JPH052173B2 - - Google Patents
Info
- Publication number
- JPH052173B2 JPH052173B2 JP18610985A JP18610985A JPH052173B2 JP H052173 B2 JPH052173 B2 JP H052173B2 JP 18610985 A JP18610985 A JP 18610985A JP 18610985 A JP18610985 A JP 18610985A JP H052173 B2 JPH052173 B2 JP H052173B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- bonded
- bonded piezoelectric
- vibrator
- fixing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005452 bending Methods 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 230000010287 polarization Effects 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 238000001514 detection method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 102100027340 Slit homolog 2 protein Human genes 0.000 description 1
- 101710133576 Slit homolog 2 protein Proteins 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、振動物体における弾性振動を検出す
るのに適した振動センサ、特に所定の周波数につ
いて検出感度の優れた共振型振動センサと非共振
で用いられる加速度センサに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is a vibration sensor suitable for detecting elastic vibrations in a vibrating object, particularly a resonant type vibration sensor with excellent detection sensitivity at a predetermined frequency, and a non-resonant type vibration sensor suitable for detecting elastic vibrations in a vibrating object. The present invention relates to an acceleration sensor.
従来の技術
従来、振動物体における弾性振動を検出する圧
電型センサとして、振動物体の固有振動数に共振
周波数を合わせ特定周波数成分のみを検出する共
振型あるいは所定周波数領域の振動成分を検出す
る非共振型、特に低周波における感度向上をはか
つた、屈曲振動モードの片持ち梁型構造である矩
形状貼り合わせ圧電振動子が広く知られている。
片持ち梁型構造をとる振動センサの場合、振動子
の一端固定という固定条件の実現が難しいが、特
開昭59−70923号公報に示されているような振動
検出部分である片持ち梁型構造の屈曲振動子を円
板状貼り合わせ圧電素子中に溝を切ることによつ
て作り込み、前記屈曲振動子はその一端において
貼り合わせ圧電素子円板と一体であり円板の周辺
部を固定支持した構造にすることにより、固定条
件の安定化がはかられているものがある。このよ
うな圧電型振動センサの信号は、別途用意された
電荷増幅器あるいは電圧増幅器を通して、所定の
出力信号にして取出される。Conventional technology Conventionally, piezoelectric sensors that detect elastic vibrations in a vibrating object have been either resonant type sensors that match the resonant frequency to the natural frequency of the vibrating object and detect only a specific frequency component, or non-resonant sensors that detect vibration components in a predetermined frequency range. 2. Description of the Related Art Rectangular bonded piezoelectric vibrators, which have a cantilever structure in a bending vibration mode and have improved sensitivity, especially at low frequencies, are widely known.
In the case of a vibration sensor that has a cantilever type structure, it is difficult to achieve the fixing condition of fixing the vibrator at one end. A bending vibrator of the structure is fabricated by cutting a groove in a disk-shaped bonded piezoelectric element, and the bending vibrator is integral with the bonded piezoelectric disk at one end and fixes the peripheral portion of the disk. Some stabilize the fixing conditions by creating a supported structure. The signal of such a piezoelectric vibration sensor is outputted as a predetermined output signal through a separately prepared charge amplifier or voltage amplifier.
発明が解決しようとする問題点
このような従来の振動センサでは、低周波にな
るほどセンサの出力インピーダンスが高くなつて
周囲の雑音が入り易くなるため、センサと増幅器
との結線を特殊なシールド線を用いる必要があ
り、かつ回路のノイズ対策を考慮しなければなら
ず高価なものとなる。あるいは信号処理回路部分
をセンサ内部に組み込み、低インピーダンスで出
力させ雑音に対する影響を低減させるような場
合、回路部分によつてセンサの小型化がはばまれ
るといつた問題点があつた。Problems to be Solved by the Invention In such conventional vibration sensors, the lower the frequency, the higher the output impedance of the sensor becomes, making it easier for ambient noise to enter. In addition, noise countermeasures for the circuit must be taken into consideration, making it expensive. Alternatively, when a signal processing circuit section is built into the sensor to output at low impedance and reduce the influence of noise, there is a problem that the circuit section hinders miniaturization of the sensor.
そこで、本発明は振動検出部分と信号処理回路
を一体化させて、雑音に対する影響を低減させ、
安価で小型化がはかれるようにしたものである。 Therefore, the present invention integrates the vibration detection part and the signal processing circuit to reduce the influence of noise.
It is designed to be inexpensive and compact.
問題点を解決するための手段
周辺を固定された厚さ方向に分極軸を有する板
状圧電素子2枚を貼り合わせた構造の貼り合わせ
圧電素子に切抜きを設けることにより屈曲振動モ
ード振動子を作り込み、前記屈曲振動子部を除く
貼り合わせ圧電素子上面に前記屈曲振動子の出力
信号を処理する電気回路を構成する。Measures to solve the problem: A flexural vibration mode vibrator is created by providing a cutout in a bonded piezoelectric element, which has a structure in which two plate-shaped piezoelectric elements having a fixed periphery and a polarization axis in the thickness direction are bonded together. In addition, an electric circuit for processing the output signal of the bending vibrator is configured on the upper surface of the bonded piezoelectric element excluding the bending vibrator section.
