JPS6244495U - - Google Patents
Info
- Publication number
- JPS6244495U JPS6244495U JP13534785U JP13534785U JPS6244495U JP S6244495 U JPS6244495 U JP S6244495U JP 13534785 U JP13534785 U JP 13534785U JP 13534785 U JP13534785 U JP 13534785U JP S6244495 U JPS6244495 U JP S6244495U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- heat dissipation
- molding material
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000012778 molding material Substances 0.000 claims 3
- 238000001816 cooling Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13534785U JPS6244495U (sl) | 1985-09-03 | 1985-09-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13534785U JPS6244495U (sl) | 1985-09-03 | 1985-09-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6244495U true JPS6244495U (sl) | 1987-03-17 |
Family
ID=31037447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13534785U Pending JPS6244495U (sl) | 1985-09-03 | 1985-09-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6244495U (sl) |
-
1985
- 1985-09-03 JP JP13534785U patent/JPS6244495U/ja active Pending