JPS6246267A - Oscillation sensor - Google Patents
Oscillation sensorInfo
- Publication number
- JPS6246267A JPS6246267A JP18610985A JP18610985A JPS6246267A JP S6246267 A JPS6246267 A JP S6246267A JP 18610985 A JP18610985 A JP 18610985A JP 18610985 A JP18610985 A JP 18610985A JP S6246267 A JPS6246267 A JP S6246267A
- Authority
- JP
- Japan
- Prior art keywords
- oscillator
- piezoelectric element
- electric circuit
- bonded
- vibrator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、振′動物体における弾性振動を検出するのに
適した振動センサ、特に所定の周波数について検出感度
の優れた共振型振動センサと非共振で用いられる加速度
センサに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a vibration sensor suitable for detecting elastic vibrations in a vibrating body, particularly a resonant vibration sensor with excellent detection sensitivity at a predetermined frequency, and a non-resonant vibration sensor suitable for detecting elastic vibrations in a vibrating body. This relates to acceleration sensors used in
従来の技術
従来、振動物体における弾性振動を検出する圧電型セン
サとして、振動物体の固有振動数に共振周波数を合わせ
特定周波数成分のみを検出する共振型あるいは所定周波
数領域の振動成分を検出する非共振型、特に低周波にお
ける感度向上をはかった、屈曲振動モードの片持ち梁型
構造である矩形状貼り合わせ圧電振動子が広く知られて
いる。Conventional technology Conventionally, piezoelectric sensors that detect elastic vibrations in a vibrating object have been either resonant type sensors that match the resonance frequency to the natural frequency of the vibrating object and detect only specific frequency components, or non-resonant sensors that detect vibration components in a predetermined frequency range. A rectangular bonded piezoelectric vibrator, which has a cantilever structure in a bending vibration mode, is widely known, and is designed to improve sensitivity, especially at low frequencies.
片持ち梁型構造をとる振動センサの場合、振動子の一端
固定という固定条件の実現が難しいが、特開昭59−7
0923号公報に示されているような振動検出部分であ
る片持ち梁型構造の屈面振動子を円板状貼り合わせ圧電
素子中に溝を切ることによって作り込み、前記屈曲振動
子はその一端において貼り合わせ圧電素子円板と一体で
あり円板の周辺部を固定支持した構造にすることにより
、固定条件の安定化がはかられているものがある。この
ような圧電型振動センサの信号は、別途用意された電荷
増幅器あるいは電圧増幅器を通して、所定の出力信号に
して取出される。In the case of a vibration sensor with a cantilever structure, it is difficult to achieve the fixing condition of fixing the vibrator at one end, but
A bending surface vibrator with a cantilever structure, which is a vibration detection portion as shown in Publication No. 0923, is fabricated by cutting a groove in a disk-shaped bonded piezoelectric element, and the bending vibrator is attached to one end of the disk-shaped bonded piezoelectric element. In some cases, the bonded piezoelectric element is integrated with a disk and has a structure in which the peripheral portion of the disk is fixedly supported, thereby stabilizing the fixing conditions. The signal of such a piezoelectric vibration sensor is outputted as a predetermined output signal through a separately prepared charge amplifier or voltage amplifier.
発明が解決しようとする問題点
このような従来の振動センサでは、低周波になるほどセ
ンサの出力インピーダンスが高くなって周囲の雑音が入
り易くなるため、センサと増幅器との結線を特殊なシー
ルド線を用いる必要があり、かつ回路のノイズ対策を考
慮しなければならず高価なものとなる。あるいは信号処
理回路部分をセンサ内部に組み込み、低インピーダンス
で出力させ雑音に対する影響を低減させるような場合、
回路部分によってセンサの小型化がはばまれるといった
問題点があった。Problems to be Solved by the Invention In such conventional vibration sensors, the lower the frequency, the higher the output impedance of the sensor becomes, making it easier for ambient noise to enter. In addition, noise countermeasures for the circuit must be taken into consideration, making it expensive. Or, if the signal processing circuit part is built into the sensor and the signal is output at low impedance to reduce the influence of noise,
There was a problem in that the circuit part hindered miniaturization of the sensor.
そこで、本発明は振動検出部分と信号処理回路を一体化
させて、雑音に対する影響を低減させ、安価で小型化が
はかれるようにしたものである。Accordingly, the present invention integrates the vibration detection portion and the signal processing circuit to reduce the influence of noise and to achieve miniaturization at low cost.
問題点を解決するための手段
周辺を固定された厚さ方向に分極軸を有する板状圧電素
子2枚を貼り合わせた構造の貼り合わせ圧電素子に切抜
きを設けることにより屈曲振動モード振動子を作り込み
、前記屈曲振動子部を除く貼り合わせ圧電素子上面に前
記屈曲振動子の出力信号を処理する電気回路を構成する
。Means to Solve the Problem A flexural vibration mode vibrator was created by providing a cutout in a bonded piezoelectric element, which has a structure in which two plate-shaped piezoelectric elements having polarization axes in the thickness direction whose periphery is fixed are bonded together. In addition, an electric circuit for processing the output signal of the bending vibrator is configured on the upper surface of the bonded piezoelectric element excluding the bending vibrator section.
