JPS6242549Y2 - - Google Patents
Info
- Publication number
- JPS6242549Y2 JPS6242549Y2 JP1982190510U JP19051082U JPS6242549Y2 JP S6242549 Y2 JPS6242549 Y2 JP S6242549Y2 JP 1982190510 U JP1982190510 U JP 1982190510U JP 19051082 U JP19051082 U JP 19051082U JP S6242549 Y2 JPS6242549 Y2 JP S6242549Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- metal plate
- flat package
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 238000005476 soldering Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】
イ 産業上の利用分野
本考案はフラツトパツケージ型ICをプリント
基板に取り付けるときの取り付け構造に関する。[Detailed description of the invention] A. Field of industrial application The present invention relates to a mounting structure for mounting a flat package type IC on a printed circuit board.
ロ 従来技術
近年、フラツトパツケージ型ICが出現してき
ている。このようなフラツトパツケージ型ICは
厚みが薄くはなつているが表面積も非常に小さく
なつており、従来のデユアルインラインパツケー
ジと比べて同一ピン数で約1.5倍の熱抵抗をも
つ。このためフラツトパツケージ型ICをプリン
ト基板に直接取り付けた状態ではフラツトパツケ
ージ下面はプリント基板と接しているため放熱効
率が悪く、半田付による熱、IC自身の発熱によ
り該ICの特性劣化、寿命の低下を招く危険性が
あつた。B. Prior Art In recent years, flat package ICs have appeared. Although these flat package ICs are thinner, they also have a much smaller surface area, and have approximately 1.5 times the thermal resistance for the same number of pins as conventional dual-in-line packages. For this reason, when a flat package type IC is directly attached to a printed circuit board, the bottom surface of the flat package is in contact with the printed circuit board, so the heat dissipation efficiency is poor, and the heat from soldering and the heat generated by the IC itself deteriorates the characteristics of the IC and reduces its lifespan. There was a risk of a decrease in
ハ 考案の目的
本考案は上記欠点を解消するために為されたも
のであつて、フラツトパツケージ型ICの放熱効
率を向上せしめ、ICの劣化を防ぐことを目的と
する。C. Purpose of the invention The present invention was made in order to eliminate the above-mentioned drawbacks, and its purpose is to improve the heat dissipation efficiency of a flat package type IC and prevent the deterioration of the IC.
ニ 考案の構成
本考案はプリント基板上のフラツトパツケージ
型ICの取付箇所に貫通孔を設けると共に、この
貫通孔に下方に放熱部を延在せしめた熱伝導性良
好なる金属板を嵌合し、この金属板上に熱伝導性
良好なる接着剤でフラツトパツケージ型ICを取
り付ける構成にする。D. Structure of the invention This invention provides a through hole at the mounting location of the flat package IC on the printed circuit board, and fits into this through hole a metal plate with good thermal conductivity with a heat dissipation section extending downward. A flat package IC is attached onto this metal plate using an adhesive with good thermal conductivity.
ホ 実施例
第１図はフラツトパツケージ型ICの上面図、
第２図は第１図におけるＡ−A′断面図であつ
て、１はフラツトパツケージ型IC、２は半導体
素子（図示せず）が組み込まれたフラツトパツケ
ージ、３，３…はこのパツケージ２内の半導体素
子を外部回路と結ぶためのリード端子でパツケー
ジ２側部から突設されている。第３図は本考案フ
ラツトパツケージ型ICの取付構造に利用される
プリント基板の上面図、第４図は第３図における
Ｂ−B′断面図を示し、これ等の図に於て、４はプ
リント基板、５はこのプリント基板４のフラツト
パツケージ型IC１を取り付ける箇所に穿たれた
貫通孔であつて、上記フラツトパツケージ２と略
同じ大きさになつている。６，６…は上記貫通孔
５周囲に形成された電極パターンを示し、上記
IC１のリード端子３，３と対応する状態で設け
られている。第５図は本考案取付構造に利用され
るアルミ、銅等の熱伝導性良好なる金属で形成さ
れた金属板７の断面図を示し、上記プリント基板
４の貫通孔５に嵌合する嵌合部８と下方に折曲形
成された放熱部９，９とを有する。尚、この放熱
部９，９は嵌合部８に対して直角状態より僅か鈍
角に折曲されていて、その弾性により嵌合部８に
対して直角状態までに曲げられ、金属板７が上記
貫通孔５に嵌合出来るようになつている。E. Example Figure 1 is a top view of a flat package type IC.
