JPH03102791U - - Google Patents
Info
- Publication number
- JPH03102791U JPH03102791U JP1167990U JP1167990U JPH03102791U JP H03102791 U JPH03102791 U JP H03102791U JP 1167990 U JP1167990 U JP 1167990U JP 1167990 U JP1167990 U JP 1167990U JP H03102791 U JPH03102791 U JP H03102791U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation fin
- mounting part
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 4
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1167990U JPH03102791U (sl) | 1990-02-08 | 1990-02-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1167990U JPH03102791U (sl) | 1990-02-08 | 1990-02-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03102791U true JPH03102791U (sl) | 1991-10-25 |
Family
ID=31515200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1167990U Pending JPH03102791U (sl) | 1990-02-08 | 1990-02-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03102791U (sl) |
-
1990
- 1990-02-08 JP JP1167990U patent/JPH03102791U/ja active Pending