作 用
振動を検出する屈曲振動子部分と信号処理回路を一体化
させるととにより、振動検出部の信号と処理回路間の接
続ケーブルが不要となり、さらに信号処理回路が電圧増
幅の場合ケーブル容量がないので均一なセンサ感度が得
られる。また、振動検出部の高インピーダンス出力を信
号処理回路で低インピーダンスに変換させると、外部雑
音に対し影響されにくく、外部へのケーブルは通常の電
線で行なえるという大きな利点があり、安価で小型化が
はかれ、量産性に富んだものとなる。By integrating the bending vibrator part that detects operational vibration and the signal processing circuit, there is no need for a connecting cable between the signal of the vibration detection section and the processing circuit, and if the signal processing circuit is voltage amplification, the cable capacity is reduced. Uniform sensor sensitivity can be obtained. In addition, converting the high impedance output of the vibration detection section to low impedance using a signal processing circuit has the great advantage of being less susceptible to external noise and allowing cables to be connected to the outside using regular electric wires, making it cheaper and more compact. This makes it possible to mass-produce the product.
実施例
以下、本発明の実施例について図面を用いて詳細に説明
する。Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
第1図は、本発明にかかる振動センサの一実施例を示す
分解斜視図である。厚さ方向に分極軸を有する円板状圧
電素子1a、1bは貼)合わせた構造の貼り合わせ圧電
素子1に、レーザ加工等によって“コ”の字状のスリッ
ト(切抜き)2を形成し、スリット2で囲まれた部分は
片持ち梁型構造の屈曲振動モード振動子3となる。屈曲
振動子3の上下面および貼り合わせ面には電極を有し、
圧電素子1a、1bの分極軸方向が互いに逆となるごと
く貼シ合わせた場合屈曲撮動子3の上下面電極は出力取
出し用電極となる。屈曲振動子3が当たる部分に溝6を
設けた金属等の導電性材料で作られた固定部材5を、屈
曲振動子3の下面電極と導通がはかられるごとく貼り合
わせ圧電素子1と接着等で固定し、屈曲振動子3の周囲
を固定して用いる。屈曲振動子3を除く貼り合わせ圧電
素子上面には、電気回路を構成できる電極4を有し、屈
曲振動子3の上面電極と電気回路入力電極とを共通にし
、固定部材6を電気回路をアースとしてインピーダンス
変換等の信号処理回路を構成している。屈曲振動子3を
除く貼シ合わせ圧電素子1は、片持ち梁型構造の一端固
定という固定条件の安定化のために必要であるが、振動
検出には関係なくこの部分に信号処理回路を構成するこ
とにより小型化がはかられ、信号処理回路によって出力
信号を低インピーダンスに変換できるので外来雑音に対
し強くでき、回路のためのプリント基板、特殊なケーブ
ル等が不要となり安価で量産性如富んだものとなる。FIG. 1 is an exploded perspective view showing an embodiment of a vibration sensor according to the present invention. The disk-shaped piezoelectric elements 1a and 1b having polarization axes in the thickness direction are laminated together.A "U"-shaped slit (cutout) 2 is formed in the laminated piezoelectric element 1 by laser processing or the like. The portion surrounded by the slit 2 becomes a flexural vibration mode vibrator 3 having a cantilever structure. The bending vibrator 3 has electrodes on the upper and lower surfaces and the bonding surface,
When the piezoelectric elements 1a and 1b are pasted together so that their polarization axes directions are opposite to each other, the upper and lower surface electrodes of the bending sensor 3 serve as output extraction electrodes. A fixing member 5 made of a conductive material such as metal and having a groove 6 in the part where the bending vibrator 3 contacts is bonded to the piezoelectric element 1 so as to be electrically connected to the lower electrode of the bending vibrator 3. and the periphery of the bending vibrator 3 is used. The top surface of the bonded piezoelectric element, excluding the bending vibrator 3, has an electrode 4 that can form an electric circuit. As a result, a signal processing circuit such as impedance conversion is configured. The laminated piezoelectric element 1 excluding the bending vibrator 3 is necessary to stabilize the fixing condition of fixing one end of the cantilever structure, but a signal processing circuit is configured in this part regardless of vibration detection. This allows for miniaturization, and the signal processing circuit converts the output signal to low impedance, making it resistant to external noise. It also eliminates the need for printed circuit boards and special cables, making it inexpensive and easy to mass-produce. It becomes something.