FIG. 2 is a cross-sectional view taken along line A-A' in FIG. Lead terminals protrude from the side of the package 2 to connect the semiconductor elements inside the package 2 to an external circuit. Fig. 3 is a top view of a printed circuit board used in the mounting structure of the flat package IC of the present invention, and Fig. 4 is a sectional view taken along line B-B' in Fig. 3. 5 is a printed circuit board, and 5 is a through hole bored in the printed circuit board 4 at the location where the flat package type IC 1 is attached, and is approximately the same size as the flat package 2. 6, 6... indicate electrode patterns formed around the above-mentioned through hole 5, and the above-mentioned
It is provided in a state corresponding to lead terminals 3, 3 of IC1. FIG. 5 shows a cross-sectional view of a metal plate 7 made of a metal with good thermal conductivity such as aluminum or copper used in the mounting structure of the present invention, and shows a metal plate 7 that fits into the through hole 5 of the printed circuit board 4. It has a portion 8 and heat dissipating portions 9 bent downward. The heat dissipating parts 9, 9 are bent at a slightly obtuse angle from the perpendicular state to the fitting part 8, and due to their elasticity, they are bent to the perpendicular state to the fitting part 8, and the metal plate 7 is bent to the above-mentioned state. It is adapted to fit into the through hole 5.
第６図は本考案取付構造を示す断面図であつ
て、前述と同一部分に対しては同一図番が付して
ある。このような取付構造において、金属板７は
プリント基板４下方から嵌合部８を上方にして貫
通孔５に嵌合している。このとき金属板７の放熱
部９，９は貫通孔５周壁に当接し、金属板７自身
を貫通孔５内に保持する。さらに、フラツトパツ
ケージ型IC１はそのリード端子３，３…が対応
する電極６，６…に対向せしめられた状態で金属
板７の嵌合部８上面に熱伝導性良好なる接着剤１
０例えば銀ペースト等によつて接着され、リード
端子３，３…と電極６，６…は半田付け固定され
ている。 FIG. 6 is a sectional view showing the mounting structure of the present invention, in which the same parts as described above are given the same reference numbers. In such a mounting structure, the metal plate 7 is fitted into the through hole 5 from below the printed circuit board 4 with the fitting part 8 facing upward. At this time, the heat dissipating parts 9, 9 of the metal plate 7 come into contact with the peripheral wall of the through hole 5, and hold the metal plate 7 itself within the through hole 5. Further, in the flat package type IC 1, an adhesive 1 having good thermal conductivity is applied to the upper surface of the fitting part 8 of the metal plate 7 with the lead terminals 3, 3, . . . facing the corresponding electrodes 6, 6, .
For example, the lead terminals 3, 3, . . . and the electrodes 6, 6, . . . are fixed by soldering.
このようなフラツトパツケージ型IC１の取付
構造にすると、リード端子３，３…と電極６，６
…との半田付による熱やIC１自身の発熱も接着
剤１０及び金属板７の嵌合部８、放熱部９，９を
介して容易に放熱される。 With such a mounting structure for the flat package type IC 1, the lead terminals 3, 3... and the electrodes 6, 6
The heat generated by soldering with the IC 1 itself and the heat generated by the IC 1 itself are easily radiated through the adhesive 10, the fitting portion 8 of the metal plate 7, and the heat radiating portions 9, 9.
第７図は本考案取付構造の他の実施例を示して
おり金属板７の放熱部がプリント基板４下面に沿
つて延在する構造になつており、薄型化が図れて
いる。 FIG. 7 shows another embodiment of the mounting structure of the present invention, in which the heat dissipating portion of the metal plate 7 extends along the lower surface of the printed circuit board 4, thereby achieving a thinner structure.
