JPS6247147U - - Google Patents

Info

Publication number
JPS6247147U
JPS6247147U JP13883085U JP13883085U JPS6247147U JP S6247147 U JPS6247147 U JP S6247147U JP 13883085 U JP13883085 U JP 13883085U JP 13883085 U JP13883085 U JP 13883085U JP S6247147 U JPS6247147 U JP S6247147U
Authority
JP
Japan
Prior art keywords
electronic component
terminal
dip type
circuit
type electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13883085U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13883085U priority Critical patent/JPS6247147U/ja
Publication of JPS6247147U publication Critical patent/JPS6247147U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP13883085U 1985-09-10 1985-09-10 Pending JPS6247147U (xx)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13883085U JPS6247147U (xx) 1985-09-10 1985-09-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13883085U JPS6247147U (xx) 1985-09-10 1985-09-10

Publications (1)

Publication Number Publication Date
JPS6247147U true JPS6247147U (xx) 1987-03-23

Family

ID=31044164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13883085U Pending JPS6247147U (xx) 1985-09-10 1985-09-10

Country Status (1)

Country Link
JP (1) JPS6247147U (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009124071A (ja) * 2007-11-19 2009-06-04 Powertech Technology Inc 半導体パッケージの積層組立

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009124071A (ja) * 2007-11-19 2009-06-04 Powertech Technology Inc 半導体パッケージの積層組立

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