第2図は、撮動センサとして組立てた場合の一例を示し
たもので、固定部材6をエポキシ等の樹脂系銅張板で構
成し、貼シ合わせ圧電素子と信号処理回路部分7を、金
属等でシールドとしだ後ポリウレタン樹脂等でモールド
したものである。固定部材として銅張板を用いることに
より、信号処理回路への入力および出力は固定部材5の
銅箔を用いて行なえ、屈曲振動子が当たる部分の溝6に
ついては銅箔のエツチングで簡単に作ることができ、組
立てが簡単で量産性に富んだものとなる。FIG. 2 shows an example of the case assembled as a photographic sensor, in which the fixing member 6 is made of a resin-based copper clad plate such as epoxy, and the laminated piezoelectric element and signal processing circuit part 7 are made of metal. After forming a shield with a polyurethane resin or the like, it is molded with a polyurethane resin or the like. By using a copper clad plate as the fixing member, input and output to the signal processing circuit can be performed using the copper foil of the fixing member 5, and the groove 6 in the part where the bending vibrator hits can be easily made by etching the copper foil. This makes it easy to assemble and highly suitable for mass production.
発明の効果
本発明によれば、同−貼り合わせ圧電素子中に振動検出
部の屈曲振動子と信号処理の電気回路を一体化させたこ
とにより、センサの小型化がはかれると共に外部雑音に
対し強くでき、回路のためのプリント基板、特殊なケー
ブル等が不要となり安価で量産性に富む。Effects of the Invention According to the present invention, by integrating the bending vibrator of the vibration detection section and the signal processing electric circuit into the same bonded piezoelectric element, the sensor can be made smaller and more resistant to external noise. This eliminates the need for printed circuit boards, special cables, etc., making it inexpensive and highly suitable for mass production.
第1図は本発明の一実施例における振動センサの分解斜
視図、第2図は同実施例における組立後の斜視図である
。
1・・・・・・貼り合わせ圧電素子、2・・・・・・ス
リット、3・・・・・・屈曲モード振動子、6・・・・
・・固定部材。
代理人の氏名 弁理士 中 尾 敏 男 ほか1名第1
図
第2図FIG. 1 is an exploded perspective view of a vibration sensor according to an embodiment of the present invention, and FIG. 2 is a perspective view of the same embodiment after assembly. 1... Bonded piezoelectric element, 2... Slit, 3... Bending mode vibrator, 6...
・Fixed member. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2
Claims (3)
り合わせた構造の貼り合わせ圧電素子と、前記貼り合わ
せ圧電素子の周辺を固定する固定部材と、前記貼り合わ
せ圧電素子に切抜きを設けることにより形成された矩形
状の屈曲振動モード振動子と、前記矩形状屈曲振動子の
上下面と貼り合わせ面に設けられた電極と、前記矩形状
屈曲振動子部を除く貼り合わせ圧電素子上面に電気回路
を構成する電極とを有し、前記貼り合わせ圧電素子上面
に電気回路を構成したことを特徴とする振動センサ。(1) A bonded piezoelectric element having a structure in which two plate-shaped piezoelectric elements having polarization axes in the thickness direction are bonded together, a fixing member that fixes the periphery of the bonded piezoelectric element, and a cutout in the bonded piezoelectric element. a rectangular bending vibration mode vibrator formed by providing a rectangular bending vibration mode vibrator, electrodes provided on the upper and lower surfaces of the rectangular bending vibrator and a bonding surface, and a bonded piezoelectric element excluding the rectangular bending vibrator portion. A vibration sensor comprising: an electrode constituting an electric circuit on an upper surface; and an electric circuit configured on the upper surface of the bonded piezoelectric element.
、導電性材料で構成したことを特徴とする特許請求の範
囲第1項記載の振動センサ。(2) The vibration sensor according to claim 1, wherein the fixing member fixing the periphery of the bonded piezoelectric element is made of a conductive material.
樹脂系銅張板で構成したことを特徴とする特許請求の範
囲第1項記載の振動センサ。(3) The vibration sensor according to claim 1, wherein the fixing member for fixing the periphery of the bonded piezoelectric element is made of a resin-based copper clad plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18610985A JPS6246267A (en) | 1985-08-24 | 1985-08-24 | Oscillation sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18610985A JPS6246267A (en) | 1985-08-24 | 1985-08-24 | Oscillation sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6246267A true JPS6246267A (en) | 1987-02-28 |
JPH052173B2 JPH052173B2 (en) | 1993-01-11 |
Family
ID=16182516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18610985A Granted JPS6246267A (en) | 1985-08-24 | 1985-08-24 | Oscillation sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6246267A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4995592A (en) * | 1988-12-22 | 1991-02-26 | Foseco International Limited | Purifying molten metal |
JP2009053087A (en) * | 2007-08-28 | 2009-03-12 | Yamaha Corp | Motion sensor and method for manufacturing the same |
-
1985
- 1985-08-24 JP JP18610985A patent/JPS6246267A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4995592A (en) * | 1988-12-22 | 1991-02-26 | Foseco International Limited | Purifying molten metal |
JP2009053087A (en) * | 2007-08-28 | 2009-03-12 | Yamaha Corp | Motion sensor and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JPH052173B2 (en) | 1993-01-11 |
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