JPS6245870U - - Google Patents

Info

Publication number
JPS6245870U
JPS6245870U JP1985130097U JP13009785U JPS6245870U JP S6245870 U JPS6245870 U JP S6245870U JP 1985130097 U JP1985130097 U JP 1985130097U JP 13009785 U JP13009785 U JP 13009785U JP S6245870 U JPS6245870 U JP S6245870U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit element
printed wiring
wiring board
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985130097U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0331092Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985130097U priority Critical patent/JPH0331092Y2/ja
Publication of JPS6245870U publication Critical patent/JPS6245870U/ja
Application granted granted Critical
Publication of JPH0331092Y2 publication Critical patent/JPH0331092Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01Manufacture or treatment
    • H10W70/05Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1985130097U 1985-08-27 1985-08-27 Expired JPH0331092Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985130097U JPH0331092Y2 (https=) 1985-08-27 1985-08-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985130097U JPH0331092Y2 (https=) 1985-08-27 1985-08-27

Publications (2)

Publication Number Publication Date
JPS6245870U true JPS6245870U (https=) 1987-03-19
JPH0331092Y2 JPH0331092Y2 (https=) 1991-07-01

Family

ID=31027269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985130097U Expired JPH0331092Y2 (https=) 1985-08-27 1985-08-27

Country Status (1)

Country Link
JP (1) JPH0331092Y2 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07170050A (ja) * 1993-12-15 1995-07-04 Nec Corp 半導体装置
JPH07321439A (ja) * 1994-05-27 1995-12-08 O K Print:Kk メモリ装置用部品取付板
KR20210090167A (ko) 2018-09-20 2021-07-19 뉴로슈티컬즈 인크. 의료용 튜브 위치 확인 시스템
WO2021202266A1 (en) 2020-03-30 2021-10-07 Mary Ann Winter Associates, Inc. Apparatus and method for nasogastric tube insertion guide

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07170050A (ja) * 1993-12-15 1995-07-04 Nec Corp 半導体装置
JPH07321439A (ja) * 1994-05-27 1995-12-08 O K Print:Kk メモリ装置用部品取付板
KR20210090167A (ko) 2018-09-20 2021-07-19 뉴로슈티컬즈 인크. 의료용 튜브 위치 확인 시스템
WO2021202266A1 (en) 2020-03-30 2021-10-07 Mary Ann Winter Associates, Inc. Apparatus and method for nasogastric tube insertion guide

Also Published As

Publication number Publication date
JPH0331092Y2 (https=) 1991-07-01

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