JPS6247106A - Ceramic electronic component - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention provides a ceramic sintered body in which a void extending from an end surface is formed, and a metal is solidified in the void. The present invention relates to a type of ceramic electronic component in which internal electrodes are formed.

[Prior Art] A void layer extending from an end of 1 m is formed in a ceramic sintered body, and internal electrodes are formed by injecting a base metal into the void layer. Ramic] Ndenri is disclosed in Japanese Patent Publication No. 53-350 B 5.

As shown in FIG. 4, this condensation layer is formed in a void layer extending inward from the end surface facing the phase 77 in the lamic sintered t41.
, Ph-8n or 7n if any base metal is 11 people (
Internal electrodes 2a...2d are formed. The internal electrodes 2a, 2b extending from the first end surface are electrically connected to one external electrode 3, and the internal electrodes 2c, 2d extending from the second end surface are electrically connected to the other external electrode 3. It is electrically connected to the electrode 4.

The laminated condenser in which the internal electrodes are formed by adding base metals T and I as described above is manufactured by passing through the two culms below the L. First, a ceramic sintered body 1 having a void layer in the portion where the internal electrodes 2a...2(1) are formed is prepared.Next,
The ceramic sintered body is placed in a vacuum chamber containing a molten base metal bath, and the interior of the vacuum chamber is evacuated to create a vacuum state before the ceramic sintered body is immersed in the base metal bath. Next, the ceramic sintered body is immersed in a base metal bath, and in that state -C ``inert bamboo gas, etc. is introduced into the vacuum chamber'', and the base metal is injected into the void layer. Roughly, the ramic sintered body is pulled out of the base metal bath, cooled to 2J+ and solidified, then returned to the popular F.

[Note 1] By making the culm lighter, the internal electrodes can be made of a 4I base metal that can withstand the sintering temperature of the ceramic sintered body.

[Problems to be Solved by the Invention] However, in the ceramic knee capacitor shown in FIG. 4, as shown in FIG. A gap 5 is formed between the body 1 and the binding capacitance decreases.
There was a problem with 4. This is thought to be because the base metal constituting the internal electrode contracts when it solidifies.

Therefore, the r1 of this invention is that no gap is formed between the internal electrode and the ceramic sintered body, and therefore the capacitance decreases by about 4f. Our goal is to provide humanoid electronic components.

[Means for solving the problem] The present invention includes a ceramic sintered body, an internal electrode formed inside the P ceramic sintered body, and an external electrode electrically connected to the internal N-pole. A ceramic electronic component is provided in which the north pole is formed by base metal implantation.

Here e, the ceramic sintered body has a void extending inward from the end face, and a conductive metal layer or a conductive metal oxide layer is formed on the surface of the ceramic sintered body surrounding this void. ing. The external electrode is formed by injecting and solidifying I metal into a cavity surrounding which a conductive metal layer or a conductive metal oxide layer is formed.

1 Effect 1 In this invention, a conductive metal layer or a conductive metal oxide layer is formed around the voids of the ceramic sintered body,
A base metal is placed inside the conductive metal layer or conductive metal oxide layer. Therefore, most of the base metal constituting and covering the internal electrodes is not in direct contact with the ceramic sintered body, but is solidified in contact with the conductive metal scraps or the 1jj metal oxide layer. The bonding strength between the conductive metal layer or the conductive metal oxide layer and the base metal is much higher than the bonding strength between the ceramic sintered body and the base metal, so the base metal contracts during assimilation.
There is no gap between the conductive metal layer or the conductive metal oxide layer and the base metal. If J<C, the conductive metal layer or lj conductive gold metal oxide layer) becomes a base layer for the base metal, so that the base metal is filled and solidified without creating a single gap.

[Description of Embodiment 1 FIG. 1 shows a cross-sectional view of an embodiment of the present invention, and FIG. 2 shows a part of the main part of FIG. 1 in an enlarged manner.

This embodiment shows an example in which the present invention is applied to a laminated ceramic condenser.

A plurality of internal electrodes 12a... are provided within the ceramic sintered body 11.
12d are stacked on each other with a part of the ceramic sintered body interposed therebetween. Moreover, 1 facing the ceramic sintered body 110
A pair of external electrodes 13 and 14 are provided on the pair of end faces.

One of the external electrodes 13 has a
Internal electrodes 12a and 12h extending by C are formed. Internal upper electrodes 12c and 12d are connected to the other external electrode 14 formed on the second end surface.

By the way, each internal electrode 12a...12d is made of ceramic green sheet with carbon powder or carbon powder. Base 1 consisting of mixed powder of Lamic powder
~ is printed, laminated with other Reramic Green Sea I~ constituting the ceramic sintered body 11, and fired to form internal electrodes 12a...12 (1). It is formed by forming a void layer in the part where the device is to be installed 1), and then applying a base metal to the void layer.The internal electrodes 12a...12d are formed by adding 71 base metals to the base metal. , published in Japanese Patent Publication No. 53-35085.

However, as described in -1-, the C external electrode 12a.
...If 12d is formed by 11 base metals,
As the gap is formed, the capacitance decreases by 11 (decreases).In this embodiment, each internal electrode 128...
・1? (A conductive metal layer or a conductive metal oxide layer 16a...16(1) around the ?I, that is, around the void layer
is formed.

This conductive metal layer or conductive 11 metal oxide layer 16a.
. . 16d is formed prior to the base metal FJ forming the internal electrodes 12a . . . 12d, and serves as a base metal base layer. Here, since the conductive metal layer or the conductive metal oxide layer 16a...16d is formed around the void layer in advance, when 11 base metals are solidified,
The base metal is a conductive metal layer or a conductive metal oxide layer 16.
a...Assimilate in close contact with 1611. Therefore, even if the base metal and the conductive metal layer J: or the conductive 1q metal oxide layer 16a...16(
l No zusama occurs between the two.

