JPS6246271B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for continuous soldering of overlapping portions of copper tapes formed longitudinally on the periphery of a filament such as an insulated cable.

Generally, in the manufacture of plastic insulated cables, in order to prevent deterioration due to water absorption, a water-blocking layer is sometimes provided by vertically forming a metal tape such as copper or lead on the circumference of an insulated conductor. The water-shielding layer in this case is very thin, unlike a protective sheath such as a lead or aluminum sheath, and therefore the metal tape used to form the water-shielding layer is made of a thin foil-like material. things are used.

Here, a conventional method for forming a water-blocking layer using such a metal tape will be explained with reference to FIG.

In Figure 1, 1 is an insulated copper conductor (striated body), 2 is a shielding copper tape plated with solder material (tin-lead) on one side of both ends; 1 are placed vertically in the length direction, and are formed in such a state that they are stacked so that the solder plated end surfaces thereof face each other. and copper tape 2
The overlapping parts are soldered one after another. Conventionally, in order to bring the overlapping parts into close contact during this soldering, iron plates 3 have been pressed before and after the torch heating part. However, in this case, the frictional resistance between the copper tape 2 and the iron plate 3 on the upper side of the overlapping part is large, so when the copper tape 2 is run together with the filament 1 in the direction of the arrow shown in the figure, The above-mentioned upper copper tape 2 is stretched to one side, causing a raised portion 4, which makes it impossible to perform normal soldering with the lower copper tape. In addition, in order to reduce this frictional resistance, if a free roll is used for pressurization instead of the iron plate 4, when the pressurizing force is small, the frictional resistance between it and the free roll will be small and there will be no problem. If the pressing force is increased in order to bring the overlapped portions into sufficient contact, the copper tape 2 will stretch on one side, as in the case shown in FIG.

SUMMARY OF THE INVENTION An object of the present invention is to provide a continuous copper tape soldering method that eliminates the above-mentioned drawbacks of the prior art and allows good soldering at all times.

A feature of the present invention is that when sequentially soldering overlapping portions of copper tape formed vertically on the periphery of a filament, the front and rear heating parts are heated to solder the overlapping portions. The overlapping portions are sequentially soldered by heating while applying pressure using a pressure jig consisting of a roll that is rotated at the same circumferential speed as the traveling speed of the filament at least at the rear. It is in.

It goes without saying that the pressure jig consisting of a rotationally driven roll is of a mechanism that itself is rotationally driven.

An embodiment of the method of the present invention will be described in detail below with reference to FIG.

FIG. 2 shows an embodiment of the method of the present invention, which can be briefly described as a method of soldering rotary drive rolls interlocked with a line speed detector using a soldering device equipped on both sides of a heating torch. It shows.

In FIG. 2, numerals 1 and 2 are the same as in FIG. 1, and their explanation will be omitted here. In this embodiment, when the overlapping parts of the copper tapes 2 are sequentially heated and soldered using a torch 5, in order to bring the overlapping parts into close contact, the heating part is A driving roll 6 is provided at least at the rear of the direction (with respect to the direction), and when the running direction of the filament 1 and the copper tape 2 is in the direction of arrow A in the figure, the running speed of the copper tape 2 is detected by a line speed detector 7. As a result, the roll 6 is rotated in the direction of arrow B in the figure so that the circumferential speed is the same as the running speed of the copper tape 2, and a pressing force is applied to the roll 6 in the direction of pressing the overlapped portion of the copper tape 2. soldering is performed continuously.

Therefore, according to this embodiment, since the circumferential speed of the roll 6 is synchronized with the running speed of the copper tape 2, unnecessary frictional resistance is not generated between the roll 6 and the copper tape 2, and as a result, the copper Normal and good soldering can be performed continuously without causing the tape 1 to elongate or lift up.

In order to make the soldering stronger and more reliable, when soldering the overlapping parts of the copper tape 1, it is recommended to heat the solder with a torch 5 while interposing a tin-lead solder sheet. It's good to do it.

Further, in the above-described embodiment, the drive roll 6 is used, but it may also be of a caterpillar type as a pressure jig that similarly does not cause friction between the drive roll 6 and the copper tape 2 at the overlapped portion. , the effect is the same.

As explained above, according to the present invention, the overlapped portions of the copper tapes are heated and soldered using a pressure jig consisting of a roll driven to rotate at the same circumferential speed as the running speed of the filament. As a result, the circumferential speed of the roll is synchronized with the running speed of the copper tape, so unnecessary frictional resistance (mainly due to sliding friction) is not generated between the pressing jig and the copper tape, and as a result, the copper There is a remarkable effect that the tape does not stretch to one side, does not rise, and can always perform good soldering on long objects.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram of a conventional method for continuous soldering of copper tapes, and Fig. 2 is an explanatory diagram of an example of a method for continuous soldering of overlapped portions of copper tapes to explain an embodiment of the method of the present invention. FIG. 1: Striatum, 2: Copper tape, 5: Torch, 6:
Drive roll, 7: line speed detector.

Claims (1)

[Claims] 1 Copper tape plated with solder material on one side of both ends was vertically applied along the circumference of the filament, and the copper tapes were overlapped so that the both end surfaces plated with the solder material faced each other. In the case where the copper tape is formed into a cylindrical shape and the overlapping parts are sequentially heated and soldered, at least the overlapping part at the front and rear of the heating part is connected to the filament body. The overlapping portions are sequentially soldered by heating while applying pressure using a pressure jig consisting of a roll that is rotationally driven at the same circumferential speed as the running speed of the linear body. Continuous soldering method for overlapping parts of spliced copper tape.