JPS6247147U - - Google Patents
Info
- Publication number
- JPS6247147U JPS6247147U JP13883085U JP13883085U JPS6247147U JP S6247147 U JPS6247147 U JP S6247147U JP 13883085 U JP13883085 U JP 13883085U JP 13883085 U JP13883085 U JP 13883085U JP S6247147 U JPS6247147 U JP S6247147U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- terminal
- dip type
- circuit
- type electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13883085U JPS6247147U (fr) | 1985-09-10 | 1985-09-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13883085U JPS6247147U (fr) | 1985-09-10 | 1985-09-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6247147U true JPS6247147U (fr) | 1987-03-23 |
Family
ID=31044164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13883085U Pending JPS6247147U (fr) | 1985-09-10 | 1985-09-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6247147U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009124071A (ja) * | 2007-11-19 | 2009-06-04 | Powertech Technology Inc | 半導体パッケージの積層組立 |
-
1985
- 1985-09-10 JP JP13883085U patent/JPS6247147U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009124071A (ja) * | 2007-11-19 | 2009-06-04 | Powertech Technology Inc | 半導体パッケージの積層組立 |
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