JPS6242261U - - Google Patents

Info

Publication number
JPS6242261U
JPS6242261U JP13326885U JP13326885U JPS6242261U JP S6242261 U JPS6242261 U JP S6242261U JP 13326885 U JP13326885 U JP 13326885U JP 13326885 U JP13326885 U JP 13326885U JP S6242261 U JPS6242261 U JP S6242261U
Authority
JP
Japan
Prior art keywords
lamp body
light
emitting diode
lamp
reflecting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13326885U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13326885U priority Critical patent/JPS6242261U/ja
Publication of JPS6242261U publication Critical patent/JPS6242261U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP13326885U 1985-08-30 1985-08-30 Pending JPS6242261U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13326885U JPS6242261U (ko) 1985-08-30 1985-08-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13326885U JPS6242261U (ko) 1985-08-30 1985-08-30

Publications (1)

Publication Number Publication Date
JPS6242261U true JPS6242261U (ko) 1987-03-13

Family

ID=31033424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13326885U Pending JPS6242261U (ko) 1985-08-30 1985-08-30

Country Status (1)

Country Link
JP (1) JPS6242261U (ko)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587364B2 (ja) * 1976-12-10 1983-02-09 住友金属工業株式会社 連続圧延機の板厚制御方法
JPS5839063B2 (ja) * 1978-03-08 1983-08-27 アントン・ヘツゲンスタラ− 押出成形機の充填ステ−シヨンの閉鎖装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587364B2 (ja) * 1976-12-10 1983-02-09 住友金属工業株式会社 連続圧延機の板厚制御方法
JPS5839063B2 (ja) * 1978-03-08 1983-08-27 アントン・ヘツゲンスタラ− 押出成形機の充填ステ−シヨンの閉鎖装置

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