JPS6245841U - - Google Patents
Info
- Publication number
- JPS6245841U JPS6245841U JP1985137169U JP13716985U JPS6245841U JP S6245841 U JPS6245841 U JP S6245841U JP 1985137169 U JP1985137169 U JP 1985137169U JP 13716985 U JP13716985 U JP 13716985U JP S6245841 U JPS6245841 U JP S6245841U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- electronic device
- case
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims 1
- 238000000605 extraction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985137169U JPS6245841U (pt) | 1985-09-06 | 1985-09-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985137169U JPS6245841U (pt) | 1985-09-06 | 1985-09-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6245841U true JPS6245841U (pt) | 1987-03-19 |
Family
ID=31040970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985137169U Pending JPS6245841U (pt) | 1985-09-06 | 1985-09-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6245841U (pt) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6771509B2 (en) | 1992-05-20 | 2004-08-03 | Seiko Epson Corporation | Cartridge for electronic devices |
| JP2012054262A (ja) * | 2010-08-31 | 2012-03-15 | Mitsubishi Electric Corp | 半導体装置 |
-
1985
- 1985-09-06 JP JP1985137169U patent/JPS6245841U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6771509B2 (en) | 1992-05-20 | 2004-08-03 | Seiko Epson Corporation | Cartridge for electronic devices |
| US6845014B2 (en) | 1992-05-20 | 2005-01-18 | Seiko Epson Corporation | Cartridge for electronic devices |
| JP2012054262A (ja) * | 2010-08-31 | 2012-03-15 | Mitsubishi Electric Corp | 半導体装置 |