Note that the conductive metal or conductive metal oxide layer 16a...
-16d is formed as follows.

In the case of conductive metal layers, for example, paste 1 consisting of silver, silver-palladium and bismuth species 1
or by applying a solution to the void layer, drying, and then baking. Also, Ni or C
LI (? Which electroless method (-) is performed,
A conductive metal layer can also be formed by using H. Similarly, in the case of a conductive metal oxide layer, L, Sn□, , Ir
e203, In20a-8nOz (indium tin oxide layer, so-called ITO) and RIf 02 <' can be formed by injecting a solution into the void layer, drying and baking.

#Electrical 11 Metal layer or Conductive 11 Metal oxide F1!16
a...16dl, as mentioned above, it is sintered into a ceramic sintered body, so it is firmly adhered to the ceramic sintered body (411).Furthermore, this conductive metal layer or conductive metal oxide The material layers 16a...16d are formed very sparingly, and are not formed in such a way that they can reliably cover the ceramic sintered body 11. Therefore, even if they are subjected to shrinkage force during the assimilation of base metals, Even if the conductive metal layer or the conductive metal oxide WJ16a...16(l) and the ceramic sintered body 11, it is impossible for one gap to occur.

In addition, regarding the external electrodes 13.14, the internal electrodes 12a
...12(1) It can be formed on both end faces of the ceramic sintered 9 integral 11 after forming 1, or it can be formed before the injection of base metal. When forming the external electrodes i3.ii prior to the process, the external electrodes 13.14 are formed of <K44 rice grains so that base metals can pass through them. a first layer covering with one component,
A portion of tin or lead-tin may constitute a second layer formed outside the first layer. In this case, a first layer based on nickel is formed within the base metal implant, and a second layer is formed after the base metal implant. By forming an external electrode with a 2N4 structure in this way, it is possible to prevent the external electrode from disappearing or being eaten away by molten lead. 1
Forming and covering with 6 materials also improves adhesion with solder.

No. 3N shows another embodiment of the present invention, in which an example applied to a cylindrical capacitor 20 is shown. The cylindrical capacitor 20 includes an internal electrode 22 formed at the center of a ceramic sintered body 21 by injecting base metal into a gap extending from an end face of the ceramic sintered body 21, and the other electrode formed on the outer peripheral surface. It has 23 etc. This internal electrode 2
The container between the external electrode 24.2 and the electrode 233 is the external electrode 24.2F.
5. Here, too, the outer periphery of the external electrode 22 is covered with a conductive metal layer or a conductive tII metal oxide-26.
is formed prior to the introduction of base metals. Therefore, 11 people were required to form the internal electrodes 22! , :IJF! Even if the metal 22 contracts, the internal electrode 2
There is no M gap around 2.

Similarly, in FIG. 3, the internal electrode 22 is formed to penetrate through the other end surface.
When forming an electrode in the center using a base metal tJ, a conductive metal layer or a conductive metal layer is placed around it in advance.
Forms a conductive metal oxide layer and similarly does not create a gap between the base metal and the ceramic sintered body.

Furthermore, base metals are injected into the voids formed within the sintered body.
If it is an electronic component that has a base metal part inside a receramic sintered body, it is not limited to L RAMIC-1, for example, λ is E? Lamic ceramics can be widely applied to various ceramic electronic components.

[Effect of the invention 1] According to the present invention, ceramic firing is applied to the inner electrode made of solidified base metal in the void extending inward from the end face so as to surround the void. Since the conductive metal layer 8 or the conductive metal oxide layer is formed in the body, the internal electrodes are connected to the II conductive metal layer or the conductive metal layer 8.
It is firmly bonded to the ceramic sintered body via the metal oxide layer. Therefore, even if contractile force is generated due to the assimilation of L & genera, gaps b and J will not occur, and therefore reliability 1
1. It is possible to obtain excellent ceramic electronic components.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a ceramic plate according to an embodiment of the present invention. FIG. 2 is an enlarged sectional view of the back of FIG. 1. FIG. 3 is a sectional view of another embodiment of the invention. 4 and 5 are a cross-sectional view and an enlarged cross-sectional view of the main parts of the prior art ceramic "Nenden 1J" which is the cost of this invention. In the figures, 11 is a ceramic sintered body, 12a... i
2d is an internal electrode, 13.14 is an external electrode, 16a...
16d indicates a conductive metal layer or a conductive metal oxide layer.

Claims (3)

[Claims] (1) A ceramic electronic component comprising a ceramic sintered body, an internal electrode formed within the ceramic sintered body, and an external electrode electrically connected to the internal electrode, the ceramic sintered body comprising: , having a void extending inward from the end face, a conductive metal layer or a conductive metal oxide layer formed on the surface of the ceramic sintered body surrounding the void, and a conductive metal layer or a conductive metal oxide layer injected into the void. A ceramic electronic component characterized by comprising an internal electrode made of a base metal. (2) The ceramic electronic component is a ceramic capacitor, and the internal electrode extends inward from the first and second end surfaces of the ceramic sintered body, and the internal electrode extends from the first end surface. Claim 1, wherein the extended internal electrode and the internal electrode extended from the second end surface are arranged so as to overlap each other with a part of the ceramic sintered body interposed therebetween. ceramic electronic components. (3) A plurality of internal electrodes extending from the first end surface and a plurality of internal electrodes extending from the second end surface are formed and alternately overlap each other so as to be interposed with each other. A ceramic electronic component according to claim 2.