ヘ 効 果
以上述べた如く本考案フラツトパツケージ型
ICの取付構造はプリント基板のフラツトパツケ
ージ型ICを取付ける箇所に貫通孔を設けると共
に、この貫通孔に下方に放熱部を延在せしめた熱
伝導性良好なる金属板を嵌合し、この金属板上に
熱伝導性良好なる接着剤でフラツトパツケージ型
ICを取り付けているので、半田付による熱、こ
のIC自身の発熱は金属板の放熱部から容易に放
熱され、ICの特性劣化、寿命の低下を防ぐこと
が出来る。F. Effects As mentioned above, the flat package type of the present invention
The IC mounting structure is such that a through hole is provided at the location where the flat package IC is installed on the printed circuit board, and a metal plate with good thermal conductivity with a heat dissipation section extending downward is fitted into this through hole. Flat package type with adhesive that has good thermal conductivity on the board.
Since the IC is attached, the heat generated by soldering and the heat generated by the IC itself can be easily radiated from the heat radiating part of the metal plate, preventing deterioration of the IC's characteristics and shortening its life.
第１図、第２図は夫々フラツトパツケージ型
ICの上面図及び断面図、第３図、第４図は夫々
本考案取付構造に利用されるプリント基板の上面
図及び断面図、第５図は金属板の断面図、第６
図、第７図は本考案取付構造を示す断面図であ
る。
１……フラツトパツケージ型IC、４……プリ
ント基板、５……貫通孔、７……金属板、１０…
…接着剤。
Figures 1 and 2 are of flat package type.
A top view and a sectional view of the IC, FIGS. 3 and 4 are a top view and a sectional view of a printed circuit board used in the mounting structure of the present invention, respectively. FIG.
7 are sectional views showing the mounting structure of the present invention. 1...Flat package type IC, 4...Printed circuit board, 5...Through hole, 7...Metal plate, 10...
…glue.
Claims (1)
り付ける取付構造に於いて、該プリント基板上の
上記ICを取り付ける箇所に貫通孔を設けると共
に、この貫通孔に前記プリント基板の下方に放熱
部を延在せしめ且つ前記貫通孔を覆う面が前記プ
リント基板の上面と略同一平面を形成するような
熱伝導性良好なる金属板をそれ自体の弾性によつ
て嵌合し、この金属板上に熱伝導性良好なる接着
剤で上記ICを取り付けた事を特徴とするフラツ
トパツケージ型ICの取付構造。 In a mounting structure for attaching a flat package type IC to a printed circuit board, a through hole is provided at a location on the printed circuit board to which the above IC is attached, and a heat dissipation section is extended into the through hole below the printed circuit board. A metal plate with good thermal conductivity, whose surface covering the through hole forms substantially the same plane as the top surface of the printed circuit board, is fitted by its own elasticity, and a metal plate with good thermal conductivity is fitted onto this metal plate. A flat package type IC mounting structure characterized by the above IC being attached with adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982190510U JPS5993170U (en) | 1982-12-15 | 1982-12-15 | Mounting structure of flat package IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982190510U JPS5993170U (en) | 1982-12-15 | 1982-12-15 | Mounting structure of flat package IC |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5993170U JPS5993170U (en) | 1984-06-25 |
| JPS6242549Y2 true JPS6242549Y2 (en) | 1987-10-31 |
Family
ID=30410468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982190510U Granted JPS5993170U (en) | 1982-12-15 | 1982-12-15 | Mounting structure of flat package IC |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5993170U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH043503Y2 (en) * | 1985-09-20 | 1992-02-04 | ||
| JP2543856B2 (en) * | 1986-08-20 | 1996-10-16 | 株式会社東芝 | Hybrid integrated circuit device |
| JP4726729B2 (en) * | 2006-07-24 | 2011-07-20 | シャープ株式会社 | Heat dissipation structure for electronic devices |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS482058U (en) * | 1971-05-27 | 1973-01-11 | ||
| JPS5753674B2 (en) * | 1981-11-09 | 1982-11-13 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5753674U (en) * | 1980-09-12 | 1982-03-29 |
-
1982
- 1982-12-15 JP JP1982190510U patent/JPS5993170U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS482058U (en) * | 1971-05-27 | 1973-01-11 | ||
| JPS5753674B2 (en) * | 1981-11-09 | 1982-11-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5993170U (en) | 1984-06-25 |
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