビリティ・カンパニー | Ｌｅｄ電球装置 |
| JP2012527761A (ja) * | 2009-05-20 | 2012-11-08 | ティーピー ビジョン ホールディング ビー ヴィ | 周辺光を提供するプリント回路板 |
-
1985
- 1985-09-12 JP JP1985139672U patent/JPH0412698Y2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008135508A (ja) * | 2006-11-28 | 2008-06-12 | Seiko Epson Corp | 光源装置、プロジェクタ及びモニタ装置 |
| JP2008270462A (ja) * | 2007-04-19 | 2008-11-06 | Stanley Electric Co Ltd | 光デバイス |
| JP2011523180A (ja) * | 2008-06-04 | 2011-08-04 | フォーエバー・バルブ・リミテッド・ライアビリティ・カンパニー | Ｌｅｄ電球装置 |
| JP2012527761A (ja) * | 2009-05-20 | 2012-11-08 | ティーピー ビジョン ホールディング ビー ヴィ | 周辺光を提供するプリント回路板 |
| JP2010226733A (ja) * | 2010-04-21 | 2010-10-07 | Mitsubishi Electric Corp | 画像読取装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0412698Y2 (US20100223739A1-20100909-C00005.png) | 1992-03-26 |