作 用
振動を検出する屈曲振動子部分と信号処理回路
を一体化させることにより、振動検出部の信号と
処理回路間の接続ケーブルが不要となり、さらに
信号処理回路が電圧増幅の場合ケーブル容量がな
いので均一なセンサ感度が得られる。また、振動
検出部の高インピーダンス出力を信号処理回路で
低インピーダンスに変換させると、外部雑音に対
し影響されにくく、外部へのケーブルは通常の電
線で行なえるという大きな利点があり、安価で小
型化がはかれ、量産性に富んだものとなる。Function By integrating the bending vibrator part that detects vibration and the signal processing circuit, there is no need for a connecting cable between the signal of the vibration detection part and the processing circuit, and if the signal processing circuit is voltage amplification, there is no cable capacity. Therefore, uniform sensor sensitivity can be obtained. In addition, converting the high impedance output of the vibration detection section to low impedance using a signal processing circuit has the great advantage of being less susceptible to external noise and allowing cables to be connected to the outside using regular electric wires, making it cheaper and more compact. This makes it possible to mass-produce the product.
実施例
以下、本発明の実施例について図面を用いて詳
細に説明する。Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
第1図は、本発明にかかる振動センサの一実施
例を示す分解斜視図であり、厚さ方向に分極軸を
有する円板状圧電素子1a,1bは貼り合わせた
構造の貼り合わせ圧電素子1に、レーザ加工等に
よつて“コ”の字状のスリツト(切抜き)2を形
成し、スリツト2で囲まれた部分は片持ち梁型構
造の屈曲振動モード振動子3となる。屈曲振動子
3の上下面および貼り合わせ面には電極を有し、
圧電素子1a,1bの分極軸方向が互いに逆とな
るごとく貼り合わせ場合屈曲振動子3の上下面電
極は出力取出し用電極となる。屈曲振動子3が当
たる部分に溝6を設けた金属等の導電性材料で作
られた固定部材5を、屈曲振動子3の下面電極と
導通がはかられるごとく貼り合わせ圧電素子1と
接着等で固定し、屈曲振動子3の周囲を固定して
用いる。屈曲振動子3を除く貼り合わせ圧電素子
上面には、電気回路を構成できる電極4を有し、
屈曲振動子3の上面電極と電気回路入力電極とを
共通にし、固定部材5を電気回路をアースとして
インピーダンス変換等の信号処理回路を構成して
いる。屈曲振動子3を除く貼り合わせ圧電素子1
は、片持ち梁型構造の一端固定という固定条件の
安定化のために必要であるが、振動検出には関係
なくこの部分に信号処理回路を構成することによ
り小型化がはかられ、信号処理回路によつて出力
信号を低インピーダンスに変換できるので外来雑
音に対し強くでき、回路のためのプリント基板、
特殊なケーブル等が不要となり安価で量産性に富
んだものとなる。 FIG. 1 is an exploded perspective view showing an embodiment of a vibration sensor according to the present invention, in which disk-shaped piezoelectric elements 1a and 1b having polarization axes in the thickness direction are bonded together. Then, a U-shaped slit (cutout) 2 is formed by laser processing or the like, and the portion surrounded by the slit 2 becomes a flexural vibration mode vibrator 3 having a cantilever structure. The bending vibrator 3 has electrodes on the upper and lower surfaces and the bonding surface,
When the piezoelectric elements 1a and 1b are bonded together so that their polarization axes directions are opposite to each other, the upper and lower surface electrodes of the bending vibrator 3 serve as output extraction electrodes. A fixing member 5 made of a conductive material such as metal and having a groove 6 in the part where the bending vibrator 3 contacts is bonded to the piezoelectric element 1 so as to be electrically connected to the lower electrode of the bending vibrator 3. and the periphery of the bending vibrator 3 is used. On the top surface of the bonded piezoelectric element except for the bending vibrator 3, there is an electrode 4 that can form an electric circuit.
The upper surface electrode of the bending vibrator 3 and the electric circuit input electrode are made common, and the fixed member 5 is used to ground the electric circuit to form a signal processing circuit such as impedance conversion. Bonded piezoelectric element 1 excluding bending vibrator 3
is necessary to stabilize the fixing condition of fixing one end of the cantilever structure, but by configuring a signal processing circuit in this part regardless of vibration detection, miniaturization can be achieved, and the signal processing The circuit can convert the output signal to low impedance, making it resistant to external noise.
No special cables are required, making it inexpensive and highly suitable for mass production.
第2図は、振動センサとして組立てた場合の一
例を示したもので、固定部材5をエポキシ等の樹
脂系銅張板で構成し、貼り合わせ圧電素子と信号
処理回路部分7を、金属等でシールドとした後ポ
リウレタン樹脂等でモールドしたものである。固
定部材として銅張板を用いることにより、信号処
理回路への入力および出力は固定部材5の銅箔を
用いて行なえ、屈曲振動子が当たる部分の溝6に
ついては銅箔のエツチングで簡単に作ることがで
き、組立てが簡単で量産性に富んだものとなる。 Fig. 2 shows an example of the case assembled as a vibration sensor, in which the fixing member 5 is made of a resin-based copper clad plate such as epoxy, and the bonded piezoelectric element and signal processing circuit part 7 are made of metal or the like. It is made into a shield and then molded with polyurethane resin or the like. By using a copper clad plate as the fixing member, input and output to the signal processing circuit can be performed using the copper foil of the fixing member 5, and the groove 6 in the part where the bending vibrator hits can be easily made by etching the copper foil. This makes it easy to assemble and highly suitable for mass production.
発明の効果
本発明によれば、同一貼り合わせ圧電素子中に
振動検出部の屈曲振動子と信号処理の電気回路を
一体化させたことにより、センサの小型化がはか
れると共に外部雑音に対し強くでき、回路のため
のプリント基板、特殊なケーブル等が不要となり
安価で量産性に富む。Effects of the Invention According to the present invention, by integrating the bending vibrator of the vibration detection section and the signal processing electric circuit into the same bonded piezoelectric element, the sensor can be made smaller and more resistant to external noise. This eliminates the need for printed circuit boards, special cables, etc., making it inexpensive and highly suitable for mass production.
第1図は本発明の一実施例における振動センサ
の分解斜視図、第2図は同実施例における組立後
の斜視図である。
1……貼り合わせ圧電素子、2……スリツト、
3……屈曲モード振動子、5……固定部材。
FIG. 1 is an exploded perspective view of a vibration sensor according to an embodiment of the present invention, and FIG. 2 is a perspective view of the same embodiment after assembly. 1... Bonded piezoelectric element, 2... Slit,
3...Bending mode vibrator, 5...Fixing member.
Claims (1)
を貼り合わせた構造の貼り合わせ圧電素子と、前
記貼り合わせ圧電素子の周辺を固定する固定部材
と、前記貼り合わせ圧電素子に切抜きを設けるこ
とにより形成された矩形状の屈曲振動モード振動
子と、前記矩形状屈曲振動子の上下面と貼り合わ
せ面に設けられた電極と、前記矩形状屈曲振動子
部を除く貼り合わせ圧電素子上面に電気回路を構
成する電極とを有し、前記貼り合わせ圧電素子上
面に電気回路を構成したことを特徴とする振動セ
ンサ。 2 貼り合わせ圧電素子の周辺を固定する固定部
材を、導電性材料で構成したことを特徴とする特
許請求の範囲第1項記載の振動センサ。 3 貼り合わせ圧電素子の周辺を固定する固定部
材を樹脂系銅張板で構成したことを特徴とする特
許請求の範囲第1項記載の振動センサ。[Scope of Claims] 1. A bonded piezoelectric element having a structure in which two plate-shaped piezoelectric elements having polarization axes in the thickness direction are bonded together, a fixing member that fixes the periphery of the bonded piezoelectric element, and the bonded piezoelectric element. Excluding a rectangular bending vibration mode vibrator formed by providing a cutout in a piezoelectric element, electrodes provided on the upper and lower surfaces and bonding surfaces of the rectangular bending vibrator, and the rectangular bending vibrator section. A vibration sensor comprising: an electrode forming an electric circuit on the upper surface of the bonded piezoelectric element; and an electric circuit formed on the upper surface of the bonded piezoelectric element. 2. The vibration sensor according to claim 1, wherein the fixing member that fixes the periphery of the bonded piezoelectric element is made of a conductive material. 3. The vibration sensor according to claim 1, wherein the fixing member for fixing the periphery of the bonded piezoelectric element is made of a resin-based copper clad plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18610985A JPS6246267A (en) | 1985-08-24 | 1985-08-24 | Oscillation sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18610985A JPS6246267A (en) | 1985-08-24 | 1985-08-24 | Oscillation sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6246267A JPS6246267A (en) | 1987-02-28 |
JPH052173B2 true JPH052173B2 (en) | 1993-01-11 |
Family
ID=16182516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18610985A Granted JPS6246267A (en) | 1985-08-24 | 1985-08-24 | Oscillation sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6246267A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4995592A (en) * | 1988-12-22 | 1991-02-26 | Foseco International Limited | Purifying molten metal |
JP5211584B2 (en) * | 2007-08-28 | 2013-06-12 | ヤマハ株式会社 | Motion sensor and method of manufacturing motion sensor |
-
1985
- 1985-08-24 JP JP18610985A patent/JPS6246267A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6246267A (en) | 1987-02-28 |
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